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    • 5. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120094446A1
    • 2012-04-19
    • US13338340
    • 2011-12-28
    • Shunpei YAMAZAKIMakoto FURUNO
    • Shunpei YAMAZAKIMakoto FURUNO
    • H01L21/336
    • H01L29/78696H01L21/02532H01L21/02579H01L21/0262H01L29/04H01L29/41733H01L29/66765
    • Electric characteristics of a thin film transistor including a channel formation region including a microcrystalline semiconductor are improved. The thin film transistor includes a gate electrode, a gate insulating film formed over the gate electrode, a microcrystalline semiconductor layer formed over the gate insulating film, a semiconductor layer which is formed over the microcrystalline semiconductor layer and includes an amorphous semiconductor, and a source region and a drain region which are formed over the semiconductor layer. A channel is formed in the microcrystalline semiconductor layer when the thin film transistor is placed in an on state, and the microcrystalline semiconductor layer includes an impurity element for functioning as an acceptor. The microcrystalline semiconductor layer is formed by a plasma-enhanced chemical vapor deposition method. In forming the microcrystalline semiconductor layer, a process gas is excited with two or more kinds of high-frequency electric power with different frequencies.
    • 提高了包括微晶半导体的沟道形成区域的薄膜晶体管的电特性。 薄膜晶体管包括栅电极,形成在栅电极上的栅极绝缘膜,形成在栅极绝缘膜上的微晶半导体层,形成在微晶半导体层上并包括非晶半导体的半导体层,以及源极 区域和漏极区域,形成在半导体层上。 当薄膜晶体管处于导通状态时,在微晶半导体层中形成沟道,微晶半导体层包括用作受体的杂质元素。 微晶半导体层通过等离子体增强化学气相沉积法形成。 在形成微晶半导体层时,以不同频率的两种以上的高频电力激发处理气体。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体器件及其制造方法
    • US20110291093A1
    • 2011-12-01
    • US13207793
    • 2011-08-11
    • Shunpei YAMAZAKIMakoto FURUNO
    • Shunpei YAMAZAKIMakoto FURUNO
    • H01L29/786
    • H01L29/04H01L29/41733H01L29/66765H01L29/78696
    • The present invention relates to a semiconductor device including a thin film transistor comprising a microcrystalline semiconductor which forms a channel formation region and includes an acceptor impurity element, and to a manufacturing method thereof. A gate electrode, a gate insulating film formed over the gate electrode, a first semiconductor layer which is formed over the gate insulating film and is formed of a microcrystalline semiconductor, a second semiconductor layer which is formed over the first semiconductor layer and includes an amorphous semiconductor, and a source region and a drain region which are formed over the second semiconductor layer are provided in the thin film transistor. A channel is formed in the first semiconductor layer when the thin film transistor is placed in an on state.
    • 本发明涉及包括形成沟道形成区并包含受主杂质元素的微晶半导体的薄膜晶体管的半导体器件及其制造方法。 栅电极,形成在栅电极上的栅极绝缘膜,形成在栅极绝缘膜上并由微晶半导体形成的第一半导体层,形成在第一半导体层上的第二半导体层, 半导体以及形成在第二半导体层上的源极区和漏极区设置在薄膜晶体管中。 当薄膜晶体管处于导通状态时,在第一半导体层中形成沟道。
    • 9. 发明申请
    • MANUFACTURING METHOD OF SUBSTRATE PROVIDED WITH SEMICONDUCTOR FILMS
    • 具有半导体膜的衬底的制造方法
    • US20090081845A1
    • 2009-03-26
    • US12211951
    • 2008-09-17
    • Shunpei YAMAZAKIMakoto FURUNO
    • Shunpei YAMAZAKIMakoto FURUNO
    • H01L21/762
    • H01L21/02002H01L21/76254
    • A plurality of rectangular single crystal semiconductor substrates are prepared. Each of the single crystal semiconductor substrates is doped with hydrogen ions and a damaged region is formed at a desired depth, and a bonding layer is formed on a surface thereof. The plurality of single crystal substrates with the damaged regions formed therein and the bonding layers formed thereover are arranged on a tray. Depression portions for holding the single crystal semiconductor substrates are formed in the tray. With the single crystal semiconductor substrates arranged on the tray, the plurality of single crystal semiconductor substrates with the damaged regions formed therein and the bonding layers formed thereover are bonded to a base substrate. By performing heat treatment and dividing the single crystal semiconductor substrates along the damaged regions, the plurality of single crystal semiconductor layers that are sliced are formed over the base substrate.
    • 制备多个矩形单晶半导体衬底。 每个单晶半导体衬底都掺杂有氢离子,并且在期望的深度上形成损伤区域,并且在其表面上形成接合层。 其中形成有损伤区域的多个单晶基板和形成在其上的接合层布置在托盘上。 用于保持单晶半导体衬底的凹陷部分形成在托盘中。 利用布置在托盘上的单晶半导体衬底,其中形成有损坏区域的多个单晶半导体衬底和其上形成的接合层被接合到基底衬底。 通过对损伤区域进行热处理和分割单晶半导体基板,在基底基板上形成切片的多个单晶半导体层。