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1. 发明申请

US20050075031A1 Electron source manufacturing apparatus and electron source manufacturing method 失效
标题翻译：电子源制造装置和电子源制造方法
公开(公告)号：US20050075031A1
公开(公告)日：2005-04-07
申请号：US10957839
申请日：2004-10-05
申请人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
发明人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
IPC分类号： H01J9/02 , H01J9/42
CPC分类号： H01J9/42 , H01J9/027 , H01J2201/3165 , H01J2329/00
摘要： In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.
摘要翻译：在电子源制造装置中，测量从电子源基板产生的热量。基于所测量的热量来控制电子源基板的支撑部件的温度。抑制了电子源基板的性能变化，延长了使用寿命。

2. 发明授权

US07226331B2 Electron source manufacturing apparatus and electron source manufacturing method 失效
标题翻译：电子源制造装置和电子源制造方法
公开(公告)号：US07226331B2
公开(公告)日：2007-06-05
申请号：US10957839
申请日：2004-10-05
申请人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
发明人： Shigeto Kamata , Kazuhiro Oki , Akihiro Kimura , Kazumasa Takatsu
IPC分类号： H01J9/00 , H01J9/42
CPC分类号： H01J9/42 , H01J9/027 , H01J2201/3165 , H01J2329/00
摘要： In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.
摘要翻译：在电子源制造装置中，测量从电子源基板产生的热量。基于所测量的热量来控制电子源基板的支撑部件的温度。抑制了电子源基板的性能变化，延长了使用寿命。

3. 发明授权

US06937041B2 Method for manufacturing a substrate and a display device 失效
标题翻译：制造基板和显示装置的方法
公开(公告)号：US06937041B2
公开(公告)日：2005-08-30
申请号：US10789996
申请日：2004-03-02
申请人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
发明人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
IPC分类号： G01R1/06 , H01J9/02 , G01R31/02
CPC分类号： H01J9/02 , H01J2201/3165 , H01J2329/00 , Y10T29/49204
摘要： A probe for applying a voltage to lines provided on a substrate comprises (a) a conductive sheet, the conductive sheet including a mesh sheet in which linear members are woven into a mesh and a conductive material which coats the mesh sheet, (b) an elastic member for pressing the conductive sheet against the lines, and (c) a holding member for holding the conductive sheet and the elastic member together. The probe has improved electrical connectivity and durability, and achieves a reduction in size and facilitation of operations of an apparatus for manufacturing an electron source.
摘要翻译：用于对设置在基板上的线施加电压的探针包括（a）导电片，所述导电片包括网状片，所述网片将线状构件编织成网状物，以及涂覆网片的导电材料，（b）用于将导电片压靠在线上的弹性构件，以及（c）用于将导电片和弹性构件保持在一起的保持构件。探针具有改善的电连接性和耐久性，并且实现了用于制造电子源的装置的操作的尺寸的减小和便利化。

4. 发明授权

US06741087B2 Voltage-applying probe, apparatus for manufacturing electron source using the probe, and method for manufacturing electron source using the apparatus 失效
公开(公告)号：US06741087B2
公开(公告)日：2004-05-25
申请号：US10143783
申请日：2002-05-14
申请人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
发明人： Akihiro Kimura , Kazuhiro Oki , Shigeto Kamata
IPC分类号： G01R3102
CPC分类号： H01J9/02 , H01J2201/3165 , H01J2329/00 , Y10T29/49204
摘要： A probe for applying a voltage to lines provided on a substrate comprises (a) a conductive sheet, the conductive sheet including a mesh sheet in which linear members are woven into a mesh and a conductive material which coats the mesh sheet, (b) an elastic member for pressing the conductive sheet against the lines, and (c) a holding member for holding the conductive sheet and the elastic member together. The probe has improved electrical connectivity and durability, and achieves a reduction in size and facilitation of operations of an apparatus for manufacturing an electron source.

5. 发明申请

US20050127812A1 Electron source producing apparatus and method 失效
标题翻译：电子源产生装置及方法
公开(公告)号：US20050127812A1
公开(公告)日：2005-06-16
申请号：US11000986
申请日：2004-12-02
申请人： Kazumasa Takatsu , Shigeto Kamata
发明人： Kazumasa Takatsu , Shigeto Kamata
IPC分类号： C23C16/04 , C23C16/26 , C23C16/44 , H01J9/02 , H01J1/62 , H01J63/04
CPC分类号： C23C16/4412 , C23C16/04 , C23C16/26 , H01J9/027
摘要： An electron source producing apparatus for forming an electron-emission part on a conductive member disposed on a substrate in an atmosphere containing a desired gas. The apparatus includes a container for forming a hermetic atmosphere between the container and a surface of the substrate on which the conductive member is formed. The container has a gas inlet and a gas outlet. A diffusing member is for diffusing an introduced gas, and is disposed between the gas inlet and the surface of the substrate. A resisting member provides exhaust resistance, and is disposed between the gas outlet and the surface of the substrate and is separated from the gas outlet. The resisting member is disposed closer to the surface of the substrate than is the diffusing member.
摘要翻译：一种用于在包含所需气体的气氛中设置在基板上的导电部件上形成电子发射部分的电子源产生装置。该装置包括用于在容器和形成有导电构件的基板的表面之间形成密封气氛的容器。容器具有气体入口和气体出口。扩散构件用于扩散引入的气体，并且设置在气体入口和衬底的表面之间。抵抗构件提供排气阻力，并且设置在气体出口和基板的表面之间并与气体出口分离。抵抗构件比扩散构件更靠近衬底的表面设置。

6. 发明授权

US07445535B2 Electron source producing apparatus and method 失效
标题翻译：电子源产生装置及方法
公开(公告)号：US07445535B2
公开(公告)日：2008-11-04
申请号：US11000986
申请日：2004-12-02
申请人： Kazumasa Takatsu , Shigeto Kamata
发明人： Kazumasa Takatsu , Shigeto Kamata
IPC分类号： H01J9/00 , H01L21/00
CPC分类号： C23C16/4412 , C23C16/04 , C23C16/26 , H01J9/027
摘要： An electron source producing apparatus for forming an electron-emission part on a conductive member disposed on a substrate in an atmosphere containing a desired gas. The apparatus includes a container for forming a hermetic atmosphere between the container and a surface of the substrate on which the conductive member is formed. The container has a gas inlet and a gas outlet. A diffusing member is for diffusing an introduced gas, and is disposed between the gas inlet and the surface of the substrate. A resisting member provides exhaust resistance, and is disposed between the gas outlet and the surface of the substrate and is separated from the gas outlet. The resisting member is disposed closer to the surface of the substrate than is the diffusing member.
摘要翻译：一种用于在包含所需气体的气氛中设置在基板上的导电部件上形成电子发射部分的电子源产生装置。该装置包括用于在容器和形成有导电构件的基板的表面之间形成密封气氛的容器。容器具有气体入口和气体出口。扩散构件用于扩散引入的气体，并且设置在气体入口和衬底的表面之间。抵抗构件提供排气阻力，并且设置在气体出口和基板的表面之间并与气体出口分离。抵抗构件比扩散构件更靠近衬底的表面设置。

7. 发明申请

US20090205849A1 HERMETIC ENVELOPE AND IMAGE DISPLAY APPARATUS USING THE SAME 有权
标题翻译：使用它的HERMETIC ENVELOPE和IMAGE DISPLAY APPARATUS
公开(公告)号：US20090205849A1
公开(公告)日：2009-08-20
申请号：US12372287
申请日：2009-02-17
申请人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
发明人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
IPC分类号： H05K5/06
CPC分类号： H05K5/061
摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.
摘要翻译：密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置粘接部分。第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间部分。第二接合部位于比第一接合部更靠近内部空间的位置。

8. 发明授权

US08115391B2 Hermetic envelope and image display apparatus using the same 有权
标题翻译：密封信封和使用其的图像显示装置
公开(公告)号：US08115391B2
公开(公告)日：2012-02-14
申请号：US12372287
申请日：2009-02-17
申请人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
发明人： Akihiro Kimura , Masateru Yasuhara , Shigeto Kamata
IPC分类号： H01J17/16 , H01L33/00
CPC分类号： H05K5/061
摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.
摘要翻译：密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置粘接部分。第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间部分。第二接合部位于比第一接合部更靠近内部空间的位置。

9. 发明授权

US06962516B2 Voltage applying apparatus, and apparatus and method for manufacturing electron source 失效
标题翻译：电压施加装置，以及用于制造电子源的装置和方法
公开(公告)号：US06962516B2
公开(公告)日：2005-11-08
申请号：US10236983
申请日：2002-09-09
申请人： Kazuhiro Ohki , Shigeto Kamata , Akihiro Kimura
发明人： Kazuhiro Ohki , Shigeto Kamata , Akihiro Kimura
IPC分类号： H01J9/44 , H01J9/02 , H01J9/39 , H01J9/00 , H01J9/42
CPC分类号： H01J9/025 , H01J9/027
摘要： A voltage applying apparatus including a holder, a probe and the like as voltage applying means enabling the application of a voltage to electrode wiring connected with electric conductors formed on a substrate on which the electrode wiring is formed. The apparatus is equipped with aligning means making the position of the probe follow to the changes of the position of the electrode wiring to coincide with them. The aligning means makes the position of the probe follow the position of the electrode wiring so that the probe aligns the electrode wiring by the thermal expansion of the holder.
摘要翻译：一种电压施加装置，包括保持器，探针等作为电压施加装置，其能够施加与形成在其上形成有电极布线的基板上的电导体连接的电极布线的电压。该装置配备有对准装置，使得探针的位置跟随电极布线的位置的变化与它们重合。对准装置使探针的位置跟随电极布线的位置，使得探针通过保持器的热膨胀来对准电极布线。

10. 发明申请

US20050074230A1 Thermal treatment equipment, thermal treatment method and manufacturing method of image display apparatus 有权
标题翻译：热处理设备，图像显示装置的热处理方法和制造方法
公开(公告)号：US20050074230A1
公开(公告)日：2005-04-07
申请号：US10944760
申请日：2004-09-21
申请人： Shigeto Kamata , Akihiro Kimura
发明人： Shigeto Kamata , Akihiro Kimura
IPC分类号： H01L21/00 , B05D5/12 , F21V7/00 , G02B17/00
CPC分类号： H01L21/67109
摘要： In an apparatus for performing heating treatment of a structure composed of a substrate and a structure arranged on the front surface of the substrate, the latter structure having thermal capacity smaller than that of the substrate, heaters are arranged to be opposed to the front surface and the back surface of the substrate, respectively, and a cooling body is arranged at a position opposed to the back surface of the substrate to sandwich the heater of the back surface between the cooling body and the substrate. Thereby, the heating and the cooling of the substrate are performed rapidly to shorten the time of a heating process, and the deformation and the damage of the substrate at the time of heating are prevented.
摘要翻译：在用于对由基板和布置在基板的前表面上的结构构成的结构进行加热处理的装置中，后者结构的热容量小于基板的热容量，加热器布置成与前表面相对，基板的背面和冷却体配置在与基板的背面相对的位置，将背面的加热器夹在冷却体与基板之间。因此，快速地进行基板的加热和冷却，缩短加热处理的时间，并且防止加热时的基板的变形和损坏。

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