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1. 发明授权

US09405045B2 Optical apparatus 有权
标题翻译：光学仪器
公开(公告)号：US09405045B2
公开(公告)日：2016-08-02
申请号：US13210751
申请日：2011-08-16
申请人： Jeong-Yub Lee , Kyu-Dong Jung , Seung-Wan Lee , Woon-Bae Kim
发明人： Jeong-Yub Lee , Kyu-Dong Jung , Seung-Wan Lee , Woon-Bae Kim
IPC分类号： G02B1/06 , G02B3/14 , G02B7/02
CPC分类号： G02B3/14 , G02B7/028
摘要： An optical apparatus such as a varifocal fluidic lens is provided. Optical apparatus includes a spacer frame, optical fluid, an elastic membrane, an actuator, an actuator frame, and a thermally deformable frame. Spacer frame defines an internal space including a lens portion and a driving portion that connect to each other, and the driving portion is disposed to surround the lens portion disposed in the center area of the internal space. Optical fluid is filled in the internal space defined by the spacer frame. The elastic membrane is attached on a surface of the spacer frame, to cover a side of the internal space, and the thermally deformable plate is attached on the other surface of the spacer frame, to cover the other side of the internal space. The thermally deformable plate deforms to increase or decrease a volume of the internal space according to a change in temperature.
摘要翻译：提供了诸如变焦透镜的光学装置。光学装置包括间隔框架，光学流体，弹性膜，致动器，致动器框架和热变形框架。间隔框架限定了包括彼此连接的透镜部分和驱动部分的内部空间，并且驱动部分设置成围绕设置在内部空间的中心区域中的透镜部分。光学流体填充在由间隔框架限定的内部空间中。弹性膜附着在间隔框架的表面上以覆盖内部空间的一侧，并且热变形板附接在间隔框架的另一个表面上，以覆盖内部空间的另一侧。根据温度变化，热变形板变形以增加或减小内部空间的体积。

2. 发明授权

US08305699B2 Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module 有权
标题翻译：具有扩展景深的晶片级透镜模块和包括晶片级透镜模块的成像装置
公开(公告)号：US08305699B2
公开(公告)日：2012-11-06
申请号：US12873461
申请日：2010-09-01
申请人： Seung-Wan Lee , Woon-Bae Kim , Jeong-Yub Lee
发明人： Seung-Wan Lee , Woon-Bae Kim , Jeong-Yub Lee
IPC分类号： G02B9/00
CPC分类号： H04N5/2254 , G02B13/0035 , G02B13/0085 , H04N5/2257
摘要： A wafer-level lens module with an extended depth of field (EDF) and an imaging device including the wafer-level lens module are provided. The wafer-level EDF lens module includes a plurality of wafer-scale lenses stacked with fixed distances therebetween. The plurality of wafer-scale lenses includes an effective lens having a profile which satisfies a corrected optimized aspheric function, wherein a profile of a center region of the effective lens is optimized for an infinity-focused image and a profile of an edge region of the effective lens is optimized for a macro-focused image.
摘要翻译：提供具有扩展景深（EDF）的晶片级透镜模块和包括晶片级透镜模块的成像装置。晶片级EDF透镜模块包括在其间具有固定距离堆叠的多个晶片级透镜。多个晶片级透镜包括具有满足校正的优化非球面函数的轮廓的有效透镜，其中有效透镜的中心区域的轮廓对于无限远聚焦的图像和边缘区域的轮廓进行了优化有效镜头针对宏观聚焦图像进行了优化。

3. 发明授权

US08411366B2 Optical probe and optical system therefor 有权
标题翻译：光探头及其光学系统
公开(公告)号：US08411366B2
公开(公告)日：2013-04-02
申请号：US13101192
申请日：2011-05-05
申请人： Min-Seog Choi , Seung-Wan Lee , Woon-Bae Kim , Seung-Tae Choi
发明人： Min-Seog Choi , Seung-Wan Lee , Woon-Bae Kim , Seung-Tae Choi
IPC分类号： G02B27/30 , G02B26/08 , G02B1/06
CPC分类号： A61B5/0066 , A61B5/0084 , A61B5/02007 , G02B23/2484 , G02B27/0075
摘要： An optical probe and an optical system therefor are provided. The optical probe is includes a housing configured to house the optical system and the housing has a transparent window therein. the optical system includes a light emitting unit, a collimation lens, and a focusing lens. A numerical aperture of the optical system is adjustable by adjusting a pupil diameter of the collimation lens and a focal length of the focusing lens. The pupil diameter of the collimation lens is adjustable based on a variable focal lens or by adjusting a distance between the collimation lens and the light emitting unit.
摘要翻译：提供了一种光学探针及其光学系统。光学探针包括构造成容纳光学系统并且壳体在其中具有透明窗口的壳体。光学系统包括发光单元，准直透镜和聚焦透镜。通过调整准直透镜的光瞳直径和聚焦透镜的焦距来调节光学系统的数值孔径。准直透镜的瞳孔直径基于可变焦距透镜可调节或者通过调整准直透镜和发光单元之间的距离来调节。

4. 发明授权

US07528481B2 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US07528481B2
公开(公告)日：2009-05-05
申请号：US11491086
申请日：2006-07-24
申请人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
发明人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
IPC分类号： H01L23/12 , H01L23/10
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L23/04 , H01L2924/01079 , H01L2924/16235
摘要： A fabrication method of a wafer level packaging cap for covering a device wafer provided with a device thereon, includes forming an insulating layer on a wafer; removing a predetermined part of the insulating layer and exposing an upper surface of the wafer; forming a cap pad extending from an upper surface and the exposed surface of the wafer; forming a cavity on a lower surface of the wafer corresponding to the cap pad; etching a bottom surface of the cavity and exposing the cap pad which is connected to the wafer through the cavity; and forming metal lines extending from the lower surface of the wafer and the cavity, to electrically connect the cap pad which is exposed through the cavity.
摘要翻译：一种用于覆盖其上具有器件的器件晶片的晶片级封装帽的制造方法，包括在晶片上形成绝缘层; 去除所述绝缘层的预定部分并暴露所述晶片的上表面; 形成从所述晶片的上表面和所述暴露表面延伸的盖焊盘; 在与所述盖垫对应的所述晶片的下表面上形成空腔; 蚀刻空腔的底表面并暴露通过空腔连接到晶片的盖垫; 以及形成从所述晶片的下表面和所述腔延伸的金属线，以电连接通过所述空腔暴露的所述盖垫。

5. 发明申请

US20070264757A1 MICRO-PACKAGE, MULTI-STACK MICRO-PACKAGE, AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：微型封装，多层微封装及其制造方法
公开(公告)号：US20070264757A1
公开(公告)日：2007-11-15
申请号：US11782404
申请日：2007-07-24
申请人： Jong-oh KWON , Woon-Bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
发明人： Jong-oh KWON , Woon-Bae Kim , In-sang Song , Ji-hyuk Lim , Suk-jin Ham , Byung-gil Jeong
IPC分类号： H01L21/00
CPC分类号： H01L23/053 , B81C1/00269 , H01L23/055 , H01L23/10 , H01L23/147 , H01L23/49816 , H01L23/564 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/48 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/11831 , H01L2224/13025 , H01L2224/13099 , H01L2224/16 , H01L2224/2518 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/48463 , H01L2224/83851 , H01L2224/9202 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06586 , H01L2225/1035 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/30105 , H01L2224/29075 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
摘要翻译：提供微型封装，多堆叠微型封装及其制造方法。根据本发明的微型封装包括用于安装器件的器件基板，作为电路模块; 保护装置的保护帽; 通过在器件基板上的预定区域上图案化而形成的结合物质将器件基板和保护盖接合; 形成在器件基板的一部分上的层和粘合物质的保护盖的一部分和外侧; 通过蚀刻掉保护盖的另一部分并且通过接合物质电连接到器件基板的上表面而形成的通孔; 在通孔上形成的阻挡金属（UBM）; 以及形成在UBM上的作为外部信号的连接端子的焊料保险杠。如上所述，本发明具有保证气密密封的优点，因为上述层防止从外部吸湿，同时降低了对包装内部装置的损坏的可能性，因为处理温度在晶片接合后下降到150°以下涉及使用聚合物物质作为结合物质。

6. 发明授权

US08531580B2 Imaging device including a plurality of imaging units 有权
标题翻译：成像装置包括多个成像单元
公开(公告)号：US08531580B2
公开(公告)日：2013-09-10
申请号：US13032137
申请日：2011-02-22
申请人： Min-Seog Choi , Woon-Bae Kim , Eun-Sung Lee , Kyu-Dong Jung
发明人： Min-Seog Choi , Woon-Bae Kim , Eun-Sung Lee , Kyu-Dong Jung
IPC分类号： H04N5/225 , H04N7/00
CPC分类号： H04N5/2253 , H04N5/2257 , H04N5/2258 , H04N5/2259 , H04N5/23238
摘要： An imaging device with a plurality of imaging units is provided. The imaging device includes a supporting substrate, a flexible substrate and a movable unit. The supporting substrate is formed with a hard material, and the flexible substrate includes a plurality of imaging units positioned at least in a width direction. The flexible substrate is fixed at a first edge portion with the supporting substrate, while an opposite second edge portion of the flexible substrate is connected with the movable unit. The movable unit moves the opposite second edge portion of the flexible substrate in the width direction and bends or flattens the flexible substrate. A degree of curvature at which the flexible substrate is bent may vary based on a distance by which the movable unit moves in the width direction, so that a field of view (FOV) of the plurality of imaging units may be adjusted.
摘要翻译：提供具有多个成像单元的成像装置。成像装置包括支撑基板，柔性基板和可移动单元。支撑基板由硬质材料形成，柔性基板包括至少沿宽度方向定位的多个成像单元。柔性基板与支撑基板固定在第一边缘部分，而柔性基板的相对的第二边缘部分与可移动单元连接。可移动单元在柔性基板的宽度方向上移动相对的第二边缘部分并弯曲或平坦化柔性基板。柔性基板弯曲的弯曲度可以基于可移动单元在宽度方向上移动的距离而变化，使得可以调整多个成像单元的视场（FOV）。

7. 发明申请

US20070164410A1 Wafer level packaging cap and fabrication method thereof 有权
标题翻译：晶圆级封装盖及其制造方法
公开(公告)号：US20070164410A1
公开(公告)日：2007-07-19
申请号：US11491086
申请日：2006-07-24
申请人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
发明人： Yong-sung Kim , Woon-Bae Kim , Kyu-dong Jung , Chang-seung Lee
IPC分类号： H01L23/02
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L23/04 , H01L2924/01079 , H01L2924/16235
摘要： A fabrication method of a wafer level packaging cap for covering a device wafer provided with a device thereon, includes forming an insulating layer on a wafer; removing a predetermined part of the insulating layer and exposing an upper surface of the wafer; forming a cap pad extending from an upper surface and the exposed surface of the wafer; forming a cavity on a lower surface of the wafer corresponding to the cap pad; etching a bottom surface of the cavity and exposing the cap pad which is connected to the wafer through the cavity; and forming metal lines extending from the lower surface of the wafer and the cavity, to electrically connect the cap pad which is exposed through the cavity.
摘要翻译：一种用于覆盖其上具有器件的器件晶片的晶片级封装帽的制造方法，包括在晶片上形成绝缘层; 去除所述绝缘层的预定部分并暴露所述晶片的上表面; 形成从所述晶片的上表面和所述暴露表面延伸的盖焊盘; 在与所述盖垫对应的所述晶片的下表面上形成空腔; 蚀刻空腔的底表面并暴露通过空腔连接到晶片的盖垫; 以及形成从所述晶片的下表面和所述腔延伸的金属线，以电连接通过所述空腔暴露的所述盖垫。

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