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1. 发明授权

US08829486B2 Light-emitting device having active layers stacked alternately 有权
标题翻译：具有交替堆叠的有源层的发光装置
公开(公告)号：US08829486B2
公开(公告)日：2014-09-09
申请号：US13313645
申请日：2011-12-07
申请人： Rong-Ren Lee , Shih-Chang Lee , Chien-Fu Huang , Tsen-Kuei Wang
发明人： Rong-Ren Lee , Shih-Chang Lee , Chien-Fu Huang , Tsen-Kuei Wang
IPC分类号： H01L29/06 , H01L33/08 , H01L27/15 , H01L33/32
CPC分类号： H01L27/15 , H01L33/08 , H01L33/32
摘要： A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.
摘要翻译：发光器件包括衬底和形成在衬底上的发光结构。发光结构包括发射具有第一波长的光的第一有源层和发射具有第二波长的光的第二有源层。发光结构由交替堆叠的第一有源层和第二有源层形成。

2. 发明申请

US20120138892A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20120138892A1
公开(公告)日：2012-06-07
申请号：US13313645
申请日：2011-12-07
申请人： Rong-Ren Lee , Shih-Chang Lee , Chien-Fu Huang , Tsen-Kuei Wang
发明人： Rong-Ren Lee , Shih-Chang Lee , Chien-Fu Huang , Tsen-Kuei Wang
IPC分类号： H01L33/04
CPC分类号： H01L27/15 , H01L33/08 , H01L33/32
摘要： A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.
摘要翻译：发光器件包括衬底和形成在衬底上的发光结构。发光结构包括发射具有第一波长的光的第一有源层和发射具有第二波长的光的第二有源层。发光结构由交替堆叠的第一有源层和第二有源层形成。

3. 发明申请

US20100175746A1 TANDEM SOLAR CELL 审中-公开
标题翻译： TANDEM太阳能电池
公开(公告)号：US20100175746A1
公开(公告)日：2010-07-15
申请号：US12686169
申请日：2010-01-12
申请人： Rong-Ren LEE , Yung-Szu Su , Shih-Chang Lee
发明人： Rong-Ren LEE , Yung-Szu Su , Shih-Chang Lee
IPC分类号： H01L31/00 , H01L31/18
CPC分类号： H01L31/18 , H01L31/0725 , Y02E10/50
摘要： This application is related to a tandem solar cell device including a substrate, a first tunnel junction formed on the substrate, and a first p-n junction formed on the first tunnel junction wherein the first tunnel junction including a heavily doped n-type layer and an alloy layer wherein the alloy layer having an element with atomic number larger than that of Gallium.
摘要翻译：该应用涉及包括衬底，形成在衬底上的第一隧道结和在第一隧道结上形成的第一pn结的串联太阳能电池器件，其中第一隧道结包括重掺杂n型层和合金其中合金层具有原子序数大于镓的元素。

4. 发明申请

US20110278537A1 SEMICONDUCTOR EPITAXIAL STRUCTURES AND SEMICONDUCTOR OPTOELECTRONIC DEVICES COMPRISING THE SAME 审中-公开
标题翻译：半导体外延结构和包含其的半导体光电装置
公开(公告)号：US20110278537A1
公开(公告)日：2011-11-17
申请号：US13103412
申请日：2011-05-09
申请人： Shih-Chang Lee , Rong-Ren Lee
发明人： Shih-Chang Lee , Rong-Ren Lee
IPC分类号： H01L33/04 , H01L31/0248 , H01L29/15
CPC分类号： H01L33/12 , H01L21/0237 , H01L21/02463 , H01L21/02505 , H01L21/02513 , H01L31/03046 , H01L31/036 , H01L31/0687 , H01L33/04 , H01L33/22 , Y02E10/544
摘要： A semiconductor epitaxial structure includes a substrate; a semiconductor epitaxial stack layers formed on the substrate; and a plurality of semiconductor buffer layers deposited between the substrate and the semiconductor epitaxial layer with a gradually varied composition along one direction; wherein more than one of the semiconductor buffer layers have a patterned surface.
摘要翻译：半导体外延结构包括：基板; 在衬底上形成的半导体外延层叠层; 以及沿着一个方向以逐渐变化的组成沉积在所述衬底和所述半导体外延层之间的多个半导体缓冲层; 其中多于一个半导体缓冲层具有图案化表面。

5. 发明授权

US08179222B2 Transformer with conductive plate winding structure 失效
标题翻译：变压器带导电板绕组结构
公开(公告)号：US08179222B2
公开(公告)日：2012-05-15
申请号：US12615341
申请日：2009-11-10
申请人： Chung-Shu Lee , Shih-Chang Lee , Chi-Hsien Weng , Fu-Teng Hou
发明人： Chung-Shu Lee , Shih-Chang Lee , Chi-Hsien Weng , Fu-Teng Hou
IPC分类号： H01F27/30
CPC分类号： H01F27/2847 , H01F27/303
摘要： A transformer with a conductive plate winding structure includes a hollow core pillar, a partition, a conductive plate winding structure, and an insulating layer. The partition is fixed at the hollow core pillar for partitioning the hollow core pillar into two winding areas. The conductive plate winding structure is sheathed to the hollow core pillar and disposed at one of the two winding areas, and comprised of a plurality of conductive plates, and each conductive plate includes a ring having an opening and two conductive terminals extended out from the opening of the ring. The insulating layer is clamped between any two adjacent conductive plates, such that the conductive plates are stacked to from a winding for increasing the rated normal current and enhancing the assembling convenience.
摘要翻译：具有导电板绕组结构的变压器包括中空芯柱，隔板，导电板绕组结构和绝缘层。分隔件固定在空心芯柱上，用于将空心芯柱分隔成两个卷绕区域。导电板绕组结构被套在中空芯柱上并且设置在两个绕组区域中的一个上并且由多个导电板构成，并且每个导电板包括具有开口的环和从开口延伸出的两个导电端子的戒指绝缘层被夹在任何两个相邻的导电板之间，使得导电板从绕组堆叠以增加额定正常电流并增强组装方便性。

6. 发明申请

US20110069513A1 Current-Sharing Power Supply Apparatus With Bridge Rectifier Circuit 审中-公开
标题翻译：具有桥式整流电路的分流电源装置
公开(公告)号：US20110069513A1
公开(公告)日：2011-03-24
申请号：US12562374
申请日：2009-09-18
申请人： Chung-Shu Lee , Shih-Chang Lee
发明人： Chung-Shu Lee , Shih-Chang Lee
IPC分类号： H02M3/335
CPC分类号： H02M3/33569 , Y02B70/1433
摘要： A current-sharing power supply apparatus with a bridge rectifier circuit includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least four switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.
摘要翻译：具有桥式整流电路的分流电源装置包括转换电路，方波发生电路，谐振电路，整流电路和滤波电路。转换电路具有两个变压器，并且每个变压器具有初级绕组和至少一个次级绕组。方波发生电路与直流电压电连接，将直流电压切换成脉动电压。谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。整流电路具有至少四个开关元件，与变压器次级绕组电连接，将交流输出电压整流为整流电压，整流电压输出至少一个电压输出端子。

7. 发明申请

US20110019439A1 POWER SUPPLY APPARATUS WITH CURRENT-SHARING FUNCTION 有权
标题翻译：具有电流共享功能的电源设备
公开(公告)号：US20110019439A1
公开(公告)日：2011-01-27
申请号：US12509814
申请日：2009-07-27
申请人： Shih-Chang Lee , Chung-Shu Lee
发明人： Shih-Chang Lee , Chung-Shu Lee
IPC分类号： H02M3/335
CPC分类号： H02M3/33569 , Y02B70/1433
摘要： A power supply apparatus with a current-sharing function includes a conversion circuit, a square-wave generating circuit, a resonant circuit, and a rectifier-filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and two secondary windings. More particularly, two secondary windings of the different transformers are electrically connected in series and then the two in-series secondary windings are electrically connected in parallel. The square-wave generating circuit is used to switch a DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier-filter circuit has at least two switch components and a second capacitor, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a DC output voltage, and the DC output voltage is outputted to at least one output terminal.
摘要翻译：具有电流共享功能的电源装置包括转换电路，方波发生电路，谐振电路和整流滤波电路。转换电路具有两个变压器，并且每个变压器具有初级绕组和两个次级绕组。更具体地，不同变压器的两个次级绕组串联电连接，然后两个串联的次级绕组并联电连接。方波发生电路用于将直流电压切换为脉动电压。谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。整流滤波电路具有至少两个开关部件和第二电容器，并且电连接到变压器的次级绕组以将AC输出电压整流为DC输出电压，并且将DC输出电压输出至少一个输出终奌站。

8. 发明授权

US07439619B2 Electronic package structure and the packaging process thereof 有权
标题翻译：电子封装结构及其封装过程
公开(公告)号：US07439619B2
公开(公告)日：2008-10-21
申请号：US11028718
申请日：2005-01-03
申请人： Chi-Chih Chu , Gwo-Liang Weng , Shih-Chang Lee
发明人： Chi-Chih Chu , Gwo-Liang Weng , Shih-Chang Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/564 , H01L21/563 , H01L24/83 , H01L24/90 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/83102 , H01L2224/83851 , H01L2224/90 , H01L2224/92125 , H01L2924/14 , H01L2924/1433 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.
摘要翻译：本发明提供一种电子包装方法。芯片载体的表面至少包括芯片附着区域和与芯片连接区域相邻的膜附着区域。在芯片载体的表面上，在芯片安装区域和膜附着区域之间形成至少一个挡板。在通过粘合层将薄膜附着到芯片载体的膜附着区域之后，芯片通过粘合剂层电连接并且物理地连接到芯片载体的芯片连接区域。挡板可以有效地防止从粘合剂层释放的气体损害薄膜和固定层之间的粘结。因此，几乎不形成气泡，并且保持薄膜和附着层之间良好的电连接。

9. 发明授权

US07126221B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US07126221B2
公开(公告)日：2006-10-24
申请号：US10868495
申请日：2004-06-14
申请人： Gwo-Liang Weng , Yung-Li Lu , Chi-Chih Chu , Shih-Chang Lee
发明人： Gwo-Liang Weng , Yung-Li Lu , Chi-Chih Chu , Shih-Chang Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H05K3/305 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H05K2201/10734 , H05K2203/0545 , Y02P70/613 , H01L2924/00014
摘要： A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.
摘要翻译：一种半导体封装，包括通过倒装芯片接合设置在衬底上的衬底和半导体器件。本发明的特征在于设置在半导体器件和基板之间的连接结构，该连接结构沿着半导体器件的底表面的周边延伸。结果，它可以优选地在两者之间提供附加的安装支撑。连接结构可以由固化的粘合剂形成。本发明还提供一种半导体封装的制造方法。

10. 发明授权

US07122757B2 Contact sensor package structure 有权
标题翻译：接触传感器封装结构
公开(公告)号：US07122757B2
公开(公告)日：2006-10-17
申请号：US10868496
申请日：2004-06-14
申请人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
发明人： Shih-Chang Lee , Cheng-Yin Lee , Yung-Li Lu , Ying-Tsai Yeh , Pei-Chi Lin
IPC分类号： H03K17/975
CPC分类号： H03K17/975 , H03K17/98 , Y10T428/30
摘要： A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.
摘要翻译：接触传感器封装具有衬底，膜，密封剂和设置在衬底上的多个接触传感器。接触传感器设置在由基板，膜和密封剂限定的封闭空间内。接触传感器封装还具有至少形成在基板上的接地导电迹线和形成在膜的表面上并电连接到接地导电迹线的静电电荷耗散层。静电电荷耗散层具有作为用于检测接触工件的接触面的上表面。

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