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    • 6. 发明申请
    • Functional composites, functional inks and applications thereof
    • 功能复合材料,功能油墨及其应用
    • US20080199687A1
    • 2008-08-21
    • US12070063
    • 2008-02-14
    • Shivkumar ChiruvoluVladimir K. DioumaevNobuyuki KambeHui Du
    • Shivkumar ChiruvoluVladimir K. DioumaevNobuyuki KambeHui Du
    • B32B5/16C08K3/02C08K3/08
    • H05K1/095C09D11/101H05K2201/0257H05K2201/0266H05K2201/0329Y10T428/25Y10T428/259
    • Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.
    • 功能复合材料包括有机基质内的元素无机颗粒。 元素无机材料通常包含元素金属,元素准金属,其合金或其混合物。 在替代或另外的实施方案中,无机颗粒可以包含金属氧化物,类金属氧化物,其组合或其混合物。 当与有机基质共混不超过约2微米时,无机颗粒的平均一次粒径不超过250nm,分散体中的二次粒径。 颗粒可以在复合材料内基本上未聚集。 有机粘合剂可以是功能聚合物,例如半导体聚合物。 无机颗粒可以被表面改性,例如具有芳族官能团的部分用于与半导体聚合物的期望相互作用。 基于溶液的方法可用于从颗粒的分散体形成复合物。 复合材料可以加工成产品,如印刷电子设备。
    • 7. 发明授权
    • Functional composites, functional inks and applications thereof
    • 功能复合材料,功能油墨及其应用
    • US08119233B2
    • 2012-02-21
    • US12070063
    • 2008-02-14
    • Shivkumar ChiruvoluVladimir K. DioumaevNobuyuki KambeHui Du
    • Shivkumar ChiruvoluVladimir K. DioumaevNobuyuki KambeHui Du
    • C08K3/02C08K3/08
    • H05K1/095C09D11/101H05K2201/0257H05K2201/0266H05K2201/0329Y10T428/25Y10T428/259
    • Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.
    • 功能复合材料包括有机基质内的元素无机颗粒。 元素无机材料通常包含元素金属,元素准金属,其合金或其混合物。 在替代或另外的实施方案中,无机颗粒可以包含金属氧化物,类金属氧化物,其组合或其混合物。 当与有机基质共混不超过约2微米时,无机颗粒的平均一次粒径不超过250nm,分散体中的二次粒径。 颗粒可以在复合材料内基本上未聚集。 有机粘合剂可以是功能聚合物,例如半导体聚合物。 无机颗粒可以被表面改性,例如具有芳族官能团的部分用于与半导体聚合物的期望相互作用。 基于溶液的方法可用于从颗粒的分散体形成复合物。 复合材料可以加工成产品,如印刷电子设备。