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    • 1. 发明申请
    • HEAT TRANSFER DEVICE COMBINED A FLATTEN LOOP HEAT PIPE AND A VAPOR CHAMBER
    • 热交换装置组合了一个平面管热管和一个蒸气室
    • US20100300656A1
    • 2010-12-02
    • US12599786
    • 2008-05-05
    • Shu-Shen LuChi-Te Chin
    • Shu-Shen LuChi-Te Chin
    • F28D15/04
    • F28D15/0266F28D15/043F28D15/046F28D15/06F28F13/00H01L23/427H01L2924/0002H01L2924/00
    • This invention declares a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe evaporator. Metal mesh is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. Working fluid is filled into the vapor chamber. Besides the advanced heat transfer characteristics of the flatten loop heat pipe, this invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage of higher density of integration and higher running speed. Based on the combination of the loop heat pipe and the vapor chamber, changing the cooling method, using both the temperature control fins and the condenser fins, this new device could increase the temperature control accuracy and the flexibility.
    • 本发明公开了一种传热装置,其结合了平坦回路热管与蒸气室,其中回路热管具有蒸发器和冷凝器,蒸气室位于回路热管蒸发器的蒸发部分。 金属网涂在蒸气室的内表面上,并在其上涂覆有通气孔的金属板和两侧的支撑。 工作流体填充到蒸气室中。 除了扁平回路热管的先进的传热特性外,本发明还具有蒸气室的附加优点,可以快速地将芯片上的高热通量热点传播到芯片上,以降低芯片的温度,使芯片具有优势 更高的集成密度和更高的运行速度。 基于循环热管和蒸气室的组合,改变冷却方式,使用温控翅片和冷凝器翅片,这种新型装置可以提高温度控制精度和灵活性。