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    • 2. 发明授权
    • Method of manufacturing printed circuit board
    • 制造印刷电路板的方法
    • US08438726B2
    • 2013-05-14
    • US13083097
    • 2011-04-08
    • Shinichi InoueHiroyuki HanazonoMineyoshi HasegawaKeisuke Okumura
    • Shinichi InoueHiroyuki HanazonoMineyoshi HasegawaKeisuke Okumura
    • H05K3/02
    • H05K3/20H05K1/0393Y10T29/49117Y10T29/49144Y10T29/49155
    • A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
    • 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来,将抗蚀剂膜曝光和显影,从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后,在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影,使得在导体图案上形成粘合剂图案。 之后,将基底绝缘层接合到导体图案上,其中夹有粘合剂图案。 最后,将载体层与导体图案分离,从而制造FPC基板。