专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110146878A1 MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR A NON-CONTACT COMMUNICATION MEDIUM 失效
标题翻译：非接触式通信介质的制造方法和制造设备
公开(公告)号：US20110146878A1
公开(公告)日：2011-06-23
申请号：US12968965
申请日：2010-12-15
申请人： Shintarou Sasaki , Takanori Aizawa , Yuji Sakai
发明人： Shintarou Sasaki , Takanori Aizawa , Yuji Sakai
IPC分类号： B32B37/02 , B29C65/00 , B32B37/12
CPC分类号： G06K19/07749 , B32B37/142 , B32B2305/22 , B32B2425/00 , Y10T156/10 , Y10T428/24901
摘要： Provided is a manufacturing method for a non-contact communication medium, including: forming in a first region a first structure including an IC chip mounted on the first region, a first adhesive in an uncured state, which is applied on the IC chip, and a first plate member placed on the first adhesive; forming in a second region a second structure including a second adhesive in an uncured state, which is applied on the second region, and a second plate member placed on the second adhesive; sandwiching the first region and the second region by a first partition wall capable of partitioning the first region and accommodating the first structure and a second partition wall capable of partitioning the second region and accommodating the second structure; and heating the first partition wall and the second partition wall, to thereby thermally cure the first adhesive and the second adhesive, respectively.
摘要翻译：提供一种非接触式通信介质的制造方法，包括：在第一区域中形成第一结构，该第一结构包括安装在第一区域上的IC芯片，未固化状态的第一粘合剂，其被施加在IC芯片上;以及放置在第一粘合剂上的第一板构件; 在第二区域中形成包括处于未固化状态的第二粘合剂的第二结构，其施加在第二区域上，以及放置在第二粘合剂上的第二板构件; 通过能够分隔第一区域并容纳第一结构的第一分隔壁和能够分隔第二区域并容纳第二结构的第二分隔壁来夹持第一区域和第二区域; 并加热第一分隔壁和第二分隔壁，从而分别热固化第一粘合剂和第二粘合剂。

2. 发明授权

US08349118B2 Manufacturing method and manufacturing apparatus for a non-contact communication medium 失效
标题翻译：非接触式通信介质的制造方法和制造装置
公开(公告)号：US08349118B2
公开(公告)日：2013-01-08
申请号：US12968965
申请日：2010-12-15
申请人： Shintarou Sasaki , Takanori Aizawa , Yuji Sakai
发明人： Shintarou Sasaki , Takanori Aizawa , Yuji Sakai
IPC分类号： B32B37/06
CPC分类号： G06K19/07749 , B32B37/142 , B32B2305/22 , B32B2425/00 , Y10T156/10 , Y10T428/24901
摘要： Provided is a manufacturing method for a non-contact communication medium, including: forming in a first region a first structure including an IC chip mounted on the first region, a first adhesive in an uncured state, which is applied on the IC chip, and a first plate member placed on the first adhesive; forming in a second region a second structure including a second adhesive in an uncured state, which is applied on the second region, and a second plate member placed on the second adhesive; sandwiching the first region and the second region by a first partition wall capable of partitioning the first region and accommodating the first structure and a second partition wall capable of partitioning the second region and accommodating the second structure; and heating the first partition wall and the second partition wall, to thereby thermally cure the first adhesive and the second adhesive, respectively.
摘要翻译：提供一种非接触式通信介质的制造方法，包括：在第一区域中形成第一结构，该第一结构包括安装在第一区域上的IC芯片，未固化状态的第一粘合剂，其被施加在IC芯片上;以及放置在第一粘合剂上的第一板构件; 在第二区域中形成包括处于未固化状态的第二粘合剂的第二结构，其施加在第二区域上，以及放置在第二粘合剂上的第二板构件; 通过能够分隔第一区域并容纳第一结构的第一分隔壁和能够分隔第二区域并容纳第二结构的第二分隔壁来夹持第一区域和第二区域; 并加热第一分隔壁和第二分隔壁，从而分别热固化第一粘合剂和第二粘合剂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式