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1. 发明授权

US08368108B2 Light emitting element housing package 失效
标题翻译：发光元件外壳包装
公开(公告)号：US08368108B2
公开(公告)日：2013-02-05
申请号：US13137930
申请日：2011-09-21
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.
摘要翻译：一种发光元件外壳封装，包括其上安装有发光元件的陶瓷基板，以及形成在陶瓷基板上并与发光元件芯片电连接的布线图案，其中形成有白色薄膜层除了要连接到发光元件芯片的布线图案中的连接区域之外，在布线图案的至少上表面上形成白色无机颗粒的烧结体。

2. 发明申请

US20100052006A1 Light emitting semiconductor device 有权
标题翻译：发光半导体器件
公开(公告)号：US20100052006A1
公开(公告)日：2010-03-04
申请号：US12585058
申请日：2009-09-02
申请人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
发明人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.
摘要翻译：发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。

3. 发明授权

US08232578B2 Light emitting semiconductor device 有权
标题翻译：发光半导体器件
公开(公告)号：US08232578B2
公开(公告)日：2012-07-31
申请号：US12585058
申请日：2009-09-02
申请人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
发明人： Shigeo Takeda , Hiroyuki Tajima , Shota Shimonishi , Yosuke Tsuchiya
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/507 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A light emitting semiconductor device includes a base substrate; a light emitting semiconductor element including a crystal growth basis and provided on the base substrate so that the crystal growth basis faces in opposite direction to the base substrate; a first transparent sealing medium which seals the light emitting semiconductor on the base substrate; and a second transparent sealing medium which seals the light emitting semiconductor over the first transparent sealing medium and contains phosphor. A thickness of the second sealing medium in a portion with high emission intensity is larger than that of the other portion of the first sealing medium; and the portion with high emission intensity is defined as a portion where light emission intensity from the light emitting semiconductor element is maximum.
摘要翻译：发光半导体器件包括：基底; 包括晶体生长基础的发光半导体元件，并且设置在所述基底基板上，使得所述晶体生长基底面向与所述基底基板相反的方向; 密封基底基板上的发光半导体的第一透明密封介质; 以及第二透明密封介质，其密封所述第一透明密封介质上的所述发光半导体并且包含磷光体。发光强度高的部分的第二密封介质的厚度大于第一密封介质的其他部分的厚度; 并且具有高发光强度的部分被定义为来自发光半导体元件的发光强度最大的部分。

4. 发明申请

US20120074445A1 Light emitting element housing package 失效
标题翻译：发光元件外壳包装
公开(公告)号：US20120074445A1
公开(公告)日：2012-03-29
申请号：US13137930
申请日：2011-09-21
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2933/0091 , H01L2924/00014
摘要： A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a light emitting element chip is electrically connected, wherein a white thin film layer formed from a sintered body of white inorganic particles is formed on at least an upper surface of the wiring pattern, except a connection region in the wiring pattern to be connected to the light emitting element chip.
摘要翻译：一种发光元件外壳封装，包括其上安装有发光元件的陶瓷基板，以及形成在陶瓷基板上并与发光元件芯片电连接的布线图案，其中形成有白色薄膜层除了要连接到发光元件芯片的布线图案中的连接区域之外，在布线图案的至少上表面上形成白色无机颗粒的烧结体。

5. 发明申请

US20120070920A1 Method for mounting luminescent device 有权
标题翻译：发光装置的安装方法
公开(公告)号：US20120070920A1
公开(公告)日：2012-03-22
申请号：US13137855
申请日：2011-09-19
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L33/48
CPC分类号： H01L33/005 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/81 , H01L24/83 , H01L33/46 , H01L2224/1132 , H01L2224/2732 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/81192 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/12041 , H01L2924/1301 , H01L2933/0033 , H01L2933/0066 , H01L2224/45099 , H01L2924/0105 , H01L2924/01079 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.
摘要翻译：一种用于将具有安装层的发光装置安装在基板上的方法，包括以下步骤：在基板上涂覆金属纳米颗粒糊料，将发光装置的安装层设置在金属纳米颗粒糊料上，层和金属纳米颗粒糊形成合金，从而结合发光装置和基板。

6. 发明授权

US08852970B2 Method for mounting luminescent device 有权
标题翻译：发光装置的安装方法
公开(公告)号：US08852970B2
公开(公告)日：2014-10-07
申请号：US13137855
申请日：2011-09-19
申请人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
发明人： Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
IPC分类号： H01L21/00 , H01L33/00 , H01L23/00 , H01L33/46
CPC分类号： H01L33/005 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/81 , H01L24/83 , H01L33/46 , H01L2224/1132 , H01L2224/2732 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/81192 , H01L2224/83192 , H01L2224/83805 , H01L2224/83815 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/0132 , H01L2924/01322 , H01L2924/12041 , H01L2924/1301 , H01L2933/0033 , H01L2933/0066 , H01L2224/45099 , H01L2924/0105 , H01L2924/01079 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.
摘要翻译：一种用于将具有安装层的发光装置安装在基板上的方法，包括以下步骤：在基板上涂覆金属纳米颗粒糊料，将发光装置的安装层设置在金属纳米颗粒糊料上，层和金属纳米颗粒糊形成合金，从而结合发光装置和基板。

7. 发明申请

US20090206718A1 LED lamp module 有权
标题翻译： LED灯模组
公开(公告)号：US20090206718A1
公开(公告)日：2009-08-20
申请号：US12320824
申请日：2009-02-05
申请人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
发明人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
IPC分类号： H01J61/52
CPC分类号： F21V29/70 , F21K9/00 , F21V19/0015 , F21V29/87 , F21V29/89 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp
摘要翻译：本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯

8. 发明授权

US08643271B2 LED lamp module 有权
标题翻译： LED灯模组
公开(公告)号：US08643271B2
公开(公告)日：2014-02-04
申请号：US12320824
申请日：2009-02-05
申请人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
发明人： Shota Shimonishi , Hiroyuki Tajima , Toshimasa Hayashi , Hideki Kokubu
IPC分类号： H01L23/02
CPC分类号： F21V29/70 , F21K9/00 , F21V19/0015 , F21V29/87 , F21V29/89 , H01L33/64 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp.
摘要翻译：本发明提供一种LED灯模块，包括金属基座，安装在金属基底上的柔性基板，具有通孔，表面安装型LED灯，其包括在陶瓷封装的背面上具有突出部分的陶瓷封装， LED芯片安装在陶瓷封装上，并具有光输出面。突出部分通过通孔与金属基座热连接，并且LED灯通过导电构件在突出部分之外的部分处与柔性板电连接。 LED灯模块包括覆盖除了光输出表面之外的LED灯的一部分的盖和柔性板并按压LED灯。

9. 外观设计

USD578083S1 Light emitting diode 有权
标题翻译：发光二极管
公开(公告)号：USD578083S1
公开(公告)日：2008-10-07
申请号：US29287886
申请日：2007-09-28
申请人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio
设计人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio

10. 外观设计

USD578082S1 Light emitting diode 有权
公开(公告)号：USD578082S1
公开(公告)日：2008-10-07
申请号：US29287884
申请日：2007-09-28
申请人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio
设计人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio

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