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1. 发明授权

US5568264A Exterior view inspecting apparatus for circuit board 失效
标题翻译：电路板外观检查装置
公开(公告)号：US5568264A
公开(公告)日：1996-10-22
申请号：US515624
申请日：1995-08-16
申请人： Shigeki Nakatsuka , Iwao Ichikawa , Manabu Morioka , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kazuhiro Shiga
发明人： Shigeki Nakatsuka , Iwao Ichikawa , Manabu Morioka , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kazuhiro Shiga
IPC分类号： B23P21/00 , G06T1/00 , H05K13/08 , G01B11/00
CPC分类号： H05K13/08
摘要： The exterior view inspecting apparatus for circuit board of the invention including a sensor unit for emitting a laser beam to an object to be inspected, and detecting the displacement of the object by focusing the reflected light on a photoelectric transducer by using a receiving lens; an optical path converter unit for refracting the optical path of the laser beam; a sensor head unit incorporating the sensor unit and optical path converter unit; a control unit for moving the sensor head unit along a specified scanning route; a correction unit for correcting the displacement data of the object to be inspected as detected by the sensor unit, and a judging unit for judging the existence and position of an electronic component on a circuit board from the corrected displacement data. The optical path converter unit includes a flat sheet glass inclined relative to the optical path of the laser beam, rotating about the axial center parallel to the optical path. By this optical path converter unit, the optical path of the laser beam is refracted so that the laser beam scans the circuit board drawing a small circular trace. As the trace draws a small circle, the trace detects the end portion of the electronic component on the circuit board multiple times. Consequently, the existence and position of the electronic component on the circuit board can be detected accurately.
摘要翻译：本发明的电路板外观检查装置包括：用于向待检查物体发射激光束的传感器单元，以及通过使用接收透镜将反射光聚焦在光电变换器上来检测物体的位移; 用于折射激光束的光路的光路转换器单元; 包括传感器单元和光路转换器单元的传感器头单元; 控制单元，用于沿着指定的扫描路线移动所述传感器头单元; 校正单元，用于校正由传感器单元检测到的待检查对象的位移数据;以及判断单元，用于根据校正的位移数据判断电路板上的电子部件的存在和位置。光路转换器单元包括相对于激光束的光路倾斜的平板玻璃，围绕平行于光路的轴向中心旋转。通过该光路转换器单元，激光束的光路被折射，使得激光束扫描电路板，绘制小的圆形迹线。轨迹绘制小圆时，轨迹会多次检测电路板上电子元件的端部。因此，可以精确地检测电子部件在电路板上的存在和位置。

2. 发明授权

US4336872A Apparatus for transferring parts or the like 失效
标题翻译：用于传送零件等的装置
公开(公告)号：US4336872A
公开(公告)日：1982-06-29
申请号：US145720
申请日：1980-05-01
申请人： Teruyoshi Noda , Iwao Ichikawa , Toshio Takahashi
发明人： Teruyoshi Noda , Iwao Ichikawa , Toshio Takahashi
IPC分类号： B65G11/10 , B29C67/00 , B65G11/02 , B65G11/16 , B65G11/18 , B65G11/20 , B65G51/18 , H05K13/04 , B65G11/00
CPC分类号： B65G11/023 , B29C53/086 , B29C67/0014 , H05K13/0482 , B29L2023/22 , B29L2031/003 , B29L2031/772 , Y10S138/11 , Y10T29/49133
摘要： Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a prepositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.
摘要翻译：无铅电子部件等在重力作用下从料斗转移，或通过强制空气通过多边形横截面的管道转移到预定位模板。转移管的多边形横截面倾向于消除部件的振荡运动并加速它们穿过管的行进。每个多边形，优选三角形的管优选通过使成形机中的圆形截面的管变形而获得，该成形机包括多个盘，所述成形机布置成使得它们的周边在其间限定圆形横截面的管被驱动的多边形空间。

3. 发明授权

US5787191A Wiring pattern inspection apparatus for printed circuit board 失效
公开(公告)号：US5787191A
公开(公告)日：1998-07-28
申请号：US467442
申请日：1995-06-06
申请人： Hideaki Kawamura , Atsuharu Yamamoto , Yuji Maruyama , Hidehiko Kawakami , Katsuhiro Kondoh , Iwao Ichikawa
发明人： Hideaki Kawamura , Atsuharu Yamamoto , Yuji Maruyama , Hidehiko Kawakami , Katsuhiro Kondoh , Iwao Ichikawa
IPC分类号： G01R31/309 , G06T7/00 , G06K9/36 , G06K9/00 , G06K9/40
CPC分类号： G06T7/0004 , G01R31/309 , G06T7/0006 , G06T2207/20044 , G06T2207/20144 , G06T2207/30141
摘要： A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.

4. 发明授权

US4451324A Apparatus for placing chip type circuit elements on a board 失效
标题翻译：将芯片型电路元件放置在电路板上的装置
公开(公告)号：US4451324A
公开(公告)日：1984-05-29
申请号：US135668
申请日：1980-03-31
申请人： Iwao Ichikawa , Kenichiro Kaimori
发明人： Iwao Ichikawa , Kenichiro Kaimori
IPC分类号： H05K13/04 , B32B31/00
CPC分类号： H05K13/0482 , Y10T156/1092 , Y10T156/1754 , Y10T156/1756 , Y10T156/1759 , Y10T156/1776 , Y10T29/4913 , Y10T29/49133 , Y10T29/5317 , Y10T29/53174 , Y10T29/53178 , Y10T29/53252 , Y10T29/53261
摘要： An apparatus for locating chip type circuit elements on a printed circuit board includes an accommodating assembly for temporarily storing said circuit elements supplied from hoppers, a movable shutter placed under the accommodating assembly, and which supports and rotates circuit elements within the accommodating assembly, and a template placed under the shutter to receive the circuit elements dropped from the accommodating assembly when the shutter is removed laterally from under the accommodating assembly.
摘要翻译：用于在印刷电路板上定位芯片型电路元件的装置包括用于临时存储从料斗供应的所述电路元件的容纳组件，放置在容纳组件下方的可移动快门，并且在容纳组件内支撑和旋转电路元件，放置在快门下方的模板，用于当从快速收容组件的下方横向移除挡板时，容纳从容纳组件落下的电路元件。

5. 发明授权

US06618135B2 Laser beam inspection apparatus 失效
标题翻译：激光束检测仪
公开(公告)号：US06618135B2
公开(公告)日：2003-09-09
申请号：US09726596
申请日：2000-12-01
申请人： Iwao Ichikawa
发明人： Iwao Ichikawa
IPC分类号： G01J328
CPC分类号： G01N21/95684
摘要： A laser beams inspection apparatus suitable for inspecting electronic components such as ICs mounted on a substrate. The inspection apparatus includes a scan mechanism. The scan mechanism works to move a laser beam emitted from a laser emitter to scan a target one of electronic components in a given scan range. The scan mechanism is designed to change orientation of emission of the laser beam to change the scan range as a function of the type (e.g., the size) of the target electronic component, thereby minimizing inspection errors regardless of the type of the electronic components to be inspected.
摘要翻译：适用于检查安装在基板上的IC等电子部件的激光束检查装置。检查装置包括扫描机构。扫描机构用于移动从激光发射器发射的激光束，以扫描给定扫描范围内的目标电子部件。扫描机构被设计成改变激光束的发射方向以根据目标电子部件的类型（例如，尺寸）来改变扫描范围，从而最小化检查错误，而不管电子部件的类型如何被检查。

6. 发明申请

US20080248193A1 Viscous Fluid Application Device 审中-公开
标题翻译：粘性流体应用装置
公开(公告)号：US20080248193A1
公开(公告)日：2008-10-09
申请号：US11547261
申请日：2005-04-04
申请人： Hachiroh Nakatsuji , Akira Ilzuka , Iwao Ichikawa , Akira Kabeshita , Kenji Okamoto
发明人： Hachiroh Nakatsuji , Akira Ilzuka , Iwao Ichikawa , Akira Kabeshita , Kenji Okamoto
IPC分类号： B05D1/26 , B05C5/00 , B05D1/40 , H01L21/56
CPC分类号： B05C11/1002 , H01L2224/73253 , H01L2924/16152
摘要： The present invention aims to provide a viscous fluid application device which allows improving manufacturing efficiency of semiconductor packages without deteriorating application position accuracy and decreasing designing flexibility. The device includes: an application unit (101) which applies viscous fluid to a substrate 140a; an application head (100) having a supply unit (102) which supplies the viscous fluid to the application unit (101); an X axis unit (110); a Y axis unit (120); a Z axis unit (130); a substrate carrying unit (140); a head height detection sensor (150); and a control unit (160). The supply unit (102) moves in the Y direction in cooperation with a movement in the Y direction of the application unit (101), and remains unmoved irrespective of a movement in the X and Z direction of the application unit (101).
摘要翻译：本发明旨在提供一种粘性流体施加装置，其能够提高半导体封装的制造效率，而不会降低施加位置精度并降低设计灵活性。该装置包括：施加单元（101），其将粘性流体施加到基底140a; 具有供应单元（102）的应用头（100），所述供应单元将粘性流体供应到施用单元（101）; X轴单元（110）; Y轴单元（120）; Z轴单元（130）; 衬底承载单元（140）; 头部高度检测传感器（150）; 和控制单元（160）。供给单元（102）与应用单元（101）的Y方向的移动一起在Y方向上移动，并且与施加单元（101）的X和Z方向上的移动无关地保持不动。

7. 发明申请

US20080021194A1 Method for Treating Extremely Small Particles of Polyethylene Terephthalate 失效
标题翻译：用于处理聚对苯二甲酸乙二酯的极小颗粒的方法
公开(公告)号：US20080021194A1
公开(公告)日：2008-01-24
申请号：US10547261
申请日：2005-08-09
申请人： Hachiroh W. Nakatsuji , Akira Iizuka , Iwao Ichikawa , Akira Kabeshita , Kenji Okamoto
发明人： Hachiroh W. Nakatsuji , Akira Iizuka , Iwao Ichikawa , Akira Kabeshita , Kenji Okamoto
IPC分类号： C08F6/18
CPC分类号： B29B9/06 , B29B17/0036 , B29B2009/125 , B29K2067/00 , Y02W30/62
摘要： A method for treating extremely small particles of recycled polyethylene terephthalate comprises providing a quantity of RPET particles having an average mean particle size ranging from about 0.0005 inch to about 0.05 inch in diameter, heating the RPET particles to a temperature sufficient to cause at least a portion of the RPET particles to adhere to one another, and forming the adhered RPET particles into pellets, said pellets having substantially the same average surface-to-volume ratio as the bulk, un-adhered RPET particles.
摘要翻译：用于处理再循环的聚对苯二甲酸乙二酯的极小颗粒的方法包括提供一定量的平均粒度范围为约0.0005英寸至约0.05英寸直径的RPET颗粒，将RPET颗粒加热到足以使至少一部分的RPET颗粒彼此粘合，并且将粘附的RPET颗粒形成颗粒，所述颗粒具有与块状未附着的RPET颗粒基本相同的平均表面 - 体积比。

8. 发明授权

US5698068A Thermocompression bonding equipment 失效
标题翻译：热压粘合设备
公开(公告)号：US5698068A
公开(公告)日：1997-12-16
申请号：US429695
申请日：1995-04-27
申请人： Iwao Ichikawa , Norio Kawatani , Kazuaki Suzuki , Yukio Yamada
发明人： Iwao Ichikawa , Norio Kawatani , Kazuaki Suzuki , Yukio Yamada
IPC分类号： H01R43/00 , B29C65/00 , B29C65/18 , G02F1/1345 , H01R43/02 , H05K3/32 , B30B15/34
CPC分类号： B29C65/18 , B29C65/305 , B29C66/80 , B29C66/81427 , B29C66/8167 , B29C66/8322 , B29C66/836
摘要： This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.
摘要翻译：本发明提供一种热压接设备，当要被接合的材料被改变时，允许容易地更换和制备压接头，减少更换所需的工作时间并制备压接头，并且简化了压接头。热压接设备设置有头单元20，头单元20包括基座10，热压接头56和用于滑动设置在基座10上的热压接头56的滑动机构50，独立于头单元构造的按压装置30，用于按压滑动机构50以滑动热压接头56，从而热压接ACF，LCD和TAB的材料，以及设置有用于定位基座10的定位装置40,41的基架40。

9. 发明授权

US5459795A Wiring pattern inspection apparatus for printed circuit board 失效
标题翻译：印刷电路板接线图案检测装置
公开(公告)号：US5459795A
公开(公告)日：1995-10-17
申请号：US219759
申请日：1994-03-29
申请人： Hideaki Kawamura , Atsuharu Yamamoto , Yuji Maruyama , Hidehiko Kawakami , Katsuhiro Kondoh , Iwao Ichikawa
发明人： Hideaki Kawamura , Atsuharu Yamamoto , Yuji Maruyama , Hidehiko Kawakami , Katsuhiro Kondoh , Iwao Ichikawa
IPC分类号： G01R31/309 , G06T7/00 , G06K9/00
CPC分类号： G06T7/0004 , G01R31/309 , G06T7/0006 , G06T2207/20044 , G06T2207/20144 , G06T2207/30141
摘要： A wiring pattern inspection apparatus for inspecting an abnormality of a wiring pattern formed on a printed circuit board, which is equipped with an optical image pickup device for optically illuminating a surface of the printed circuit board including the wiring pattern to photoelectrically convert optical information of the printed circuit board surface due to the optical illumination into a grey level image. This grey level image is converted into a bi-level image which separates the grey level image into the wiring pattern side and a background side of the wiring pattern. Thereafter, the bi-level image is once contracted by a first size and then expanded by a second size so as to eliminate a micro conductive portion left on the printed circuit board or a micro pinhole which can be disregarded in the abnormality inspection, thereby preventing the excessive detection.
摘要翻译：一种用于检查形成在印刷电路板上的布线图案的异常的布线图形检查装置，其配备有用于光学照射包括布线图案的印刷电路板的表面的光学图像拾取装置，以光电转换印刷电路板表面由于光学照明而成为灰度图像。该灰度图像被转换成将灰度级图像分离成布线图案侧和布线图案的背景侧的双电平图像。此后，双层图像一次收缩第一尺寸，然后扩大第二尺寸，以消除留在印刷电路板上的微导电部分或在异常检查中可忽略的微针孔，从而防止过度检测。

10. 发明授权

US5439161A Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device 失效
标题翻译：热压接合装置，热压接法及制造液晶显示装置的工序
公开(公告)号：US5439161A
公开(公告)日：1995-08-08
申请号：US301389
申请日：1994-09-07
申请人： Norio Kawatani , Iwao Ichikawa , Kazuaki Suzuki , Yukio Yamada
发明人： Norio Kawatani , Iwao Ichikawa , Kazuaki Suzuki , Yukio Yamada
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/00 , H01L21/603
CPC分类号： H01L21/67138 , H01L24/80 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14
摘要： A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.
摘要翻译：一种热压接装置，其中通过热压接可以高精度地连接对象部分，并且整个装置不会由于高压而容易地变形，并且可以以高度的细度将大尺寸的部件连接在一起准确性。热压接装置被构造成通过热压接将第一构件结合到第二构件，并且包括基座构件，用于将第二构件保持在其上的保持装置，用于向第一构件施加热量的发热元件，以及加压构件，用于将发热元件按压在第一构件和第二构件上。保持装置，发热元件和加压构件与基座构件分开设置。还公开了使用热压接装置进行的热压接方法和制造液晶显示装置的方法。

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