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    • 2. 发明授权
    • Aryl dicarboxylic acid diimidazole-based compounds as n-type semiconductor materials for thin film transistors
    • 作为用于薄膜晶体管的n型半导体材料的芳基二羧酸二咪唑类化合物
    • US08187915B2
    • 2012-05-29
    • US12731191
    • 2010-03-25
    • Shiying ZhengDeepak ShuklaDiane C. Freeman
    • Shiying ZhengDeepak ShuklaDiane C. Freeman
    • H01L51/40
    • H01L51/0053C09B5/62C09B57/08H01L51/0545H01L51/0558Y02E10/549
    • A process for fabricating a thin film semiconductor device includes the following steps, but not necessarily in the noted order. Firstly, a thin film of organic semiconductor material is deposited onto a substrate. This thin film of organic semiconductor material comprises organic semiconductor material that comprises one or more aryl dicarboxylic diimidazole-based compounds of claim 1 such that the film exhibits a field effect electron mobility that is greater than 0.005 cm2/Vs. Then, the process includes forming a spaced apart source electrode and drain electrode, wherein the source electrode and the drain electrode are separated by and electrically connected with, the n-channel semiconductor film. A gate electrode is then formed, spaced apart from the semiconductor material. One or more of the thin film semiconductor devices (or transistors) can be incorporated into an electronic device.
    • 制造薄膜半导体器件的方法包括以下步骤,但不一定按照所述顺序。 首先,将有机半导体材料的薄膜沉积在基板上。 这种有机半导体材料薄膜包括有机半导体材料,其包括一种或多种权利要求1的芳基二甲基二咪唑基化合物,使得该膜表现出大于0.005cm 2 / Vs的场效应电子迁移率。 然后,该工艺包括形成间隔开的源电极和漏电极,其中源极电极和漏极电极与n沟道半导体膜分离并与其电连接。 然后形成与半导体材料间隔开的栅电极。 可以将一个或多个薄膜半导体器件(或晶体管)并入电子器件中。
    • 3. 发明申请
    • ARYL DICARBOXYLIC ACID DIIMIDAZOLE-BASED COMPOUNDS AS N-TYPE SEMICONDUCTOR MATERIALS FOR THIN FILM TRANSISTORS
    • 作为薄膜晶体管的N型半导体材料的ARYL DICARBOXYLIC ACID DIIMIDAZOLE-based COMPOUNDS
    • US20100178728A1
    • 2010-07-15
    • US12731191
    • 2010-03-25
    • Shiying ZhengDeepak ShuklaDiane C. Freeman
    • Shiying ZhengDeepak ShuklaDiane C. Freeman
    • H01L51/40
    • H01L51/0053C09B5/62C09B57/08H01L51/0545H01L51/0558Y02E10/549
    • A process for fabricating a thin film semiconductor device includes the following steps, but not necessarily in the noted order. Firstly, a thin film of organic semiconductor material is deposited onto a substrate. This thin film of organic semiconductor material comprises organic semiconductor material that comprises one or more aryl dicarboxylic diimidazole-based compounds of claim 1 such that the film exhibits a field effect electron mobility that is greater than 0.005 cm2/Vs. Then, the process includes forming a spaced apart source electrode and drain electrode, wherein the source electrode and the drain electrode are separated by and electrically connected with, the n-channel semiconductor film. A gate electrode is then formed, spaced apart from the semiconductor material. One or more of the thin film semiconductor devices (or transistors) can be incorporated into an electronic device.
    • 制造薄膜半导体器件的方法包括以下步骤,但不一定按照所述顺序。 首先,将有机半导体材料的薄膜沉积在基板上。 这种有机半导体材料薄膜包括有机半导体材料,其包括一种或多种权利要求1的芳基二甲基二咪唑基化合物,使得该膜表现出大于0.005cm 2 / Vs的场效应电子迁移率。 然后,该工艺包括形成间隔开的源电极和漏电极,其中源极电极和漏极电极与n沟道半导体膜分离并与其电连接。 然后形成与半导体材料间隔开的栅电极。 可以将一个或多个薄膜半导体器件(或晶体管)并入电子器件中。