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1. 发明申请

US20230133834A1 HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED COMPOSITE MATERIAL AND RADOME 有权
公开(公告)号：US20230133834A1
公开(公告)日：2023-05-04
申请号：US17957378
申请日：2022-09-30
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Yoshihiro TSUTSUMI , Tadaharu IKEDA
IPC分类号： C08J5/04 , C08L33/24
摘要： Provided are a heat-curable maleimide resin composition for RTM that is used to produce a fiber-reinforced composite material such as FRP, and is superior in dielectric properties; and a fiber-reinforced composite material using such composition. The composition contains: (A-1) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, and having a viscosity of not higher than 20 Pa·s; (A-2) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, having a viscosity of greater than 20 Pa·s, and exhibiting a fluidity at 25° C.; (B) a radical polymerization initiator; and (C) a polymerization inhibitor, wherein the viscosities of the components (A-1) and (A-2) are measured in accordance with a method described in JIS Z8803:2011, at a measurement temperature of 25° C., and using a Brookfield-type rotary viscometer with a rotation rate of a spindle being set to 5 rpm.

2. 发明申请

US20230040536A1 PHOTOCURABLE MALEIMIDE RESIN COMPOSITION 有权
公开(公告)号：US20230040536A1
公开(公告)日：2023-02-09
申请号：US17834495
申请日：2022-06-07
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Yoshihiro TSUTSUMI , Hiroyuki IGUCHI , Yuki KUDO , Atsushi TSUURA , Tadaharu IKEDA
IPC分类号： C08G73/10
摘要： Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.

3. 发明申请

US20230140237A1 HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE AND PRINTED-WIRING BOARD 有权
公开(公告)号：US20230140237A1
公开(公告)日：2023-05-04
申请号：US17971310
申请日：2022-10-21
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Yoshihiro TSUTSUMI , Shinsuke YAMAGUCHI , Yuki KUDO , Hiroyuki IGUCHI , Fumiya HIRANO , Atsushi TSUURA , Tadaharu IKEDA
IPC分类号： C08G73/10 , C08K3/36 , C08J5/24 , B32B5/02 , B32B27/28
摘要： Provided is a heat-curable maleimide resin composition capable of yielding a cured product having excellent dielectric properties even in the high-frequency region, a low water absorption rate, and a high glass-transition temperature. The heat-curable maleimide resin composition contains: (A) two or more kinds of maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule; and (B) a reaction initiator, wherein a cured product of the heat-curable maleimide resin composition has a dielectric tangent of not larger than 0.003 both at 10 GHz and 40 GHz.

4. 发明申请

US20160251511A1 RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于封装半导体元件和半导体器件的树脂组合物
公开(公告)号：US20160251511A1
公开(公告)日：2016-09-01
申请号：US15053730
申请日：2016-02-25
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shoichi OSADA , Ryuhei YOKOTA , Hiroki OISHI , Tadaharu IKEDA
IPC分类号： C08L63/00 , H01L23/29
CPC分类号： C08L63/00 , C08G59/621 , C08G77/14 , C08G77/42 , C08K3/36 , C08K5/3442 , C08K5/50 , C08K5/5377 , C08L63/04 , C08L83/10 , H01L23/296
摘要： The purposes of the present invention is to provide a resin composition which provides a cured product which has a high glass transition temperature, a low moisture absorption and a good solder reflow property and small heat decomposition in storage at a high temperature for a long time, and has good moldability and good adhesiveness to a Cu lead frame. Thus, the present invention is to provide a composition comprising (A) an epoxy compound represented by the general formula (1); (B) a copolymer obtained by a hydrosilylation between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by the average compositional formula (2); (C) a phenol compound represented by the general formula (3); (D) an inorganic filler; (E) at least one compound selected from the group consisting of organic phosphines, tetra-substituted phosphonium tetraphenylborates and adducts of phosphines and quinones; and (F) a nitrogen-containing heterocyclic compound represented by the formula (I) or a salt thereof represented by the formula (II). Further, the present invention provides a semiconductor device provided with a cured product obtained by curing the composition.
摘要翻译：本发明的目的是提供一种树脂组合物，其提供在高温下长时间储存时具有高玻璃化转变温度，低吸湿性和良好的回流焊性能以及小的热分解的固化产物，并且具有良好的成型性和对Cu引线框架的良好的粘附性。因此，本发明提供一种组合物，其包含（A）由通式（1）表示的环氧化合物; （B）通过含有链烯基的环氧化合物和由平均组成式（2）表示的有机聚硅氧烷之间的氢化硅烷化获得的共聚物; （C）由通式（3）表示的酚化合物; （D）无机填料; （E）选自有机膦，四取代鏻四苯基硼酸盐和膦和醌的加合物的至少一种化合物; 和（F）由式（I）表示的含氮杂环化合物或其由式（II）表示的盐。此外，本发明提供一种具有通过固化该组合物而得到的固化物的半导体装置。

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