会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08373203B2
    • 2013-02-12
    • US12954222
    • 2010-11-24
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • H01L27/148
    • H01L29/78693H01L29/41733H01L29/42384H01L29/4908H01L29/66969H01L29/7869H01L29/78696
    • An intrinsic or substantially intrinsic semiconductor, which has been subjected to a step of dehydration or dehydrogenation and a step of adding oxygen so that the carrier concentration is less than 1×1012/cm3 is used for an oxide semiconductor layer of an insulated gate transistor, in which a channel region is formed. The length of the channel formed in the oxide semiconductor layer is set to 0.2 μm to 3.0 μm an inclusive and the thicknesses of the oxide semiconductor layer and the gate insulating layer are set to 15 nm to 30 nm inclusive and 20 nm to 50 nm inclusive, respectively, or 15 nm to 100 nm inclusive and 10 nm to 20 nm inclusive, respectively. Consequently, a short-channel effect can be suppressed, and the amount of change in threshold voltage can be less than 0.5 V in the range of the above channel lengths.
    • 对于绝缘栅极晶体管的氧化物半导体层,使用已进行脱水或脱氢工序的本征或本质上本征的半导体,以及添加氧以使载流子浓度小于1×10 12 / cm 3的步骤, 其中形成沟道区。 将形成在氧化物半导体层中的沟道的长度设定为0.2μm〜3.0μm,氧化物半导体层和栅极绝缘层的厚度为15nm〜30nm,包括20nm〜50nm ,或分别为15nm〜100nm,10nm〜20nm。 因此,可以抑制短沟道效应,并且在上述通道长度的范围内阈值电压的变化量可以小于0.5V。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110127525A1
    • 2011-06-02
    • US12954222
    • 2010-11-24
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • H01L29/786
    • H01L29/78693H01L29/41733H01L29/42384H01L29/4908H01L29/66969H01L29/7869H01L29/78696
    • An intrinsic or substantially intrinsic semiconductor, which has been subjected to a step of dehydration or dehydrogenation and a step of adding oxygen so that the carrier concentration is less than 1×1012/cm3 is used for an oxide semiconductor layer of an insulated gate transistor, in which a channel region is formed. The length of the channel formed in the oxide semiconductor layer is set to 0.2 μm to 3.0 μm an inclusive and the thicknesses of the oxide semiconductor layer and the gate insulating layer are set to 15 nm to 30 nm inclusive and 20 nm to 50 nm inclusive, respectively, or 15 nm to 100 nm inclusive and 10 nm to 20 nm inclusive, respectively. Consequently, a short-channel effect can be suppressed, and the amount of change in threshold voltage can be less than 0.5 V in the range of the above channel lengths.
    • 对于绝缘栅极晶体管的氧化物半导体层,使用已进行脱水或脱氢工序的本征或本质上本征的半导体,以及添加氧以使载流子浓度小于1×10 12 / cm 3的步骤, 其中形成沟道区。 将形成在氧化物半导体层中的沟道的长度设定为0.2μm〜3.0μm,氧化物半导体层和栅极绝缘层的厚度为15nm〜30nm,包括20nm〜50nm ,或分别为15nm〜100nm,10nm〜20nm。 因此,可以抑制短沟道效应,并且在上述通道长度的范围内阈值电压的变化量可以小于0.5V。
    • 6. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US08664652B2
    • 2014-03-04
    • US12974099
    • 2010-12-21
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • Shunpei YamazakiHiromichi GodoDaisuke Kawae
    • H01L29/786H01L29/12
    • H01L29/7869H01L29/1033H01L29/42384H01L29/4908H01L29/66477H01L29/78696
    • A semiconductor device which includes an oxide semiconductor layer, a source electrode and a drain electrode electrically connected to the oxide semiconductor layer, a gate insulating layer covering the oxide semiconductor layer, the source electrode, and the drain electrode, and a gate electrode over the gate insulating layer is provided. The thickness of the oxide semiconductor layer is greater than or equal to 1 nm and less than or equal to 10 nm. The gate insulating layer satisfies a relation where ∈r/d is greater than or equal to 0.08 (nm−1) and less than or equal to 7.9 (nm−1) when the relative permittivity of a material used for the gate insulating layer is ∈r and the thickness of the gate insulating layer is d. The distance between the source electrode and the drain electrode is greater than or equal to 10 nm and less than or equal to 1 μm.
    • 一种半导体器件,包括氧化物半导体层,与氧化物半导体层电连接的源电极和漏电极,覆盖氧化物半导体层的栅绝缘层,源电极和漏电极以及栅电极 提供栅极绝缘层。 氧化物半导体层的厚度大于或等于1nm且小于或等于10nm。 当栅极绝缘层使用的材料的相对介电常数为Er时,栅极绝缘层满足Er / d大于等于0.08(nm-1)且小于等于7.9(nm-1)的关系 栅极绝缘层的厚度为d。 源电极和漏电极之间的距离大于或等于10nm且小于或等于1μm。
    • 7. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08415667B2
    • 2013-04-09
    • US12957434
    • 2010-12-01
    • Shunpei YamazakiDaisuke KawaeHiromichi Godo
    • Shunpei YamazakiDaisuke KawaeHiromichi Godo
    • H01L29/04H01L31/036H01L31/0376H01L31/20
    • H01L29/45H01L27/1225H01L29/7869
    • One object is to provide a p-channel transistor including an oxide semiconductor. Another object is to provide a complementary metal oxide semiconductor (CMOS) structure of an n-channel transistor including an oxide semiconductor and a p-channel transistor including an oxide semiconductor. A p-channel transistor including an oxide semiconductor includes a gate electrode layer, a gate insulating layer, an oxide semiconductor layer, and a source and drain electrode layers in contact with the oxide semiconductor layer. When the electron affinity and the band gap of an oxide semiconductor used for the oxide semiconductor layer in the semiconductor device, respectively, are χ (eV) and Eg (eV), the work function (φm) of the conductor used for the source electrode layer and the drain electrode layer satisfies φm>χ+Eg/2 and the barrier for holes (φBp) represented by (χ+Eg−φm) is less than 0.25 eV.
    • 一个目的是提供一种包括氧化物半导体的p沟道晶体管。 另一个目的是提供包括氧化物半导体的n沟道晶体管和包括氧化物半导体的p沟道晶体管的互补金属氧化物半导体(CMOS)结构。 包括氧化物半导体的p沟道晶体管包括与氧化物半导体层接触的栅极电极层,栅极绝缘层,氧化物半导体层以及源极和漏极电极层。 当半导体器件中用于氧化物半导体层的氧化物半导体的电子亲和力和带隙分别为χ(eV)和Eg(eV)时,用于所述半导体器件的导体的功函数(&phgr; m) 源电极层和漏电极层满足< m +χ+ Eg / 2,并且由(χ+ Eg-&phgr; m)表示的空穴屏障(&phgr; Bp)小于0.25eV。