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1. 发明授权

US08135207B2 Optical inspection tools featuring parallel post-inspection analysis 有权
标题翻译：光学检测工具具有并行后检查分析
公开(公告)号：US08135207B2
公开(公告)日：2012-03-13
申请号：US12145701
申请日：2008-06-25
申请人： Shai Silberstein , Tsafrir Avni
发明人： Shai Silberstein , Tsafrir Avni
IPC分类号： G06K9/00 , G01N21/88
CPC分类号： G06K9/03 , G01N21/9501 , G06T7/0006 , G06T2207/30148
摘要： An optical inspection tool can automatically perform analysis/operations after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.
摘要翻译：光学检查工具可以在工具从诸如半导体晶片的对象的检查运行中产生识别缺陷（例如，缺陷列表）的数据之后，自动执行分析/操作。该工具可以将检查后任务与执行检查运行脱钩，以便在进行另一次检查运行时，对先前检查运行中的缺陷数据执行一个或多个检查后任务。这可以显着提高多次检查时刀具的生产量，因为检查运行时间有效缩短，仅包括工具实际用于获取缺陷数据的时间。可以执行一个或多个后检查任务，包括但不限于合并检查运行，删除重复缺陷，去除直线虚警和表征缺陷。

2. 发明申请

US20090323052A1 Dynamic Illumination in Optical Inspection Systems 有权
标题翻译：光学检测系统中的动态照明
公开(公告)号：US20090323052A1
公开(公告)日：2009-12-31
申请号：US12145708
申请日：2008-06-25
申请人： Shai Silberstein , Tsafrir Avni
发明人： Shai Silberstein , Tsafrir Avni
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/9503 , G01N21/95607 , G01N21/95623 , G01N2021/8825 , G01N2201/067 , G01N2201/0675 , G01N2201/0697 , G01N2201/1241
摘要： An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.
摘要翻译：光学检查系统或工具可以被配置为使用动态照明来检查物体，其中调整照明的一个或多个特征以满足不同区域的检查需要。例如，当工具检查晶片管芯中的存储器区域和外围特征时，可以增加或减小照明强度。在一些实施例中，调整可以基于在预检查设置顺序期间获得的数据，其中基于具有变化特性的照明拍摄的图像被评估为在检查过程的其余部分中的适用性。

3. 发明授权

US07973921B2 Dynamic illumination in optical inspection systems 有权
标题翻译：光学检测系统中的动态照明
公开(公告)号：US07973921B2
公开(公告)日：2011-07-05
申请号：US12145708
申请日：2008-06-25
申请人： Shai Silberstein , Tsafrir Avni
发明人： Shai Silberstein , Tsafrir Avni
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/9503 , G01N21/95607 , G01N21/95623 , G01N2021/8825 , G01N2201/067 , G01N2201/0675 , G01N2201/0697 , G01N2201/1241
摘要： An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.
摘要翻译：光学检查系统或工具可以被配置为使用动态照明来检查物体，其中调整照明的一个或多个特征以满足不同区域的检查需要。例如，当工具检查晶片管芯中的存储器区域和外围特征时，可以增加或减小照明强度。在一些实施例中，调整可以基于在预检查设置顺序期间获得的数据，其中基于具有变化特性的照明拍摄的图像被评估为在检查过程的其余部分中的适用性。

4. 发明申请

US20090324057A1 Optical Inspection Tools Featuring Parallel Post-Inspection Analysis 有权
标题翻译：具有平行检测分析的光学检测工具
公开(公告)号：US20090324057A1
公开(公告)日：2009-12-31
申请号：US12145701
申请日：2008-06-25
申请人： Shai Silberstein , Tsafrir Avni
发明人： Shai Silberstein , Tsafrir Avni
IPC分类号： G06K9/74
CPC分类号： G06K9/03 , G01N21/9501 , G06T7/0006 , G06T2207/30148
摘要： An optical inspection tool can automatically perform analysis/operations that after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.
摘要翻译：光学检查工具可以自动执行分析/操作，在工具已经从诸如半导体晶片的对象的检查运行中产生识别缺陷（例如缺陷列表）的数据之后。该工具可以将检查后任务与执行检查运行脱钩，以便在进行另一次检查运行时，对先前检查运行中的缺陷数据执行一个或多个检查后任务。这可以显着提高多次检查时刀具的生产量，因为检查运行时间有效缩短，仅包括工具实际用于获取缺陷数据的时间。可以执行一个或多个后检查任务，包括但不限于合并检查运行，删除重复缺陷，去除直线虚警和表征缺陷。

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