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1. 发明申请

US20050099098A1 Surface acoustic wave device, package for the device, and method of fabricating the device 失效
标题翻译：声表面波器件，器件封装以及器件制造方法
公开(公告)号：US20050099098A1
公开(公告)日：2005-05-12
申请号：US10864364
申请日：2004-06-10
申请人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
发明人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
IPC分类号： H01L23/04 , H01L41/08 , H03H3/08 , H03H9/10 , H03H9/25 , H03H9/64
CPC分类号： H03H9/1071 , H01L24/97 , H01L2224/05001 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/15153 , H01L2924/15313 , H01L2924/16195 , H01L2224/81 , H01L2924/00014
摘要： A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, a package housing the surface acoustic wave chip, and electrode patterns provided on a bottom surface of the package. The bottom surface of the package is wider than a top surface of the package. The electrode patterns are away from edges of the bottom surface of the package.
摘要翻译：表面声波装置包括具有形成有梳状电极和电极焊盘的压电基板的表面声波芯片，容纳声表面波芯片的封装以及设置在封装的底面上的电极图案。包装的底部表面比包装的顶部表面宽。电极图案远离封装底表面的边缘。

2. 发明授权

US07215065B2 Surface acoustic wave device, package for the device, and method of fabricating the device 失效
标题翻译：声表面波器件，器件封装以及器件制造方法
公开(公告)号：US07215065B2
公开(公告)日：2007-05-08
申请号：US10864364
申请日：2004-06-10
申请人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
发明人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
IPC分类号： H01L41/08
CPC分类号： H03H9/1071 , H01L24/97 , H01L2224/05001 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/97 , H01L2924/15153 , H01L2924/15313 , H01L2924/16195 , H01L2224/81 , H01L2924/00014
摘要： A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, a package housing the surface acoustic wave chip, and electrode patterns provided on a bottom surface of the package. The bottom surface of the package is wider than a top surface of the package. The electrode patterns are away from edges of the bottom surface of the package.
摘要翻译：表面声波装置包括具有形成有梳状电极和电极焊盘的压电基板的表面声波芯片，容纳声表面波芯片的封装以及设置在封装的底面上的电极图案。包装的底部表面比包装的顶部表面宽。电极图案远离封装底表面的边缘。

3. 发明授权

US07180228B2 Surface acoustic wave device, package for the device, and method of fabricating the device 有权
标题翻译：声表面波器件，器件封装以及器件制造方法
公开(公告)号：US07180228B2
公开(公告)日：2007-02-20
申请号：US10866966
申请日：2004-06-15
申请人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
发明人： Shingo Masuko , Naoyuki Mishima , Masao Irikura
IPC分类号： H03H9/05 , H01L41/04
CPC分类号： H03H9/1078 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/16 , H03H3/08 , H03H9/1071 , H01L2224/05624 , H01L2924/00014 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684
摘要： A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, and a package housing the surface acoustic wave chip, a first surface of the package including an opening of the cavity being wider than a second surface of the package opposite to the first surface.
摘要翻译：声表面波装置包括具有形成有梳状电极和电极焊盘的压电基板的声表面波芯片和容纳声表面波芯片的封装，该封装的第一表面包括空腔的开口比包装件的与第一表面相对的第二表面宽。

4. 发明授权

US06356021B2 Built-in resistor for cathode-ray tube 失效
标题翻译：阴极射线管内置电阻
公开(公告)号：US06356021B2
公开(公告)日：2002-03-12
申请号：US09783972
申请日：2001-02-16
申请人： Masao Irikura , Aiko Takemoto , Suejiro Iwata
发明人： Masao Irikura , Aiko Takemoto , Suejiro Iwata
IPC分类号： H01J2316
CPC分类号： H01J29/96 , H01J29/92 , H01J2229/922 , H01J2229/966
摘要： A built-in resistor for cathode-ray tube which comprises an insulating substrate, a resistance layer formed on one main surface of the insulating substrate, a plurality of terminal electrodes mounted on the resistance layer, and a plurality of terminals connected respectively with the terminal electrodes, wherein the plurality of terminals are individually constituted by a base body made of a non-magnetic alloy, and by a surface layer which is formed on the surface of the base body and made of an oxide of the non-magnetic alloy, the plurality of terminals have a relative permeability of not more than 1.005, and the surface layer of each of the terminals is partially provided with an insulating covering layer. The nonmagnetic alloy is a Ni—Cr-based alloy, and the surface layer is formed through an oxidation treatment under a condition where the formation of NiO can be suppressed.
摘要翻译：一种用于阴极射线管的内置电阻器，其包括绝缘基板，形成在绝缘基板的一个主表面上的电阻层，安装在电阻层上的多个端子电极和分别与端子连接的多个端子电极，其中所述多个端子由非磁性合金制的基体单独构成，并且由形成在基体的表面上并由非磁性合金的氧化物构成的表面层构成，多个端子的相对磁导率不大于1.005，并且每个端子的表面层部分地设置有绝缘覆盖层。非磁性合金是Ni-Cr系合金，在能够抑制NiO的形成的条件下，通过氧化处理形成表面层。

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