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    • 3. 发明授权
    • Semiconductor device and liquid crystal panel driver device
    • 半导体装置和液晶面板驱动装置
    • US07580020B2
    • 2009-08-25
    • US11487339
    • 2006-07-17
    • Shinya UdoMasao KumagaiMasatoshi KokubunHidekazu NishizawaTakeo Shigihara
    • Shinya UdoMasao KumagaiMasatoshi KokubunHidekazu NishizawaTakeo Shigihara
    • G09G3/34
    • G09G3/006
    • A semiconductor device carries out a test utilizing contact with a probe needle without being affected by narrowing of the pitch at which output pads are arranged. The device is equipped with test circuits provided between a plurality of output buffers via which signals are output and output pads corresponding thereto. The test circuit includes output switches caused to sequentially make connections by a controller in test and interpad switches involved in making connections of the output pads with a test pad by the controller in test. In test, probe needles are brought into contact with the test pad. The output pads are not used in test, and can be arranged at a narrowed pitch. Thus, the chip area can be reduced and are therefore so that the pitch for the output pads can be narrowed and the chip area can be decreased.
    • 半导体器件利用与探针接触而进行测试,而不受输出焊盘布置的间距变窄的影响。 该装置配备有测试电路,该测试电路设置在输出信号的多个输出缓冲器和对应于其的输出焊盘之间。 测试电路包括输出开关,其由测试中的控制器顺序进行连接,并且控制器在测试中涉及与输出焊盘的连接与测试焊盘的连接。 在测试中,探针与测试垫接触。 输出垫不用于测试,可以以窄的间距布置。 因此,可以减小芯片面积,因此可以使输出焊盘的间距变窄,并且可以减小芯片面积。