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1. 发明申请

US20060088983A1 Method of dividing wafer 审中-公开
标题翻译：分割晶片的方法
公开(公告)号：US20060088983A1
公开(公告)日：2006-04-27
申请号：US11251933
申请日：2005-10-18
申请人： Shinichi Fujisawa , Ryou Matsuhashi , Takashi Ono , Toshihiro Funanaka , Jun Hachiya , Akihito Kawai
发明人： Shinichi Fujisawa , Ryou Matsuhashi , Takashi Ono , Toshihiro Funanaka , Jun Hachiya , Akihito Kawai
IPC分类号： H01L21/78 , H01L21/302
CPC分类号： H01L21/67132 , H01L21/304 , H01L21/3065 , H01L21/31138 , H01L21/67092 , H01L21/78
摘要： In order to efficiently divide the wafer into individual devices in dicing the wafer without deteriorating the quality of the devices, the front surface of the wafer is coated with a resist film except the regions corresponding to the streets, grooves of a depth corresponding to the finished thickness of the devices are formed by plasma etching in the regions corresponding to the streets, and the back surface of the wafer is ground so that the grooves are exposed from the side of the back surface and that the wafer is divided into individual devices.
摘要翻译：为了在不影响器件质量的情况下将晶片有效地划分成各个器件，晶片的前表面涂覆有抗蚀剂膜，除了对应于街道的区域，对应于完成的深度的槽通过在与街道相对应的区域中的等离子体蚀刻形成器件的厚度，并且研磨晶片的背面，使得凹槽从背面的侧面露出，并且将晶片分成单独的器件。

2. 发明申请

US20060073705A1 Method for dividing semiconductor wafer along streets 审中-公开
标题翻译：半导体晶片沿街道划分的方法
公开(公告)号：US20060073705A1
公开(公告)日：2006-04-06
申请号：US11237690
申请日：2005-09-29
申请人： Kazuhisa Arai , Shinichi Fujisawa , Ryo Matsuhashi , Takashi Ono , Toshihiro Funanaka , Jun Hachiya , Akihito Kawai
发明人： Kazuhisa Arai , Shinichi Fujisawa , Ryo Matsuhashi , Takashi Ono , Toshihiro Funanaka , Jun Hachiya , Akihito Kawai
IPC分类号： H01L21/461
CPC分类号： H01L21/78 , H01L21/3065
摘要： A method for dividing a semiconductor wafer along a plurality of streets, the semiconductor wafer having a face on which a plurality of rectangular regions are defined by the streets arranged in a lattice pattern, and a semiconductor device is formed in each of the rectangular regions. This method comprises a protective member coating step of coating the face of the semiconductor wafer with a protective member, a resist film coating step of coating the back of the semiconductor wafer, except sites corresponding to the streets, with a resist film, and a plasma etching step of applying plasma etching to the back of the semiconductor wafer to divide the semiconductor wafer along the streets.
摘要翻译：一种用于沿着多个街道划分半导体晶片的方法，所述半导体晶片具有由以格子状布置的街道限定多个矩形区域的面，并且在每个矩形区域中形成半导体器件。该方法包括用保护部件涂覆半导体晶片的表面的保护部件涂布工序，除了与街道对应的位置以外的半导体晶片的背面，用抗蚀剂膜和等离子体将等离子体蚀刻施加到半导体晶片的背面以沿着街道划分半导体晶片的蚀刻步骤。

3. 发明申请

US20090186465A1 WAFER DIVIDING METHOD 审中-公开
标题翻译：波分方法
公开(公告)号：US20090186465A1
公开(公告)日：2009-07-23
申请号：US12346490
申请日：2008-12-30
申请人： Shinichi Fujisawa , Takashi Ono
发明人： Shinichi Fujisawa , Takashi Ono
IPC分类号： H01L21/02
CPC分类号： H01L21/78 , H01L21/67092
摘要： A wafer dividing method for dividing a wafer into individual devices, the front side of the wafer being formed with a plurality of crossing streets for partitioning a plurality of areas where the devices are respectively formed. The wafer dividing method includes the steps of coating the front side of the wafer with a protective film, cutting the front side of the wafer with the protective film along the streets to form a plurality of kerfs each having a depth corresponding to the finished thickness of each device, removing chipping from each kerf by plasma etching, attaching a protective tape to the front side of the wafer, grinding the back side of the wafer to expose each kerf to the back side of the wafer, thereby dividing the wafer into the individual devices, and removing a grinding strain from the back side of the wafer.
摘要翻译：一种用于将晶片分成各个装置的晶片分割方法，所述晶片的前侧形成有用于分隔形成所述器件的多个区域的多个交叉街道。晶片分割方法包括以下步骤：用保护膜涂覆晶片的前侧，沿着街道用保护膜切割晶片的前侧以形成多个切口，每个切口具有对应于最终厚度的深度每个器件通过等离子体蚀刻从每个切口去除碎片，将保护带附着到晶片的前侧，研磨晶片的背面以将每个切口暴露于晶片的背面，从而将晶片分成单独的装置，并且从晶片的背面移除研磨应变。

4. 发明申请

US20060130967A1 Wafer machining apparatus 审中-公开
标题翻译：晶圆加工设备
公开(公告)号：US20060130967A1
公开(公告)日：2006-06-22
申请号：US11302392
申请日：2005-12-14
申请人： Shinichi Fujisawa , Takashi Ono
发明人： Shinichi Fujisawa , Takashi Ono
IPC分类号： H01L21/306 , C23F1/00
CPC分类号： H01L21/78 , H01L21/67092 , H01L21/67219 , H01L21/6835 , H01L2221/6834
摘要： The present invention provides a wafer machining apparatus which can separate streets with high efficiency, without deteriorating the quality of devices, in dividing a wafer into individual devices. The wafer machining apparatus comprises grinding means for grinding the back of the wafer; resist film coating means for passing a radiation from the back side to the face side of the wafer to recognize the streets, and coating a resist film onto regions other than street-corresponding regions; and plasma etching means for etching away the street-corresponding regions in a range from the back to the face of the wafer to divide the wafer into individual devices, and thus can perform a procedure ranging from grinding of the back of the wafer to the division of the wafer into the devices. In the resist film coating means, the wafer is imaged from the back side by an infrared imaging portion to recognize the streets formed on the face side, and a liquid resist is jetted from a resist jetting portion toward the regions other than the street-corresponding regions, whereby only the street-corresponding regions can be exposed.
摘要翻译：本发明提供了一种在将晶片分割为各个装置的同时，能够高效率地分离街道而不劣化装置的质量的晶片加工装置。晶片加工装置包括用于研磨晶片背面的研磨装置; 抗辐射膜涂布装置，用于将辐射从晶片的背面传递到表面，以识别街道，并将抗蚀剂膜涂覆到除街道对应区域之外的区域上; 以及等离子体蚀刻装置，用于在从晶片的背面到表面的范围内蚀刻掉街道对应的区域，以将晶片分割成单独的器件，并且因此可以执行从晶片背面研磨到分割的晶片进入器件。在抗蚀剂膜涂布装置中，通过红外成像部分从背面对晶片进行成像，以识别在正面上形成的街道，并且将抗蚀剂从抗蚀剂喷射部分喷射到除街道对应之外的区域区域，从而只能暴露与街道对应的区域。

5. 发明授权

US08752076B2 Disk device 有权
标题翻译：磁盘设备
公开(公告)号：US08752076B2
公开(公告)日：2014-06-10
申请号：US12050095
申请日：2008-03-17
申请人： Shinichi Fujisawa
发明人： Shinichi Fujisawa
IPC分类号： G11B17/04
CPC分类号： G11B17/051 , G11B17/0288 , G11B33/08
摘要： A lift frame supports a turntable unit, and moves between a lower-most position and a read/write position in conjunction with slide movement of a follower slider. The follower slider has a pressing member and a cam groove. Pressed to a bottom plate of a device chassis by a coil spring, the pressing member stabilizes the movement of the follower slider. The cam groove fits onto a lifting pin of the lift frame. At the read/write position, the cam bottom wall is constituted of a pin pushing portion. The pin pushing portion is pushed upward by the coil spring to press the lifting pin to a cam groove upper wall when the lift frame is in the read/write position.
摘要翻译：升降机架支撑转盘单元，并且在最低位置和读/写位置之间移动，并结合随动滑块的滑动运动。从动滑块具有按压部件和凸轮槽。按压构件通过螺旋弹簧压向装置底盘的底板，使按压构件稳定从动滑块的移动。凸轮槽装配在升降机架的提升销上。在读/写位置，凸轮底壁由销推动部分构成。当提升框架处于读/写位置时，销推动部分被螺旋弹簧向上推动以将提升销按压到凸轮槽上壁。

6. 发明授权

US08015575B2 Disk device with insertion slot capable of preventing double loading of disks 有权
标题翻译：具有插槽的磁盘设备能够防止双重加载磁盘
公开(公告)号：US08015575B2
公开(公告)日：2011-09-06
申请号：US12428374
申请日：2009-04-22
申请人： Shinichi Fujisawa
发明人： Shinichi Fujisawa
IPC分类号： G11B33/02 , G11B17/04
CPC分类号： G11B17/051
摘要： An optical disk device has a casing, an insertion slot and a loading mechanism for loading a disk. A shutter is shiftable transversely to an elongate slot shape of the insertion slot, closes the insertion slot partially when in a closed position, and opens the insertion slot when in an open position. A coupling hole is disposed at an end of the shutter with respect to the elongate slot shape. A shift lever moves the coupling hole in a first direction along the elongate slot shape upon shifting of the loading mechanism for loading, and moves the coupling hole in a second direction upon shifting of the loading mechanism for unloading. A cam mechanism shifts the shutter to the closed position when the coupling hole is moved in the first direction, and shifts the shutter to the open position when the coupling hole is moved in the second direction.
摘要翻译：光盘装置具有壳体，插槽和用于装载盘的装载机构。快门可以横向于插入槽的细长槽形状移动，当处于关闭位置时部分地封闭插入槽，并且当处于打开位置时打开插槽。耦合孔相对于细长槽形状设置在活门的端部。变速杆在移动用于装载的装载机构时沿着细长槽形状沿着第一方向移动联接孔，并且在卸载装载机构移动时沿第二方向移动联接孔。当联接孔沿第一方向移动时，凸轮机构将闸门移动到关闭位置，并且当联接孔沿第二方向移动时，将挡板移动到打开位置。

7. 发明申请

US20110029993A1 DISK DEVICE 有权
标题翻译：磁盘设备
公开(公告)号：US20110029993A1
公开(公告)日：2011-02-03
申请号：US12849580
申请日：2010-08-03
申请人： Shinichi Fujisawa
发明人： Shinichi Fujisawa
IPC分类号： G11B17/04
CPC分类号： G11B17/051
摘要： To eject an optical disk forcibly from a disk device by a manual operation, an operation pin is inserted into an emergency hole of a front bezel. Then, the operation pin causes first and second ejection levers to move rearward to push a first transmission gear down to a disengaged position. When the first transmission gear is pushed down to the disengaged position, a loading slider begins to move forward according to a biasing force of a coil spring, feeding the disk outward. After moving a distance forward, the loading slider is stopped against a receiving portion of a first ejection lever, thereby to stop the disk at a half-eject position where the disk slightly protrudes from the bezel. Thereafter, when the operation pin is pulled out, the loading slider moves forward along with the pull-out movement of the operation pin, and the disk is fed out to a full-eject position.
摘要翻译：要通过手动操作从磁盘设备强制弹出光盘，则操作销插入前挡板的紧急孔中。然后，操作销使第一和第二喷射杆向后移动，以将第一传动齿轮向下推动到脱离位置。当第一传动齿轮被向下压到脱离位置时，加载滑块根据螺旋弹簧的偏压力开始向前移动，将盘向外供给。在向前移动一段距离之后，装载滑块停靠在第一弹出杆的接收部分上，从而将盘停止在半弹出位置，其中盘从边框略微突出。此后，当操作销被拉出时，装载滑块随着操作销的拉出运动而向前移动，并且盘被送出到完全弹出位置。

8. 发明授权

US07814508B2 Disk device including a lifting frame for disk handling 有权
标题翻译：磁盘设备包括用于磁盘处理的提升架
公开(公告)号：US07814508B2
公开(公告)日：2010-10-12
申请号：US11821520
申请日：2007-06-22
申请人： Shinichi Fujisawa
发明人： Shinichi Fujisawa
IPC分类号： G11B17/04
CPC分类号： G11B17/051
摘要： An optical disk drive is loaded with a disk set in a chuck position upon entry through an insertion slot by automatic loading. A lifting frame is movable between high and low positions in an opening of a base panel. A disk driving unit is disposed on the lifting frame for chucking and rotating the disk. A leading segment is connected with the lifting frame, and raises a distal end of a periphery of the disk from the insertion slot by forming a slope. The leading segment extends in the insertion direction of the disk, and has an end positioned beside the disk driving unit. The end of the leading segment is kept higher than an upper surface of the lifting frame when the lifting frame is in the low position.
摘要翻译：当通过自动加载进入插入槽时，光盘驱动器装载有设置在卡盘位置的盘。提升框架可在基板的开口中的高位和低位之间移动。磁盘驱动单元设置在提升框架上，用于夹紧和旋转盘。引导段与提升框架连接，并且通过形成斜坡从插入槽升高盘的周边的远端。引导部分在盘的插入方向上延伸，并且具有位于盘驱动单元旁边的端部。当提升框架处于低位置时，引导段的端部保持高于起重框架的上表面。

9. 发明申请

US20100138846A1 DISK DEVICE 有权
标题翻译：磁盘设备
公开(公告)号：US20100138846A1
公开(公告)日：2010-06-03
申请号：US12626552
申请日：2009-11-25
申请人： Shinichi Fujisawa
发明人： Shinichi Fujisawa
IPC分类号： G11B17/04
CPC分类号： G11B17/051 , G11B17/0288
摘要： A lifting frame has a lifting pin that fits into a lifting cam groove of a follower slider, and swings up and down about a rod near a disk slot. A holding member is swingably attached to front end of the lifting frame. This holding member supports a turntable unit for holding a disk. The holding member has a cam follower pin that fits into a swinging cam groove of a loading slider to raise and lower the holding member. When the lifting frame swings down from a read/write position to a lowered position, the holding member inclines from the lifting frame so as to place the turntable unit substantially parallel to a disk carrying direction.
摘要翻译：提升框架具有一个提升销，该提升销装配在从动滑块的提升凸轮槽中，并绕着一个靠近盘槽的杆而上下摆动。保持构件可摆动地附接到提升框架的前端。该保持构件支撑用于保持盘的转盘单元。保持构件具有凸轮从动销，其配合到装载滑块的摆动凸轮槽中，以升高和降低保持构件。当提升架从读/写位置向下摆动到下降位置时，保持构件从提升框架倾斜，以将转盘单元基本上平行于盘传送方向。

10. 发明申请

US20060184853A1 Operating method for a motorized roller blind 有权
标题翻译：电动卷帘的操作方法
公开(公告)号：US20060184853A1
公开(公告)日：2006-08-17
申请号：US11270209
申请日：2005-11-09
申请人： Frederic Devis , Eric Lagarde , Valerie Maistre , Shinichi Fujisawa , Stephane Girod , Alain Tranchand , Capucine Autret
发明人： Frederic Devis , Eric Lagarde , Valerie Maistre , Shinichi Fujisawa , Stephane Girod , Alain Tranchand , Capucine Autret
IPC分类号： H04L1/18
CPC分类号： E05F15/40 , E05F15/00 , E05F15/77 , E05Y2400/822 , E05Y2800/00 , E05Y2900/106 , E06B9/68 , E06B2009/6872
摘要： The method describes the operation of a roller blind including a moving element that can be operated via an actuator and a handheld-type remote control used to set the value of an operating parameter of the system, the value of this parameter being modifiable between two limit values. In this method, after a modification of the setting of the parameter value, an acknowledgement signal is sent, the acknowledgement signals differing according to whether the parameter value is or is not a limit value.
摘要翻译：该方法描述了包括可以通过致动器操作的移动元件和用于设置系统的操作参数的值的手持式遥控器的卷帘的操作，该参数的值可在两个限制之间修改价值观。在该方法中，在修改了参数值的设定后，发送确认信号，确认信号根据参数值是否为限制值而不同。

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