会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Solar battery module and method for production thereof
    • 太阳能电池组件及其制造方法
    • US6051774A
    • 2000-04-18
    • US129087
    • 1998-08-05
    • Shinichiro YoshidaMasahiro Yoshino
    • Shinichiro YoshidaMasahiro Yoshino
    • H01L31/042H01L25/00H01L31/04H01L31/052H01L31/18
    • H01L31/052B32B15/043B32B15/20B32B3/12F28F3/12H01L31/048Y02E10/50
    • A solar battery module having the component members thereof joined uniformly and sustaining no distortion in the surface thereof and a method for the production thereof are disclosed, The solar battery module comprises a solar battery unit and a honeycomb structure. The honeycomb structure comprises a honeycomb core possessed of a plurality of cells and a first surface panel and a second surface panel respectively joined to opposite opening sides of the honeycomb core. The second surface panel has a plurality of perforations communicating with cavities in the cells of the honeycomb core. The honeycomb core has at least a pair of perforations in the walls of each of the cells or is made of a porous material. The solar battery unit provided with a plurality of solar battery elements is mounted on the second surface panel of the honeycomb structure through the medium of a joining member and they are joined by application of heat and pressure while the air remaining in the gap therebetween is caused to flow into cavities of the honeycomb structure.
    • 公开了一种太阳能电池模块,其具有均匀地连接并且在其表面上不变形的太阳能电池模块及其制造方法。太阳能电池模块包括太阳能电池单元和蜂窝结构。 蜂窝结构体包括具有多个单电池的蜂窝芯和分别接合到蜂窝芯的相对的开口侧的第一表面面板和第二表面面板。 第二表面面板具有与蜂窝芯的单元中的空腔连通的多个穿孔。 蜂窝芯在每个单元的壁中具有至少一对穿孔,或者由多孔材料制成。 设置有多个太阳能电池元件的太阳能电池单元通过接合构件的介质安装在蜂窝结构体的第二表面面板上,并且通过施加热和压力而接合,同时留在其间的间隙中的空气 流入蜂窝结构的空腔。
    • 3. 发明授权
    • Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
    • 层压结构,超大规模集成电路布线板及其形成方法
    • US07547972B2
    • 2009-06-16
    • US11529535
    • 2006-09-29
    • Tetsuya OsakaMasahiro Yoshino
    • Tetsuya OsakaMasahiro Yoshino
    • H01L23/48H01L23/52
    • H01L23/53238C23C18/1651C23C18/1893H01L21/288H01L21/76814H01L21/76826H01L21/76831H01L21/76843H01L21/76846H01L21/76864H01L21/76874H01L23/53295H01L2924/0002H01L2924/00
    • The laminated structure includes a substrate of low dielectric constant material of silicon compound and an electroless copper plating layer laminated thereon with a barrier layer. The barrier layer is interposed between the substrate and the copper layer, and the barrier layer is formed by electroless plating. And the laminated structure is characterized in that the barrier layer is formed on the substrate with a monomolecular layer of organosilane compound and a palladium catalyst which are interposed between the substrate and the barrier layer, the palladium catalyst modifies the terminal, adjacent to the barrier layer, of the monomolecular layer, and the barrier layer includes an electroless NiB plating layer which is disposed on the substrate side, and a electroless CoWP plating layer.The present invention makes it possible to coat the low dielectric constant material of silicon compound in a simple all-wet process with a firmly adhering barrier layer and an electroless copper plating layer as the wiring layer. the advantage of requiring. Thus, the laminated structure formed in this way includes a substrate of low dielectric constant material of silicon compound, a barrier layer, and a copper layer as the wiring layer formed by electroless plating, which firmly adhere to one another. In addition, the laminated structure is suitable for the copper wiring in a ULSI, particularly the one which is to be formed in a narrower trench than conventional one.
    • 层叠结构包括硅化合物的低介电常数材料的基板和层压有阻挡层的化学镀铜层。 阻挡层插入在基板和铜层之间,通过无电镀形成阻挡层。 层叠结构的特征在于,在基板上形成有分隔层的有机硅烷化合物和钯催化剂插入在基板和阻挡层之间的阻挡层,钯催化剂改变与阻挡层相邻的端子 的阻挡层,并且阻挡层包括设置在基板侧的无电解NiB镀层和无电CoWP镀层。 本发明使得可以以简单的全湿法将具有牢固粘合的阻挡层和化学镀铜层的硅化合物的低介电常数材料涂布作为布线层。 要求的优点。 因此,以这种方式形成的层叠结构包括硅化合物的低介电常数材料的衬底,阻挡层和作为通过无电镀形成的布线层的铜层,其彼此牢固地粘合。 此外,该层压结构适用于ULSI中的铜布线,特别是在比常规的窄沟槽形成的布线中。
    • 9. 发明申请
    • Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof
    • 层压结构,超大规模集成电路布线板及其形成方法
    • US20080079154A1
    • 2008-04-03
    • US11529535
    • 2006-09-29
    • Tetsuya OsakaMasahiro Yoshino
    • Tetsuya OsakaMasahiro Yoshino
    • H01L23/52
    • H01L23/53238C23C18/1651C23C18/1893H01L21/288H01L21/76814H01L21/76826H01L21/76831H01L21/76843H01L21/76846H01L21/76864H01L21/76874H01L23/53295H01L2924/0002H01L2924/00
    • The laminated structure includes a substrate of low dielectric constant material of silicon compound and an electroless copper plating layer laminated thereon with a barrier layer. The barrier layer is interposed between the substrate and the copper layer, and the barrier layer is formed by electroless plating. And the laminated structure is characterized in that the barrier layer is formed on the substrate with a monomolecular layer of organosilane compound and a palladium catalyst which are interposed between the substrate and the barrier layer, the palladium catalyst modifies the terminal, adjacent to the barrier layer, of the monomolecular layer, and the barrier layer includes an electroless NiB plating layer which is disposed on the substrate side, and a electroless CoWP plating layer.The present invention makes it possible to coat the low dielectric constant material of silicon compound in a simple all-wet process with a firmly adhering barrier layer and an electroless copper plating layer as the wiring layer. the advantage of requiring. Thus, the laminated structure formed in this way includes a substrate of low dielectric constant material of silicon compound, a barrier layer, and a copper layer as the wiring layer formed by electroless plating, which firmly adhere to one another. In addition, the laminated structure is suitable for the copper wiring in a ULSI, particularly the one which is to be formed in a narrower trench than conventional one.
    • 层叠结构包括硅化合物的低介电常数材料的基板和层压有阻挡层的化学镀铜层。 阻挡层插入在基板和铜层之间,通过无电镀形成阻挡层。 层叠结构的特征在于,在基板上形成有分隔层的有机硅烷化合物和钯催化剂插入在基板和阻挡层之间的阻挡层,钯催化剂改变与阻挡层相邻的端子 的阻挡层,并且阻挡层包括设置在基板侧的无电解NiB镀层和无电CoWP镀层。 本发明使得可以以简单的全湿法将具有牢固粘合的阻挡层和化学镀铜层的硅化合物的低介电常数材料涂布作为布线层。 要求的优点。 因此,以这种方式形成的层叠结构包括硅化合物的低介电常数材料的衬底,阻挡层和作为通过无电镀形成的布线层的铜层,其彼此牢固地粘合。 此外,该层压结构适用于ULSI中的铜布线,特别是在比常规的窄沟槽形成的布线中。