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    • 1. 发明授权
    • Method for manufacturing semiconductor wafer
    • 制造半导体晶片的方法
    • US07829434B2
    • 2010-11-09
    • US12210304
    • 2008-09-15
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • H01L21/762
    • H01L21/76254H01L21/2236H01L21/26506
    • To provide a method for manufacturing an SOI substrate having a single crystal semiconductor layer having a small and uniform thickness over an insulating film. Further, time of adding hydrogen ions is reduced and time of manufacture per SOI substrate is reduced. A bond layer is formed over a surface of a first semiconductor wafer and a separation layer is formed below the bond layer by irradiating the first semiconductor wafer with H3+ ions by an ion doping apparatus. H3+ ions accelerated by high voltage are separated to be three H+ ions at a semiconductor wafer surface, and the H+ ions cannot enter deeply. Therefore, H+ ions are added into a shallower region in the semiconductor wafer at a higher concentration than the case of using a conventional ion implantation method.
    • 提供一种制造具有在绝缘膜上具有小而均匀厚度的单晶半导体层的SOI衬底的方法。 此外,加入氢离子的时间减少,并且每个SOI衬底的制造时间减少。 在第一半导体晶片的表面上形成接合层,并且通过用离子掺杂装置用H3 +离子照射第一半导体晶片,在接合层的下方形成分离层。 通过高压加速的H3 +离子在半导体晶片表面被分离为三个H +离子,并且H +离子不能深入。 因此,与使用常规的离子注入方法的情况相比,将H +离子加入到半导体晶片的较浅的区域中。
    • 2. 发明授权
    • Method for manufacturing semiconductor wafer
    • 制造半导体晶片的方法
    • US08043939B2
    • 2011-10-25
    • US12862197
    • 2010-08-24
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • H01L21/762
    • H01L21/76254H01L21/2236H01L21/26506
    • To provide a method for manufacturing an SOI substrate having a single crystal semiconductor layer having a small and uniform thickness over an insulating film. Further, time of adding hydrogen ions is reduced and time of manufacture per SOI substrate is reduced. A bond layer is formed over a surface of a first semiconductor wafer and a separation layer is formed below the bond layer by irradiating the first semiconductor wafer with H3+ ions by an ion doping apparatus. H3+ ions accelerated by high voltage are separated to be three H+ ions at a semiconductor wafer surface, and the H+ ions cannot enter deeply. Therefore, H+ ions are added into a shallower region in the semiconductor wafer at a higher concentration than the case of using a conventional ion implantation method.
    • 提供一种制造具有在绝缘膜上具有小而均匀厚度的单晶半导体层的SOI衬底的方法。 此外,加入氢离子的时间减少,并且每个SOI衬底的制造时间减少。 在第一半导体晶片的表面上形成接合层,并且通过用离子掺杂装置用H3 +离子照射第一半导体晶片,在接合层的下方形成分离层。 通过高压加速的H3 +离子在半导体晶片表面被分离为三个H +离子,并且H +离子不能深入。 因此,与使用常规的离子注入方法的情况相比,将H +离子加入到半导体晶片的较浅的区域中。
    • 3. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
    • 制造半导体波形的方法
    • US20090081849A1
    • 2009-03-26
    • US12210304
    • 2008-09-15
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • Shunpei YamazakiAkiharu MiyanagaKo InadaYuji Iwaki
    • H01L21/762
    • H01L21/76254H01L21/2236H01L21/26506
    • To provide a method for manufacturing an SOI substrate having a single crystal semiconductor layer having a small and uniform thickness over an insulating film. Further, time of adding hydrogen ions is reduced and time of manufacture per SOI substrate is reduced. A bond layer is formed over a surface of a first semiconductor wafer and a separation layer is formed below the bond layer by irradiating the first semiconductor wafer with H3+ ions by an ion doping apparatus. H3+ ions accelerated by high voltage are separated to be three H+ ions at a semiconductor wafer surface, and the H+ ions cannot enter deeply. Therefore, H+ ions are added into a shallower region in the semiconductor wafer at a higher concentration than the case of using a conventional ion implantation method.
    • 提供一种制造具有在绝缘膜上具有小而均匀厚度的单晶半导体层的SOI衬底的方法。 此外,加入氢离子的时间减少,并且每个SOI衬底的制造时间减少。 在第一半导体晶片的表面上形成接合层,并且通过用离子掺杂装置用H3 +离子照射第一半导体晶片,在接合层的下方形成分离层。 通过高压加速的H3 +离子在半导体晶片表面被分离为三个H +离子,并且H +离子不能深入。 因此,与使用常规的离子注入方法的情况相比,将H +离子加入到半导体晶片的较浅的区域中。