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    • 3. 发明授权
    • Packaging cushion device having modular cushion units
    • 包装缓冲装置具有模块化缓冲单元
    • US07604125B2
    • 2009-10-20
    • US11894868
    • 2007-08-21
    • Sheng-Hsiung ChengTe-An LinWu-Nan WangChia-Chia Huang
    • Sheng-Hsiung ChengTe-An LinWu-Nan WangChia-Chia Huang
    • B65D81/02B65D85/30
    • B65D81/056B65D2585/6837
    • In a packaging cushion device, a base member has a base wall, and first and second sidewalls respectively perpendicular to two adjacent edges of the base wall. The base wall and first and second sidewalls define a receiving portion. A modular component has a base panel, two adjacent first and second side panels perpendicular to the base panel, a first projection extending from the first and second side panels, and a second projection extending from the base panel and the second panel. The first and second projections are matchable with and connectable to the receiving portion to form two interchangeable configurations of different heights, thereby satisfying the need of packing a computer housing in either folded or unfolded configuration, and saving packing materials.
    • 在包装缓冲装置中,基部构件具有底壁,并且第一和第二侧壁分别垂直于基壁的两个相邻边缘。 基壁和第一和第二侧壁限定接收部分。 模块化部件具有基板,垂直于基板的两个相邻的第一和第二侧板,从第一和第二侧板延伸的第一突出部,以及从基板和第二板延伸的第二突起。 第一和第二突起与接收部分匹配并可连接以形成不同高度的两个可互换配置,从而满足将折叠或展开配置中的计算机外壳包装的需要,并节省包装材料。
    • 7. 发明申请
    • Double housing mutually stacking structure
    • 双层双层堆叠结构
    • US20090059503A1
    • 2009-03-05
    • US11896280
    • 2007-08-30
    • Sheng-Hsiung ChengTe-An LinWu-Nan WangChia-Chia Huang
    • Sheng-Hsiung ChengTe-An LinWu-Nan WangChia-Chia Huang
    • G06F1/18
    • G06F1/181
    • A double housing mutually stacking structure comprises first and second housing. The first and second housing are respectively constituted at least by first and second motherboard blocking walls, first and second front walls, first and second rear walls, a first upper cover and a second lower cover. When the housing is packed, the first front wall is propped against an outer side of the second rear wall, the second front wall is propped against an outer side of the first rear wall, the first upper cover is propped against upper edges of the second rear wall and the second motherboard blocking wall, and the second lower cover is propped against lower edges of the first rear wall and the first motherboard blocking wall to cause the first and the second housing to be mutually stacked to be close to the volume of one housing to be transported.
    • 双壳体相互堆叠结构包括第一和第二壳体。 第一和第二壳体分别至少由第一和第二母板阻挡壁,第一和第二前壁,第一和第二后壁,第一上盖和第二下盖构成。 当壳体被包装时,第一前壁支撑在第二后壁的外侧上,第二前壁抵靠第一后壁的外侧支撑,第一上盖支撑在第二后壁的上边缘 后壁和第二母板阻挡壁,并且第二下盖被支撑在第一后壁和第一母板阻挡壁的下边缘上,以使第一和第二壳体相互堆叠成接近于一个的体积 待运输的住房。