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    • 4. 发明授权
    • Flat fluorescent lamp for liquid crystal display
    • 平板荧光灯用于液晶显示
    • US4920298A
    • 1990-04-24
    • US169708
    • 1988-03-18
    • Katsuhiro HinotaniShunichi KishimotoHaruhisa KosakaKatsumi TeradaGoro Hamagishi
    • Katsuhiro HinotaniShunichi KishimotoHaruhisa KosakaKatsumi TeradaGoro Hamagishi
    • F21V8/00G02F1/13357H01J61/30
    • G02F1/133604H01J61/30
    • In a flat fluorescent lamp for serving as a back light of liquid crystal panels for use in display devices, upper and lower glass plates are respectively coated with fluorescent film on its inner surface and arranged in parallel to each other, a glass side wall is disposed along the peripheral edges of the upper and lower glass plates in order to form a hermetic discharge space between the upper and lower glass plates, a pair of discharge electrodes are arranged in parallel within the discharge space and opposed to each other, at least one reinforcing glass member having a height approximately equal to the distance between the upper and lower glass plates and for supporting the upper and lower glass plates is disposed between the electrodes, and the upper glass plate is formed at its inner surface with an uncoated portion having no fluorescent film at the position where the upper glass plate is opposed to the reinforcing glass member in contact therewith.
    • 在用作显示装置的液晶面板的背光的平面荧光灯中,上下玻璃板在其内表面上分别涂有荧光膜并且彼此平行地布置,玻璃侧壁被布置 沿着上玻璃板和下玻璃板的周边边缘,以便在上玻璃板和下玻璃板之间形成密封的放电空间,一对放电电极平行布置在放电空间内并彼此相对,至少一个增强 玻璃构件的高度大致等于上下玻璃板之间的距离,并且用于支撑上玻璃板和下玻璃板,设置在电极之间,并且上玻璃板在其内表面上形成有不具有荧光体的未涂覆部分 在上玻璃板与与其接触的加强玻璃构件相对的位置处的膜。
    • 7. 发明申请
    • MOUNTING APPARATUS AND MOUNTING METHOD
    • 安装设备和安装方法
    • US20120015458A1
    • 2012-01-19
    • US13260232
    • 2010-03-18
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • Takayoshi AkamatsuKatsumi TeradaHajime Hirata
    • H01L21/58B23P19/00
    • H05K13/021H01L2224/16225H01L2224/75H05K13/0452Y10T29/53178
    • Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
    • 提供了一种将芯片部件安装在具有形成在其上的多个电路图案的电路板上的电路图案上的安装装置。 安装装置设置有多个焊接工具,每个焊接工具将芯片部件安装在电路板上的每个电路图案上。 每个接合工具在电路板上要安装芯片部件的区域内设置专用安装区域,其中只有每个焊接工具可以安装芯片部件,以及公共安装区域,其中焊接工具和 相邻的焊接工具可以安装芯片组件。 还提供了一种安装方法。 即使在电路板上形成多个电路图案并且在形成的电路图案中包括故障电路图案的情况下,也可以缩短芯片组件的安装节拍时间。