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    • 5. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08405159B2
    • 2013-03-26
    • US13234536
    • 2011-09-16
    • Kanna AdachiShigeru KawanakaSatoshi Inaba
    • Kanna AdachiShigeru KawanakaSatoshi Inaba
    • H01L27/088
    • H01L27/1104H01L27/11H01L29/4238
    • In accordance with an embodiment, a semiconductor device includes an SRAM cell on a substrate. The SRAM cell includes: first and second load transistors each having an n-type source region and a p-type drain region, first and second driver transistors each having a p-type source region and an n-type drain region, and first and second transfer transistors each having an n-type source region and a n-type drain region. The n-type source regions of the first and second load transistors, the n-type drain regions of the first and second driver transistors, and the n-type source regions and the n-type drain regions of the first and second transfer transistors are located in a region other than a region present between any two of the p-type drain regions of the first and second load transistors and the p-type source regions of the first and second driver transistors.
    • 根据实施例,半导体器件在衬底上包括SRAM单元。 SRAM单元包括:具有n型源极区域和p型漏极区域的第一和第二负载晶体管,每个具有p型源极区域和n型漏极区域的第一和第二驱动器晶体管,以及第一和第二负极晶体管, 第二传输晶体管,每个具有n型源极区和n型漏极区。 第一和第二负载晶体管的n型源极区域,第一和第二驱动晶体管的n型漏极区域以及第一和第二转移晶体管的n型源极区域和n型漏极区域是 位于除了存在于第一和第二负载晶体管的任何两个p型漏极区域之间的区域以及第一和第二驱动器晶体管的p型源极区域之外的区域中。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120228706A1
    • 2012-09-13
    • US13358643
    • 2012-01-26
    • Emiko SugizakiShigeru KawanakaKanna Adachi
    • Emiko SugizakiShigeru KawanakaKanna Adachi
    • H01L29/78
    • H01L29/7391H01L29/0657H01L29/42312
    • A memory includes a semiconductor layer, a gate insulating film on the semiconductor layer, and a gate electrode on the gate insulating film. A first channel region of a first conductivity type is provided on a surface of the semiconductor layer below the gate insulating film. A diffusion layer of a second conductivity type is provided below the first channel region in the semiconductor layer. The diffusion layer contacts a bottom of the first channel region in a direction substantially vertical to a surface of the semiconductor layer. The diffusion layer forms a PN junction with the bottom of the first channel region. A drain of a first conductivity type and a source of a second conductivity type are provided on a side and another side of the first channel region. A sidewall film covers a side surface of the first channel region on a side of the diffusion layer.
    • 存储器包括半导体层,半导体层上的栅极绝缘膜和栅极绝缘膜上的栅电极。 第一导电类型的第一沟道区设置在栅极绝缘膜下方的半导体层的表面上。 第二导电类型的扩散层设置在半导体层中的第一沟道区的下方。 扩散层在与半导体层的表面大致垂直的方向上接触第一沟道区的底部。 扩散层与第一通道区域的底部形成PN结。 第一导电类型的漏极和第二导电类型的源极设置在第一沟道区的一侧和另一侧。 侧壁膜覆盖扩散层侧的第一沟道区域的侧表面。
    • 7. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120091537A1
    • 2012-04-19
    • US13234536
    • 2011-09-16
    • Kanna AdachiShigeru KawanakaSatoshi Inaba
    • Kanna AdachiShigeru KawanakaSatoshi Inaba
    • H01L27/11
    • H01L27/1104H01L27/11H01L29/4238
    • In accordance with an embodiment, a semiconductor device includes an SRAM cell on a substrate. The SRAM cell includes: first and second load transistors each having an n-type source region and a p-type drain region, first and second driver transistors each having a p-type source region and an n-type drain region, and first and second transfer transistors each having an n-type source region and a n-type drain region. The n-type source regions of the first and second load transistors, the n-type drain regions of the first and second driver transistors, and the n-type source regions and the n-type drain regions of the first and second transfer transistors are located in a region other than a region present between any two of the p-type drain regions of the first and second load transistors and the p-type source regions of the first and second driver transistors.
    • 根据实施例,半导体器件在衬底上包括SRAM单元。 SRAM单元包括:具有n型源极区域和p型漏极区域的第一和第二负载晶体管,每个具有p型源极区域和n型漏极区域的第一和第二驱动器晶体管,以及第一和第二负极晶体管, 第二传输晶体管,每个具有n型源极区和n型漏极区。 第一和第二负载晶体管的n型源极区域,第一和第二驱动晶体管的n型漏极区域以及第一和第二转移晶体管的n型源极区域和n型漏极区域是 位于除了存在于第一和第二负载晶体管的任何两个p型漏极区域之间的区域以及第一和第二驱动器晶体管的p型源极区域之外的区域中。
    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09041104B2
    • 2015-05-26
    • US13358643
    • 2012-01-26
    • Emiko SugizakiShigeru KawanakaKanna Adachi
    • Emiko SugizakiShigeru KawanakaKanna Adachi
    • H01L29/78H01L29/739H01L29/06H01L29/423
    • H01L29/7391H01L29/0657H01L29/42312
    • A memory includes a semiconductor layer, a gate insulating film on the semiconductor layer, and a gate electrode on the gate insulating film. A first channel region of a first conductivity type is provided on a surface of the semiconductor layer below the gate insulating film. A diffusion layer of a second conductivity type is provided below the first channel region in the semiconductor layer. The diffusion layer contacts a bottom of the first channel region in a direction substantially vertical to a surface of the semiconductor layer. The diffusion layer forms a PN junction with the bottom of the first channel region. A drain of a first conductivity type and a source of a second conductivity type are provided on a side and another side of the first channel region. A sidewall film covers a side surface of the first channel region on a side of the diffusion layer.
    • 存储器包括半导体层,半导体层上的栅极绝缘膜和栅极绝缘膜上的栅电极。 第一导电类型的第一沟道区设置在栅极绝缘膜下方的半导体层的表面上。 第二导电类型的扩散层设置在半导体层中的第一沟道区的下方。 扩散层在与半导体层的表面大致垂直的方向上接触第一沟道区的底部。 扩散层与第一通道区域的底部形成PN结。 第一导电类型的漏极和第二导电类型的源极设置在第一沟道区的一侧和另一侧。 侧壁膜覆盖扩散层侧的第一沟道区域的侧表面。
    • 9. 发明申请
    • SPIN TRANSISTOR AND INTEGRATED CIRCUIT
    • 旋转晶体管和集成电路
    • US20110284938A1
    • 2011-11-24
    • US13053399
    • 2011-03-22
    • Shigeru KawanakaKanna AdachiYoshiyuki Kondo
    • Shigeru KawanakaKanna AdachiYoshiyuki Kondo
    • H01L29/82
    • H01L29/66984G11C11/16H01F10/1936
    • A spin transistor according to an embodiment includes: a first magnetic region supplying a first polarized signal polarized in a first magnetization direction in accordance with a first input signal; a second magnetic region supplying a second polarized signal polarized in a second magnetization direction opposite from the first magnetization direction in accordance with a second input signal, the second input signal being different from the first input signal; and a third magnetic region outputting the first polarized signal supplied from the first magnetic region in accordance with a third input signal, and outputting the second polarized signal supplied from the second magnetic region in accordance with a fourth input signal different from the third input signal.
    • 根据实施例的自旋晶体管包括:第一磁区,根据第一输入信号提供沿第一磁化方向偏振的第一偏振信号; 第二磁区,根据第二输入信号,提供沿与第一磁化方向相反的第二磁化方向偏振的第二极化信号,第二输入信号不同于第一输入信号; 以及第三磁区,根据第三输入信号输出从第一磁区提供的第一极化信号,并根据与第三输入信号不同的第四输入信号输出从第二磁区提供的第二极化信号。
    • 10. 发明申请
    • Semiconductor memory device and its manufacturing method
    • US20060157738A1
    • 2006-07-20
    • US11369041
    • 2006-03-07
    • Shigeru Kawanaka
    • Shigeru Kawanaka
    • H01L27/10
    • H01L21/84G11C11/405H01L27/108H01L27/11H01L27/1203H01L29/7841
    • According to one aspect of the present invention, a semiconductor memory device has: a semiconductor layer formed on an insulating film; and a memory cell array including a matrix arrangement of a plurality of memory cells each made up of first and second transistors connected in series, one side of each memory cell being connected to a bit line and the other side of each memory cell being supplied with a reference potential, and according to another aspect of the present invention, a semiconductor memory device manufacturing method includes: forming an oxide layer and a silicon active layer on a semiconductor substrate; forming an element isolation region for separating said silicon active layer into discrete element-forming regions to be substantially flush with said silicon active layer; forming gate electrode of paired two transistors by depositing a gate electrode material on said silicon active layer and patterning it; injecting predetermined ions into a region for forming a diffusion layer in, using said gate electrodes as an ion injection mask; forming said paired transistors by activating the injected ions through a heat process; and forming a first gate line connected to the gate electrode of one of said paired transistors and a second gate line connected to the gate electrode of the other of said paired transistors.