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    • 5. 发明授权
    • Circuit for driving conductive line and testing conductive line for current leakage
    • 用于驱动导线的电路和测试导线用于漏电
    • US06242936B1
    • 2001-06-05
    • US09366232
    • 1999-08-03
    • Michael Duc HoDuy-Loan T. LeScott E. Smith
    • Michael Duc HoDuy-Loan T. LeScott E. Smith
    • G01R3126
    • G01R31/3004
    • A circuit (100) that drives word lines and tests a word line (102) in a semiconductor device is disclosed. A charge circuit (108) couples a supply voltage (VPP) to a charge node (106) according to a potential at a boot node (110). The charge node (106) supplies a charge voltage for the word line (102). In a standard cycle, the boot node (110) is charged to a high voltage, and maintained at the high potential, to keep the word line (102) charged. In a test cycle, the boot node (110) is charged to a high voltage, and then discharged to a low voltage, thereby isolating the charge node (106) and the word line (102). In the event the word line (102) suffers from current leakage, a drop in potential will be detected at the charge rode (106).
    • 公开了一种在半导体器件中驱动字线并测试字线(102)的电路(100)。 充电电路(108)根据引导节点(110)处的电位将电源电压(VPP)耦合到充电节点(106)。 充电节点(106)为字线(102)提供充电电压。 在标准周期中,引导节点(110)被充电到高电压并保持在高电位,以保持字线(102)充电。 在测试周期中,引导节点(110)被充电到高电压,然后被放电到低电压,从而隔离充电节点(106)和字线(102)。 在字线(102)遇到电流泄漏的情况下,在充电路径(106)处将检测到电位下降。
    • 6. 发明授权
    • Timing circuit for high voltage testing
    • 高电压测试定时电路
    • US06201752B1
    • 2001-03-13
    • US09398240
    • 1999-09-20
    • Anh BuiScott E. SmithDuy-Loan T. Le
    • Anh BuiScott E. SmithDuy-Loan T. Le
    • G11C700
    • C07H13/06C07H15/18C07H17/08C07H19/16G11C5/143G11C7/1072G11C11/401G11C29/028G11C29/50G11C29/50012
    • A circuit is designed with a detector circuit (700) coupled between a supply voltage terminal (705) and a reference voltage terminal (755). The detector circuit produces a first control signal in response to a detected mode and produces a second control signal in response to another mode. A first circuit (205, 207) including a delay circuit receives the first control signal and a third control signal. The delay circuit produces a fourth control signal at an output terminal (215) in response to the first and third control signals. A second circuit (203) receives the second control signal and the third control signal. The second circuit produces the fourth control signal at the output terminal in response to the second and third control signals.
    • 电路设计有耦合在电源电压端(705)和参考电压端(755)之间的检测器电路(700)。 检测器电路响应于检测模式产生第一控制信号,并且响应于另一模式产生第二控制信号。 包括延迟电路的第一电路(205,207)接收第一控制信号和第三控制信号。 延迟电路响应于第一和第三控制信号在输出端(215)产生第四控制信号。 第二电路(203)接收第二控制信号和第三控制信号。 第二电路响应于第二和第三控制信号在输出端产生第四控制信号。
    • 7. 发明授权
    • Data pipeline interrupt scheme for preventing data disturbances
    • 用于防止数据干扰的数据流水线中断方案
    • US6038177A
    • 2000-03-14
    • US253848
    • 1999-02-22
    • M. Kumar RajithKallol MazumderScott E. SmithDuy-Loan T. Le
    • M. Kumar RajithKallol MazumderScott E. SmithDuy-Loan T. Le
    • G11C7/10G11C16/04G11C8/00
    • G11C7/1039G11C7/1051
    • A read mask circuit (300) is disclosed. A mask command is shifted through a series of mask latches (308 and 310) to generate the output-enable input (OE.sub.--) of an output driver (306). In synchronism with the mask command, data bits are shifted through a series of data latches (312 and 314) to the data input (DIN) of the output driver (306). To prevent a race condition between the mask command and the data bit that is to be masked (B3), the mask command, when latched in the second-to-last mask latch (308), is used to interrupt the last data latch (314). This prevents the to-be-masked data bit (B3) from being latched in the last data latch (314) and generating an undesirable output data transition by the output driver (306).
    • 公开了一种读掩模电路(300)。 屏蔽命令通过一系列掩码锁存器(308和310)移位,以产生输出驱动器(306)的输出使能输入(OE-)。 与掩模命令同步,数据位通过一系列数据锁存器(312和314)移动到输出驱动器(306)的数据输入(DIN)。 为了防止掩码命令和要被屏蔽的数据位之间的竞争条件(B3),当锁存在第二到最后掩码锁存器(308)中时,掩码命令用于中断最后的数据锁存器 314)。 这防止了被屏蔽的数据位(B3)被锁存在最后的数据锁存器(314)中,并且由输出驱动器(306)产生不期望的输出数据转换。
    • 8. 发明授权
    • Array block level redundancy with steering logic
    • 具有转向逻辑的阵列块级冗余
    • US5295101A
    • 1994-03-15
    • US829124
    • 1992-01-31
    • Michael C. Stephens, Jr.Scott E. SmithCharles J. PilchDuy-Loan T. LeTerry T. TsaiArthur R. Piejko
    • Michael C. Stephens, Jr.Scott E. SmithCharles J. PilchDuy-Loan T. LeTerry T. TsaiArthur R. Piejko
    • G11C11/401G06F11/10G11C29/00G11C29/04G11C7/00
    • G11C29/81G11C29/88G06F11/1008
    • The described embodiments of the present invention provide a circuit and method for a two level redundancy scheme for a semiconductor memory device. The memory device has one or more data blocks (12) with each data block (12) having an array of memory cells arranged in addressable rows and columns along row lines and column lines. Each array is configured into sub-blocks (14) with each sub-block having a plurality of the memory cells. The first level redundancy scheme includes a few redundant elements for each sub-block for the replacement of defective elements, as is common in many modern semiconductor devices. The second level redundancy scheme includes at least one redundant sub-block of memory cells as part of the main memory for a fully functional memory device or, as an extra level of redundancy for at least one sub-block of memory cells containing defects which are not repairable using the redundant elements. When activated for redundancy, the second level redundancy scheme replaces at least one defective sub-block of memory devices with a like number of redundant sub-blocks of memory devices.
    • 本发明的所描述的实施例提供了一种用于半导体存储器件的二级冗余方案的电路和方法。 存储器件具有一个或多个数据块(12),每个数据块(12)具有沿着行线和列线布置在可寻址行和列中的存储单元阵列。 每个阵列被配置成子块(14),每个子块具有多个存储单元。 第一级冗余方案包括用于替换缺陷元件的每个子块的少数冗余元件,这在许多现代半导体器件中是常见的。 第二级冗余方案包括作为用于全功能存储器件的主存储器的一部分的存储器单元的至少一个冗余子块,或者作为包含缺陷的至少一个存储器单元子块的冗余级别 不可修复使用冗余元素。 当被激活用于冗余时,第二级冗余方案用存储器设备的相同数目的冗余子块替换至少一个存储器件的有缺陷子块。
    • 9. 发明授权
    • Testing and repair of wide I/O semiconductor memory devices designed for
testing
    • 测试和修复设计用于测试的宽I / O半导体存储器件
    • US5706234A
    • 1998-01-06
    • US766705
    • 1996-12-13
    • Charles J. Pilch, Jr.Carl W. PerrinDuy-Loan T. LeScott E. SmithYutaka Komai
    • Charles J. Pilch, Jr.Carl W. PerrinDuy-Loan T. LeScott E. SmithYutaka Komai
    • G01R31/28G11C29/00G11C29/34G11C29/44
    • G11C29/34G11C29/44
    • A semiconductor memory device 40 includes an array of storage cells 130, addressable by row and column and specifically designed for testing. Row and column addresses are decoded to access a row and plural columns simultaneously. A test data bit to be written into the storage cells is replicated and stored into as many storage cells at once as there are columns simultaneously accessed. Upon readout for a comparison test, plural occurrences of the stored test data bit are compared with each other and with an expected data bit within parallel comparator circuitry 140 located within the memory device. A pass/fail signal (on lead 170) from the parallel comparator circuitry is transmitted to the memory device tester 30 for final defect analysis and correction. When a failure/defect is detected, information representing the address and the type of failure are stored in the memory device tester. A memory device test method also is described.
    • 半导体存储器件40包括可由行和列寻址并且被专门设计用于测试的存储单元阵列130。 行和列地址被解码以同时访问行和多列。 将要写入存储单元的测试数据位复制并存储到同一数量的存储单元中,因为存在列同时访问。 在读出比较测试时,将存储的测试数据位的多次出现彼此进行比较,并与位于存储器件内的并行比较器电路140内的预期数据位进行比较。 来自并行比较器电路的通过/失败信号(在引线170上)传送到存储器件测试器30用于最终的缺陷分析和校正。 当检测到故障/缺陷时,表示地址和故障类型的信息存储在存储器件测试器中。 还描述了存储器件测试方法。