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1. 发明授权

US08747634B2 Gas-sensor 有权
标题翻译：气体传感器
公开(公告)号：US08747634B2
公开(公告)日：2014-06-10
申请号：US13045223
申请日：2011-03-10
申请人： Seiji Oya , Shin Yoshida , Yuko Yamada
发明人： Seiji Oya , Shin Yoshida , Yuko Yamada
IPC分类号： G01N27/409 , G01N27/26
CPC分类号： G01N27/407
摘要： A gas sensor including a gas sensor element, and an inner member surrounding the gas sensor element. The gas sensor element has a detection element having therein a space to which a gas to be measured is introduced, and a heater laminated on the detection element. The detection element includes a first oxygen pumping cell for pumping oxygen into or out of the space, an oxygen concentration detection cell, a detection electrode and a reference electrode. In side faces of the detection element along a laminating direction, a region from a front end of the inner member to a part of the detection electrode along a longitudinal direction is covered with a glass coat having a glass transition point of over 700° C. Further the detection electrode is controlled at a temperature range from 600° C. or more to not more than the glass transition point of the glass coat.
摘要翻译：包括气体传感器元件的气体传感器和围绕气体传感器元件的内部构件。气体传感器元件具有检测元件，其中具有引入待测气体的空间，层叠在检测元件上的加热器。检测元件包括用于将氧气输入或流出空间的第一氧气泵浦单元，氧浓度检测单元，检测电极和参考电极。沿着层叠方向的检测元件的侧面，从玻璃化转变点为700℃以上的玻璃涂层覆盖从内部构件的前端到沿着长度方向的检测电极的一部分的区域。此外，将检测电极控制在玻璃涂层的玻璃化转变点的600℃以上的范围内。

2. 发明授权

US07738927B2 In-vehicle hand-free apparatus 失效
标题翻译：车载免提装置
公开(公告)号：US07738927B2
公开(公告)日：2010-06-15
申请号：US11319647
申请日：2005-12-29
申请人： Eiji Ogura , Mitsuru Yamamoto , Yuko Yamada
发明人： Eiji Ogura , Mitsuru Yamamoto , Yuko Yamada
IPC分类号： H04M1/00
CPC分类号： H04M1/6091 , H04M1/22
摘要： An in-vehicle hand-free apparatus that is for ensuring hand-free talk by a short-range wireless communication system in compliance with the Bluetooth includes a notification unit which notifies the status of the in-vehicle hand-free apparatus. As the in-vehicle hand-free apparatus notifies the status thereof by the notification unit, the user can easily perceive the status of the in-vehicle hand-free apparatus.
摘要翻译：用于通过符合蓝牙的短距离无线通信系统确保免提通话的车载免提装置包括：通知单元，其通知车载免提装置的状态。当车载无人机通知通知单元的状态时，用户可以容易地察觉到车载免提装置的状态。

3. 发明申请

US20100308465A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100308465A1
公开(公告)日：2010-12-09
申请号：US12794012
申请日：2010-06-04
申请人： Masami Ogura , Takahito Takayanagi , Yuko Yamada , Jun Kato , Tsugio Masuda , Tsukasa Aiba , Fumitomo Takano
发明人： Masami Ogura , Takahito Takayanagi , Yuko Yamada , Jun Kato , Tsugio Masuda , Tsukasa Aiba , Fumitomo Takano
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H05K1/0204 , H01L23/3735 , H01L2224/32225 , H01L2224/83101 , H01L2924/13055 , H01L2924/13091 , H05K3/0058 , H01L2924/00
摘要： There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.
摘要翻译：提供了一种半导体器件，包括：电路板，其通过将第一和第二金属板分别接合到绝缘基板的两个表面而形成;至少一个半导体元件，其将通过第一和第二金属板接合到第一金属板的外表面焊料和散热基板，其通过第二焊料与第二金属板的外表面接合，其中第一和第二焊料由相同类型的焊料构成，并且厚度之和的比率将绝缘基板的厚度的第一金属板和第二金属板设定在预定范围内，以确保第一和第二焊料各自的温度应力的耐久性。

4. 发明授权

US08415801B2 Semiconductor device having thermal endurance and method of manufacturing the same 有权
标题翻译：具有耐热性的半导体器件及其制造方法
公开(公告)号：US08415801B2
公开(公告)日：2013-04-09
申请号：US12794012
申请日：2010-06-04
申请人： Masami Ogura , Takahito Takayanagi , Yuko Yamada , Jun Kato , Tsugio Masuda , Tsukasa Aiba , Fumitomo Takano
发明人： Masami Ogura , Takahito Takayanagi , Yuko Yamada , Jun Kato , Tsugio Masuda , Tsukasa Aiba , Fumitomo Takano
IPC分类号： H01L23/488
CPC分类号： H05K1/0204 , H01L23/3735 , H01L2224/32225 , H01L2224/83101 , H01L2924/13055 , H01L2924/13091 , H05K3/0058 , H01L2924/00
摘要： There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.
摘要翻译：提供了一种半导体器件，包括：电路板，其通过将第一和第二金属板分别接合到绝缘基板的两个表面而形成;至少一个半导体元件，其将通过第一和第二金属板接合到第一金属板的外表面焊料和散热基板，其通过第二焊料与第二金属板的外表面接合，其中第一和第二焊料由相同类型的焊料构成，并且厚度之和的比率将绝缘基板的厚度的第一金属板和第二金属板设定在预定范围内，以确保第一和第二焊料各自的温度应力的耐久性。

5. 发明授权

US07736690B2 Method for manufacturing an electrical test probe 有权
标题翻译：电测试探头的制造方法
公开(公告)号：US07736690B2
公开(公告)日：2010-06-15
申请号：US12017300
申请日：2008-01-21
申请人： Hideki Hirakawa , Yuko Yamada , Yosuke Yoshizawa , Takayuki Hayashizaki , Akira Soma , Shinji Kuniyoshi
发明人： Hideki Hirakawa , Yuko Yamada , Yosuke Yoshizawa , Takayuki Hayashizaki , Akira Soma , Shinji Kuniyoshi
IPC分类号： B05D5/12
CPC分类号： G01R1/06755 , G01R1/06733 , Y10T29/49117 , Y10T29/49204
摘要： A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way. Thus, the cross-sectional area at the maximum cross-sectional area portion reaching the base portion of the probe tip section can be made to be larger than in the conventional case, and along with the increase of the cross-sectional area, the stress acting on the base portion can be lowered.
摘要翻译：电测试探针的探针尖端部分具有由第一沉积部分和覆盖第一沉积部分的第二沉积部分组成的层压结构，并且通过层压结构，包括最大横截面积部分，其截面积在探针末端部的前端部与探针头部的基部之间，设置有探针头部的部分增加到基部。在最大横截面积部分，在垂直于探针尖端部分的突出方向的平坦表面上看到的X方向上的尺寸以一维方式增加，另外，Y方向上的尺寸与X方向垂直的方向从前端朝向基部增加，结果能够以二维方式增大探针末端部的截面积。因此，能够使到达到探头前端部的基部的最大截面积部分的截面积大于常规情况，并且随着横截面积的增加，应力可以降低作用于基部的部分。

6. 发明授权

US07816931B2 Contact for electrical test, electrical connecting apparatus using it, and method of producing the contact 有权
标题翻译：用于电气测试的接触件，使用它的电气连接装置以及接触的制造方法
公开(公告)号：US07816931B2
公开(公告)日：2010-10-19
申请号：US12388394
申请日：2009-02-18
申请人： Hideki Hirakawa , Takayuki Hayashizaki , Akira Soma , Yuko Yamada
发明人： Hideki Hirakawa , Takayuki Hayashizaki , Akira Soma , Yuko Yamada
IPC分类号： G01R31/02
CPC分类号： G01R1/06738 , G01R1/06727 , G01R3/00 , Y10T29/49204
摘要： A contact comprises a contact body at least provided with an arm region extending in the right-left direction, and a tip region extending downward from the front end portion of the arm region. The tip region is provided with a pedestal portion integrally continuous to the lower edge portion on the front end side of the arm region, and a contact portion projecting downward from the lower end portion of the pedestal portion and having a tip to be brought into contact with an electrode of a device under test at the lower end. The pedestal portion includes an underside region having at least four inclined faces located around the contact portion when the tip region is seen from below, and inclined such that a portion closer to the side of the contact portion becomes lower.
摘要翻译：触点包括至少设置有沿左右方向延伸的臂区域的接触体和从臂区域的前端部向下延伸的尖端区域。尖端区域设置有与臂区域的前端侧的下边缘部分整体连续的基座部分，以及从基座部分的下端部向下突出并具有接触头部的接触部分在下端的被测器件的电极。基座部分包括下侧区域，当从下方观察尖端区域时，具有至少四个倾斜面位于接触部分周围，并且倾斜使接近部分更靠近接触部分的部分变得更低。

7. 发明申请

US20060154698A1 In-vehicle hand-free apparatus 失效
标题翻译：车载免提装置
公开(公告)号：US20060154698A1
公开(公告)日：2006-07-13
申请号：US11319647
申请日：2005-12-29
申请人： Eiji Ogura , Mitsuru Yamamoto , Yuko Yamada
发明人： Eiji Ogura , Mitsuru Yamamoto , Yuko Yamada
IPC分类号： H04M1/00
CPC分类号： H04M1/6091 , H04M1/22
摘要： An in-vehicle hand-free apparatus that is for ensuring hand-free talk by a short-range wireless communication system in compliance with the Bluetooth includes a notification unit which notifies the status of the in-vehicle hand-free apparatus. As the in-vehicle hand-free apparatus notifies the status thereof by the notification unit, the user can easily perceive the status of the in-vehicle hand-free apparatus.
摘要翻译：用于通过符合蓝牙的短距离无线通信系统确保免提通话的车载免提装置包括：通知单元，其通知车载免提装置的状态。当车载无人机通知通知单元的状态时，用户可以容易地察觉到车载免提装置的状态。

8. 发明授权

US4741240A Recorder 失效
标题翻译：录音机
公开(公告)号：US4741240A
公开(公告)日：1988-05-03
申请号：US931074
申请日：1986-11-17
申请人： Shuhei Kawano , Yuko Yamada , Masaaki Mizuguchi , Akihiko Takeuchi
发明人： Shuhei Kawano , Yuko Yamada , Masaaki Mizuguchi , Akihiko Takeuchi
IPC分类号： G10D7/02 , G10H3/00
CPC分类号： G10H3/00 , G10D7/023 , G10H2230/165
摘要： In construction of a musical recorder, a sound collector such as a microphone is attached to the body of the recorder at the position of the constant belly of the basic vibration of resonant air columns formed in the bore of the recorder at musical tone generation in order to obtain constant sound collecting level with large howling margin at musical tone regeneration without any influence of the wall configuration of the bore.
摘要翻译：在构建音乐记录器时，诸如麦克风的收集器在记录器的主体上以在音乐生成中形成在记录器的孔中的谐振空气柱的基本振动的恒定腹部的位置附着到记录器的主体上获得恒定的声音收集水平，在音调再现时具有大的啸叫余量，而不影响孔的壁构造。

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