专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060163745A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20060163745A1
公开(公告)日：2006-07-27
申请号：US11340562
申请日：2006-01-27
申请人： Shiro Yamashita , Daisuke Tsuji , Akihiko Hatasawa , Hidehiro Takeshima
发明人： Shiro Yamashita , Daisuke Tsuji , Akihiko Hatasawa , Hidehiro Takeshima
IPC分类号： H01L23/48 , H05K1/16
CPC分类号： H01L25/0657 , H01L23/145 , H01L23/5383 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06555 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor device according to the present invention, a first bare chip, and a second bare chip having a wider principal surface than that of the first bare chip are connected to one principal surface and the other principal surface of an interposer substrate, respectively. In the semiconductor device, a resin having a larger coefficient of linear expansion than that of the second bare chip is applied to a backgrind surface (a principal surface at an opposite side to the interposer substrate) of the second bare chip, thereby preventing the second bare chip from cracking due to warpage of the interposer substrate.
摘要翻译：在根据本发明的半导体器件中，具有比第一裸芯片更宽的主表面的第一裸芯片和第二裸芯片分别连接到插入器基板的一个主表面和另一主表面。在半导体装置中，将具有比第二裸芯片的线膨胀系数大的树脂施加到第二裸芯片的背面研磨表面（与内插基板的相反侧的主表面），从而防止第二裸芯片裸芯片由于内插器基板的翘曲而破裂。

2. 发明授权

US10131275B2 Motive power operation guidance apparatus 有权
公开(公告)号：US10131275B2
公开(公告)日：2018-11-20
申请号：US14649950
申请日：2013-12-10
申请人： Kenji Marunaka , Daisuke Tsuji , Noriyuki Imanishi , Hiroshi Katou , Masaya Watanabe , Toru Ochi , Yasuhiro Tsutsumi
发明人： Kenji Marunaka , Daisuke Tsuji , Noriyuki Imanishi , Hiroshi Katou , Masaya Watanabe , Toru Ochi , Yasuhiro Tsutsumi
IPC分类号： B60K35/00 , B60Q5/00 , B60K6/22 , F02D29/00 , B60W50/14 , F02D29/02
摘要： A motive power stoppage guidance apparatus includes at least one of a display device configured to be disposed in a compartment of a vehicle, and a sound output device configured to output a sound in the compartment of the vehicle; and an indication control unit configured, when the vehicle is traveling in a state where a motive power stops, or when the likelihood is high in that the vehicle is traveling in the state where the motive power stops, to execute at least one of having the display device display at least one of that the motive power is in a stopped state, and a recommended operational method, and having the sound output device output an indication sound.

3. 发明申请

US20140094521A1 BENZYLAMINE DERIVATIVE 审中-公开
标题翻译：苯甲酰胺衍生物
公开(公告)号：US20140094521A1
公开(公告)日：2014-04-03
申请号：US14122731
申请日：2012-05-23
申请人： Daisuke Tsuji , Kohji Itoh , Akira Otaka , Akira Shigenaga , Masahiro Abe , Masahiro Hiasa
发明人： Daisuke Tsuji , Kohji Itoh , Akira Otaka , Akira Shigenaga , Masahiro Abe , Masahiro Hiasa
IPC分类号： C07C233/51 , C07C233/31
CPC分类号： C07C233/51 , A61K31/165 , C07C233/31 , C07C259/06
摘要： The objective of the present invention is to provide a new compound which is effective in treating blood cancer, particularly multiple myeloma, and which is also effective in suppressing an SP cell, i.e. Side Population Cell, which is a cause of recurrence of cancer. The compound according to the present invention is a novel compound which has the specific benzylamine structure.
摘要翻译：本发明的目的是提供一种在治疗血液癌，特别是多发性骨髓瘤中有效的新化合物，并且也有效抑制作为癌症复发的原因的SP细胞即侧群体细胞。根据本发明的化合物是具有特定苄胺结构的新化合物。

4. 外观设计

USD519940S1 Remote controller for car burglar alarm 失效
标题翻译：汽车防盗报警遥控器
公开(公告)号：USD519940S1
公开(公告)日：2006-05-02
申请号：US29181215
申请日：2003-05-08
申请人： Hisashi Takeuchi , Akihiko Nakamura , Daisuke Tsuji
设计人： Hisashi Takeuchi , Akihiko Nakamura , Daisuke Tsuji

5. 发明授权

US08682253B2 Radio communication system, slave unit, master unit and communication method 有权
标题翻译：无线通信系统，从单元，主单元和通信方式
公开(公告)号：US08682253B2
公开(公告)日：2014-03-25
申请号：US12042807
申请日：2008-03-05
申请人： Daisuke Tsuji , Shinichi Mukaigawa
发明人： Daisuke Tsuji , Shinichi Mukaigawa
IPC分类号： H04B17/00 , H03C1/62
CPC分类号： G08C17/02
摘要： The invention provides a radio communication system allowing a user to readily set a delay time. The controller determines whether the test button was depressed and then determines how long the test button has been kept depressed. The depressed time is set as a delay time and stored in a memory. After a lapse of the set delay time, the controller starts a communication with a master unit, determines whether the installation site of the slave unit 10 is appropriate and notifies the determination. If a normal communication is recognized from the determination result, the user decides to install the slave unit to the tested installation site and terminates the test.
摘要翻译：本发明提供了允许用户容易地设置延迟时间的无线电通信系统。控制器确定测试按钮是否被按下，然后确定测试按钮保持按下多长时间。抑制时间被设置为延迟时间并存储在存储器中。在经过设定的延迟时间之后，控制器开始与主单元的通信，确定从单元10的安装地点是否合适，并通知该确定。如果从确定结果中识别到正常通信，则用户决定将从属单元安装到测试安装地点并终止测试。

6. 外观设计

USD494080S1 Car burglar alarm 失效
标题翻译：汽车防盗报警器
公开(公告)号：USD494080S1
公开(公告)日：2004-08-10
申请号：US29181211
申请日：2003-05-08
申请人： Hisashi Takeuchi , Akihiko Nakamura , Daisuke Tsuji
设计人： Hisashi Takeuchi , Akihiko Nakamura , Daisuke Tsuji

7. 发明申请

US20140093960A1 CELL DIFFERENTIATION INDUCER AND DIFFERENTIATION INDUCING METHOD 审中-公开
标题翻译：细胞分化诱导和差异诱导方法
公开(公告)号：US20140093960A1
公开(公告)日：2014-04-03
申请号：US14118648
申请日：2012-05-14
申请人： Daisuke Tsuji , Kohji Itoh , Shigeki Sano , Michiyasu Nakao
发明人： Daisuke Tsuji , Kohji Itoh , Shigeki Sano , Michiyasu Nakao
IPC分类号： C12N5/079
CPC分类号： C12N5/0618 , C12N2501/385 , C12N2501/999 , C12N2506/02 , C12N2506/45
摘要： The objective of the present invention is to provide a cell differentiation inducer which is a low-molecular compound, which can be chemically synthesized easily and which can efficiently induce a differentiation of an undifferentiated cell into a nervous system cell with high selectivity. In addition, the objective of the present invention is to provide use of a specific catechol derivative for efficiently inducing a differentiation of an undifferentiated cell into a nervous system cell with high selectivity, and a method for efficiently inducing a differentiation of an undifferentiated cell into a nervous system cell with high selectivity using a specific catechol derivative. The cell differentiation inducer of the present invention is characterized in comprising the catechol derivative having the specific chemical structure.
摘要翻译：本发明的目的是提供一种细胞分化诱导剂，其是可以容易地化学合成的低分子化合物，其可以以高选择性有效地诱导未分化细胞分化成神经系统细胞。此外，本发明的目的是提供特异性儿茶酚衍生物用于高选择性地有效诱导未分化细胞分化成神经系统细胞的用途，以及有效诱导未分化细胞分化为使用特定的儿茶酚衍生物具有高选择性的神经系统细胞。本发明的细胞分化诱导剂的特征在于包含具有特定化学结构的儿茶酚衍生物。

8. 发明授权

US08461690B2 Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process 有权
标题翻译：能够抑制制造工序中的半导体芯片产生裂纹的半导体装置
公开(公告)号：US08461690B2
公开(公告)日：2013-06-11
申请号：US12969909
申请日：2010-12-16
申请人： Masanori Yoshida , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
发明人： Masanori Yoshida , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
IPC分类号： H01L29/40
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.
摘要翻译：一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

9. 发明申请

US20110147945A1 SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING GENERATION OF CRACKS IN SEMICONDUCTOR CHIP DURING MANUFACTURING PROCESS 有权
标题翻译：在制造过程中抑制半导体芯片中裂纹产生的半导体器件
公开(公告)号：US20110147945A1
公开(公告)日：2011-06-23
申请号：US12969909
申请日：2010-12-16
申请人： Masanori YOSHIDA , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
发明人： Masanori YOSHIDA , Daisuke Tsuji , Masahito Yamato , Jun Sasaki , Kaoru Sonobe , Akira Ide , Masahiro Yamaguchi
IPC分类号： H01L23/52
CPC分类号： H01L23/3128 , H01L21/561 , H01L21/563 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a chip stacked body where a plurality of semiconductor chips are stacked, and penetration electrodes respectively formed in the semiconductor chips are electrically interconnected in stacking order of the semiconductor chips, a first support member that is disposed to face a first semiconductor chip formed in one end of the chip stacked body, and including electrodes electrically connected to the penetration electrodes of the first semiconductor chip, and a wiring board that is disposed to face a second semiconductor chip formed in an end opposed to the one end of the chip stacked body, and including external electrodes on a surface opposed to a surface facing the second semiconductor chip that is to be electrically connected to the penetration electrodes of the second semiconductor chip.
摘要翻译：一种半导体器件包括堆叠多个半导体芯片的芯片堆叠体，并且分别形成在半导体芯片中的穿透电极以半导体芯片的堆叠顺序电互连，第一支撑构件设置为面对第一半导体芯片形成在所述芯片堆叠体的一端，并且包括电连接到所述第一半导体芯片的穿透电极的电极以及配置为面对形成在与所述芯片的所述一端相对的端部的第二半导体芯片的布线板并且在与要与第二半导体芯片的贯通电极电连接的与第二半导体芯片相对的表面相对的表面上包括外部电极。

10. 发明授权

US07477523B2 Semiconductor device and method of manufacturing semiconductor device 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07477523B2
公开(公告)日：2009-01-13
申请号：US11678492
申请日：2007-02-23
申请人： Daisuke Tsuji
发明人： Daisuke Tsuji
IPC分类号： H05K7/00
CPC分类号： H01L21/563 , H01L21/561 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L24/97 , H01L2224/1134 , H01L2224/13144 , H01L2224/16237 , H01L2224/73203 , H01L2224/73204 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H05K3/3452 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , H05K2203/0594 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012
摘要： A semiconductor device has at least a square wiring board having a board core made of an insulating material, wires made of a metal and formed on a first surface of the board core, a solder resist film formed on the first surface to cover the wires, and openings formed by partially opening the solder resist film, wherein a plurality of the elongated wires are arranged in parallel on the bottom of the openings, a semiconductor chip having electrodes flip chip connected to the wires are arranged on the bottom of the openings of the wiring board through a conductive bonding material, and an insulating resin is provided for filling an interstice between the wiring board and the semiconductor chip, wherein the wires extend along a width direction orthogonal to a longitudinal direction of the openings, the openings comprise elongated grooves which extend along at least two opposing sides of the square of the wiring board, a pair of opposing edges of the opening along the longitudinal direction define zig-zag edges in which the widths of the opening seem to be longer and shorter in a repeating sequence, and recessed edge portions which recess toward the outside of the opening formed by the zig-zag edges in the width direction correspond to the wires, and protruded edge portions which protrude toward the inside of the opening formed by the zig-zag edges in the width direction correspond to the board core between adjoining the wires.
摘要翻译：半导体器件至少具有由绝缘材料制成的板芯的正方形布线板，由金属制成的金属线形成在板芯的第一表面上，阻焊膜形成在第一表面上以覆盖电线，以及通过部分地打开阻焊膜形成的开口，其中多个细长导线平行地布置在开口的底部上，具有连接到导线的电极倒装芯片的半导体芯片布置在开口的底部上布线板通过导电接合材料，并且提供绝缘树脂以填充布线板和半导体芯片之间的间隙，其中电线沿着与开口的纵向正交的宽度方向延伸，开口包括细长槽沿着布线板的正方形的至少两个相对侧延伸，沿着纵向方向的一对相对的开口的边缘在其中开口的宽度以重复顺序看起来更长和更短的定义的Z字形边缘，并且朝向宽度方向上由之字形边缘形成的开口的外侧凹陷的凹入边缘部分对应于电线和在宽度方向上由锯齿形边缘形成的开口的内侧突出的突出部分对应于相邻电线之间的板芯。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式