专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20160381834A1 MODULAR COOLING SYSTEM 有权
标题翻译：模块式冷却系统
公开(公告)号：US20160381834A1
公开(公告)日：2016-12-29
申请号：US14751488
申请日：2015-06-26
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H05K7/20 , F16L37/14 , F28F9/02
CPC分类号： H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
摘要： Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.
摘要翻译：本文提供了用于冷却安装在设备机架中的电子部件的模块化冷却系统的技术。模块化冷却系统包括冷板和连接到冷板的支撑歧管。一起，支撑歧管和冷板限定了用于将流体从支撑歧管冷却到冷板的流体路径。模块化冷却系统还包括设备载体，包括由冷板冷却的设备。

2. 发明申请

US20160057886A1 Modular Data Storage System 有权
标题翻译：模块化数据存储系统
公开(公告)号：US20160057886A1
公开(公告)日：2016-02-25
申请号：US14832676
申请日：2015-08-21
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alexander C. Worrall
IPC分类号： H05K7/14
CPC分类号： G06F1/187 , G06F1/185 , G06F1/20 , H05K5/0021 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/1405 , H05K7/1411 , H05K7/1489
摘要： A modular data storage system can consist of at least first and second enclosures spanning a single pair of rails. The first and second enclosures may each have keyed couplers that mate to align the first and second enclosures along a common plane while being suspended between the single pair of rails.
摘要翻译：模块化数据存储系统可以由至少跨越一对导轨的第一和第二外壳组成。第一和第二外壳可以各自具有键合的耦合器，其配合以沿着公共平面对准第一和第二外壳，同时悬挂在单对导轨之间。

3. 发明授权

US09832906B2 Midplane docking system 有权
公开(公告)号：US09832906B2
公开(公告)日：2017-11-28
申请号：US14751498
申请日：2015-06-26
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H01R27/02 , H01R13/213 , H05K7/14 , G06F1/16
CPC分类号： H05K7/1492 , G06F1/16 , H01R13/213
摘要： Technologies for midplane docking systems for connecting adjacent levels of docks are provided herein. An extendable connection system includes: a connector cable, the connector cable having a first end and a second end; a male connector, the male connector connected to the first end of the connector cable, the male connector including male connecting mechanism; and a female connector, the female connector connected to the second end of the connector cable and including a female connecting mechanism adapted to connect with the male connecting mechanism, wherein the male connector is extendable relative to the female connector.

4. 发明申请

US20160380399A1 MIDPLANE DOCKING SYSTEM 有权
标题翻译： MIDPLANE锁定系统
公开(公告)号：US20160380399A1
公开(公告)日：2016-12-29
申请号：US14751498
申请日：2015-06-26
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H01R27/02
CPC分类号： H05K7/1492 , G06F1/16 , H01R13/213
摘要： Technologies for midplane docking systems for connecting adjacent levels of docks are provided herein. An extendable connection system includes: a connector cable, the connector cable having a first end and a second end; a male connector, the male connector connected to the first end of the connector cable, the male connector including male connecting mechanism; and a female connector, the female connector connected to the second end of the connector cable and including a female connecting mechanism adapted to connect with the male connecting mechanism, wherein the male connector is extendable relative to the female connector.
摘要翻译：本文提供了用于连接相邻水平底座的中平面对接系统的技术。可延伸连接系统包括：连接器电缆，所述连接器电缆具有第一端和第二端; 阳连接器，阳连接器连接到连接器电缆的第一端，阳连接器包括阳连接机构; 和阴连接器，阴连接器连接到连接器电缆的第二端并且包括适于与阳连接机构连接的阴连接机构，其中阳连接器可相对于阴连接器延伸。

5. 发明授权

US09655281B2 Modular cooling system 有权
公开(公告)号：US09655281B2
公开(公告)日：2017-05-16
申请号：US14751488
申请日：2015-06-26
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H05K7/20 , F28F9/02 , F16L37/14
CPC分类号： H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
摘要： Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.

6. 发明授权

US11197393B2 Fluid connectors for modular cooling systems 有权
公开(公告)号：US11197393B2
公开(公告)日：2021-12-07
申请号：US16407256
申请日：2019-05-09
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： G06F1/20 , H05K7/20 , F28F9/02 , F16L37/14 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/007
摘要： A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.

7. 发明申请

US20190269039A1 FLUID CONNECTORS FOR MODULAR COOLING SYSTEMS 审中-公开
公开(公告)号：US20190269039A1
公开(公告)日：2019-08-29
申请号：US16407256
申请日：2019-05-09
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H05K7/20 , F16L37/18 , F16L37/14 , F28F9/02 , G06F1/20 , F16L37/32 , F28F3/12 , F28F9/007
摘要： A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.

8. 发明授权

US10327358B2 Fluid connectors for modular cooling systems 有权
公开(公告)号：US10327358B2
公开(公告)日：2019-06-18
申请号：US15595779
申请日：2017-05-15
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： F28F3/12 , F28F9/02 , G06F1/20 , H05K7/20 , F16L37/14 , F16L37/18 , F16L37/32 , F28F9/007
摘要： Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.

9. 发明申请

US20170251573A1 FLUID CONNECTORS FOR MODULAR COOLING SYSTEMS 审中-公开
公开(公告)号：US20170251573A1
公开(公告)日：2017-08-31
申请号：US15595779
申请日：2017-05-15
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alex Carl Worrall
IPC分类号： H05K7/20 , F16L37/18 , F16L37/14 , F16L37/32 , F28F9/02 , F28F9/007
CPC分类号： H05K7/20627 , F16L37/146 , F16L37/18 , F16L37/32 , F28F3/12 , F28F9/0075 , F28F9/02 , F28F9/0219 , F28F9/0275 , F28F2280/10 , G06F1/20 , G06F2200/201 , H05K7/20636 , H05K7/20781
摘要： Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.

10. 发明授权

US09851764B2 Modular data storage system 有权
公开(公告)号：US09851764B2
公开(公告)日：2017-12-26
申请号：US14832676
申请日：2015-08-21
申请人： Seagate Technology LLC
发明人： Laurence A. Harvilchuck , Alexander C. Worrall
IPC分类号： G06F1/16 , G06F1/18 , H05K5/02 , H05K5/00 , H05K7/14 , G06F1/20
CPC分类号： G06F1/187 , G06F1/185 , G06F1/20 , H05K5/0021 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/1405 , H05K7/1411 , H05K7/1489
摘要： A modular data storage system can consist of at least first and second enclosures spanning a single pair of rails. The first and second enclosures may each have keyed couplers that mate to align the first and second enclosures along a common plane while being suspended between the single pair of rails.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式