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    • 5. 发明授权
    • Ultrasound imaging system
    • 超声成像系统
    • US07687976B2
    • 2010-03-30
    • US11669235
    • 2007-01-31
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • H01L41/09G01N24/00A61B8/14
    • A61B8/00A61B1/0005B06B1/0622G01S7/5208G01S15/8925G01S15/8927G03B42/06
    • An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
    • 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。
    • 7. 发明申请
    • Ultrasound Imaging System
    • 超声成像系统
    • US20080183078A1
    • 2008-07-31
    • US11669235
    • 2007-01-31
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • A61B8/00
    • A61B8/00A61B1/0005B06B1/0622G01S7/5208G01S15/8925G01S15/8927G03B42/06
    • An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
    • 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。
    • 8. 发明申请
    • ULTRASOUND IMAGING SYSTEM
    • 超声成像系统
    • US20100174195A1
    • 2010-07-08
    • US12725536
    • 2010-03-17
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • Bruno Hans HaiderKjell KristoffersenRayette Ann FisherThomas HalvorsrodRobert Wodnicki
    • A61B8/14
    • A61B8/00A61B1/0005B06B1/0622G01S7/5208G01S15/8925G01S15/8927G03B42/06
    • An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.
    • 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。