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    • 5. 发明申请
    • Method of manufacturing an organic electronic device
    • 制造有机电子器件的方法
    • US20070048895A1
    • 2007-03-01
    • US11341799
    • 2006-01-27
    • Mitsuru SuginoyaShuhei YamamotoMasayuki Suda
    • Mitsuru SuginoyaShuhei YamamotoMasayuki Suda
    • H01L51/40
    • H01L51/5253H01L51/524H01L2251/5338
    • An organic electronic device using an extremely thin substrate is manufactured by a simple and easy method. That is, according to the method of manufacturing the organic electronic device of the present invention, a first surface of a substrate is subjected to polishing, a protective layer is provided on the first surface, and a second surface on the back side of the first surface of the substrate is removed through etching to reduce the thickness of the substrate. As a result, the extremely thin substrate may be formed. Two extremely thin substrates manufactured through the above process are arranged such that etching surfaces thereof are opposed to each other. Then, the two substrates are bonded to each other so as to hold a layer containing a polymer material therebetween. Thereafter, the protective layer is removed. Accordingly, the organic electronic device is formed on the first surface from which the protective layer has been removed.
    • 使用极薄的基板的有机电子器件通过简单且容易的方法制造。 也就是说,根据本发明的有机电子器件的制造方法,对衬底的第一表面进行抛光,在第一表面上设置保护层,在第一表面的背面设置第二表面 通过蚀刻去除衬底的表面以减小衬底的厚度。 结果,可以形成极薄的衬底。 通过上述工艺制造的两个非常薄的基板被布置成使得其蚀刻表面彼此相对。 然后,将两个基板彼此接合,以便在其间保持包含聚合物材料的层。 之后,除去保护层。 因此,有机电子器件形成在已被去除保护层的第一表面上。
    • 6. 发明申请
    • Manufacturing method for organic electronic device
    • 有机电子器件的制造方法
    • US20060037934A1
    • 2006-02-23
    • US11196098
    • 2005-08-03
    • Mitsuru SuginoyaMasayuki SudaShuhei Yamamoto
    • Mitsuru SuginoyaMasayuki SudaShuhei Yamamoto
    • H01B13/00
    • H01L51/5253H01L51/5246
    • A manufacturing method permits easy manufacture of an organic electronic device using an extremely thin substrate. The manufacturing method includes a first step for polishing a first surface of a substrate, a second step for providing a protective polymeric layer on the first surface, a third step for etching a second surface on the back side of the first surface of the substrate to make the substrate thinner, a fourth step for providing a polymeric layer that contains a polymeric material on the etched second surface, a fifth step for removing the protective polymeric layer, and a sixth step for forming an organic electronic device on the first surface from which the protective polymeric layer has been removed.
    • 制造方法允许使用非常薄的衬底容易地制造有机电子器件。 该制造方法包括用于研磨基板的第一表面的第一步骤,用于在第一表面上提供保护性聚合物层的第二步骤,用于蚀刻基板的第一表面的背面上的第二表面的第三步骤, 使基材更薄,第四步是提供在蚀刻的第二表面上含有聚合材料的聚合物层,用于除去保护性聚合物层的第五步骤,以及在第一表面上形成有机电子器件的第六步骤, 保护性聚合物层已被去除。