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    • 9. 发明授权
    • Vapor deposition device, vapor deposition method, and organic EL display device
    • 气相沉积装置,气相沉积法和有机EL显示装置
    • US09240572B2
    • 2016-01-19
    • US13984799
    • 2012-03-02
    • Shinichi KawatoSatoshi InoueTohru SonodaSatoshi Hashimoto
    • Shinichi KawatoSatoshi InoueTohru SonodaSatoshi Hashimoto
    • H01L51/56C23C14/04C23C14/12C23C14/56C23C16/455H01L51/00
    • H01L51/56C23C14/044C23C14/12C23C14/562C23C16/45578H01L51/0011
    • A vapor deposition device includes a vapor deposition source (60) having a plurality of vapor deposition source openings (61) that discharge vapor deposition particles (91), a limiting unit (80) having a plurality of limiting openings (82), and a vapor deposition mask (70) in which a plurality of mask openings (71) are formed only in a plurality of vapor deposition regions (72) where the vapor deposition particles that have passed through a plurality of limiting openings reach. The plurality of vapor deposition regions are arranged along a second direction that is orthogonal to the normal line direction of the substrate (10) and the movement direction of the substrate, with non-vapor deposition regions (73) where the vapor deposition particles do not reach being sandwiched therebetween. Mask openings through which the vapor deposition particles pass are formed at different positions in the movement direction of the substrate from the positions of the non-vapor deposition regions located on a straight line parallel to the second direction, as viewed along the normal line direction of the substrate. Accordingly, it is possible to stably form a vapor deposition coating film in which edge blurring is suppressed at a desired position on a substrate.
    • 蒸镀装置包括:蒸镀源(60),具有排出气相沉积粒子(91)的多个气相沉积源开口(61),具有多个限制开口(82)的限制单元(80) 气相沉积掩模(70),其中多个掩模开口(71)仅形成在已经通过多个限制孔的气相沉积颗粒到达的多个气相沉积区(72)中。 多个气相沉积区域沿着与基板(10)的法线方向正交的第二方向和基板的移动方向排列,其中气相沉积微粒不具有非气相沉积区域(73) 夹在其间。 沿着平行于第二方向的直线上的非蒸镀区域的位置,沿着基板的移动方向的不同位置,沿蒸镀粒子的法线方向 底物。 因此,可以稳定地形成在基板上的期望位置抑制边缘模糊的气相沉积涂膜。