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1. 发明授权

US06685777B2 Paste applicator and paste application method for die bonding 失效
标题翻译：贴片涂布机和贴剂应用方法
公开(公告)号：US06685777B2
公开(公告)日：2004-02-03
申请号：US09998526
申请日：2001-11-28
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05C1100
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

2. 发明授权

US06361831B1 Paste application method for die bonding 有权
标题翻译：贴片应用方法
公开(公告)号：US06361831B1
公开(公告)日：2002-03-26
申请号：US09544385
申请日：2000-04-06
申请人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
发明人： Seiichi Sato , Hitoshi Mukojima , Nobuyuki Iwashita , Nobuyuki Suefuji , Mitsuru Ozono
IPC分类号： B05D118
CPC分类号： H01L24/27 , H01L21/67144 , H01L21/6715 , H01L21/67253 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/07802 , H01L2924/00
摘要： A paste applicator and paste application method for die bonding apply paste to adhere a semiconductor chip on a substrate. Data on paste application volume and application pattern which can be identified from paste thickness and chip size are stored. A dispensing flow rate calculator calculates dispensing flow rate of a dispenser based on the paste application volume data and application pattern data when the paste is dispensed from the dispenser and pressure fed to an application nozzle for applying paste. Based on this calculated dispensing flow rate and application pattern data, a dispenser controller controls the dispenser and a transfer table controller controls the transfer table for moving the application nozzle.
摘要翻译：用于管芯接合的糊剂涂布器和糊剂施加方法施加糊剂以将半导体芯片粘附在基底上。存储可以从糊料厚度和芯片尺寸确定的粘贴应用体积和应用模式的数据。分配流量计算器基于糊料从分配器中分配出来的浆料施加量数据和应用模式数据来计算分配器的分配流量，并且将压力供给到用于施加浆料的施加喷嘴。基于该计算的分配流量和应用模式数据，分配器控制器控制分配器，并且转移表控制器控制用于移动施加喷嘴的转移台。

3. 发明授权

US06348234B1 Paste applying method 有权
标题翻译：粘贴方法
公开(公告)号：US06348234B1
公开(公告)日：2002-02-19
申请号：US09536614
申请日：2000-03-28
申请人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
发明人： Mitsuru Ozono , Hitoshi Mukojima , Seiichi Sato , Nobuyuki Iwashita , Nobuyuki Suefuji
IPC分类号： B05D510
CPC分类号： H01L21/67253 , B05C5/0216 , H01L21/67144 , H01L21/68
摘要： In a paste applying method for applying paste in an application area set on the surface of the object to be applied, the application efficiency is enhanced and the application quality is improved by applying the paste in an undulation pattern of convex and concave shape that defines the interior of the surface of the object on which no paste is deposited, where the interior area is substantially enclosed by the undulation pattern of the paste. A discharge port of an application nozzle is moved with one continuous line from an application start point to an application end point along the moving route by a plurality of passing points. The plurality of passing points are set at each comer of the application area and include a plurality of first passing points and a plurality of second passing points, where the first passing points are set at each corner of the application area and the second passing points are set at the central side of the application area.
摘要翻译：另外，在涂布在被涂物的表面上的涂布区域中的糊剂涂布方法中，通过将糊状物以规定了凹凸形状的凹凸形状的波纹图案进行涂布，提高了涂布效果，提高了涂布质量没有糊状物的物体的表面的内部，其中内部区域基本上被糊的起伏图案包围。应用喷嘴的排出口通过多个通过点沿着移动路线以一条连续的线从应用开始点移动到应用端点。多个通过点被设置在应用区域的每个角上，并且包括多个第一通过点和多个第二通过点，其中第一通过点被设置在应用区域的每个角落处，而第二通过点是设置在应用领域的中央。

4. 发明申请

US20050132567A1 Electronic component placement machine and electronic component placement method 有权
标题翻译：电子元件贴装机和电子元器件放置方法
公开(公告)号：US20050132567A1
公开(公告)日：2005-06-23
申请号：US11033511
申请日：2005-01-12
申请人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
发明人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
IPC分类号： H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
摘要翻译：公开了一种电子元件贴装机和电子部件配置方法。旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。放置头接收翻转的芯片并将其放置在板上。在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

5. 发明授权

US07191511B2 Electronic component placement machine having camera units with vertically overlaid apertures 有权
标题翻译：电子元件贴装机具有垂直重叠孔的相机单元
公开(公告)号：US07191511B2
公开(公告)日：2007-03-20
申请号：US11033511
申请日：2005-01-12
申请人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
发明人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
IPC分类号： B23P19/00
CPC分类号： H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
摘要翻译：公开了一种电子元件贴装机和电子部件配置方法。旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。放置头接收翻转的芯片并将其放置在板上。在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

6. 发明授权

US07007377B2 Electronic component placement method 有权
标题翻译：电子元件放置方法
公开(公告)号：US07007377B2
公开(公告)日：2006-03-07
申请号：US10781787
申请日：2004-02-20
申请人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
发明人： Kazuhiko Noda , Hitoshi Mukojima , Yasuhiro Narikiyo , Toshiro Hirakawa , Hiromi Kanaki , Akira Nishimura , Osamu Uchida , Takatoshi Ishikawa
IPC分类号： H05K3/30
CPC分类号： H05K13/0452 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/53087 , Y10T29/53174 , Y10T29/53178
摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
摘要翻译：公开了一种电子元件贴装机和电子部件配置方法。旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。放置头接收翻转的芯片并将其放置在板上。在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

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