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    • 1. 发明授权
    • Laser treatment of head gimbal assembly components
    • 头万向节组件的激光治疗
    • US5739982A
    • 1998-04-14
    • US702072
    • 1996-08-23
    • Satya Prakash AryaDarrell Dean PalmerSurya PattanaikMathew Kayhan ShafeRandall George Simmons
    • Satya Prakash AryaDarrell Dean PalmerSurya PattanaikMathew Kayhan ShafeRandall George Simmons
    • G11B5/48G11B21/16
    • G11B5/4853G11B21/16G11B5/4826
    • Disclosed is an improved slider-suspension electrical interconnect assembly and a method of manufacturing the same. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and conductive leads integrally formed thereon. The flexible member has a gimbal area to which a slider is attached. At least one transducer is attached to the slider for reading data from and writing data to a disk surface. Each of the conductive leads terminates at one end on contact pads on the end face of the slider for electrical connection to the transducer. At the slider termination end, the conductive leads comprise an altered and an unaltered section. The altered section of the conductor has a lower yield strength than the conductor surrounding the altered section, and has a more uniform grain structure than the unaltered section. The altered, stress relieved section of the conductor is formed by treating the lead at the slider termination end with localized infrared radiation.
    • 公开了一种改进的滑块 - 悬挂电互连组件及其制造方法。 新颖的集成悬架可以由单独的部件组装,包括负载梁,挠曲件和安装板。 负载梁提供挠性件的刚性结构支撑。 挠性件包括一体地形成在其上的柔性构件和导电引线。 柔性构件具有连接滑块的万向节区域。 至少一个传感器连接到滑块,用于从盘表面读取数据并将数据写入磁盘表面。 每个导电引线在滑块的端面上的接触垫的一端终止,用于与换能器电连接。 在滑块终端端,导电引线包括改变和未改变的部分。 导体的改变部分具有比围绕改变部分的导体更低的屈服强度,并且具有比未改变部分更均匀的晶粒结构。 通过用局部红外辐射处理滑块终端处的引线来形成导体的改变的应力消除部分。
    • 4. 发明授权
    • Method of electrostatic discharge protection of magnetic heads in a
magnetic storage system
    • 磁存储系统中磁头的静电放电保护方法
    • US5699212A
    • 1997-12-16
    • US646753
    • 1996-05-01
    • A. David ErpeldingSurya PattanaikRandall George Simmons
    • A. David ErpeldingSurya PattanaikRandall George Simmons
    • G11B5/39G11B5/40G11B5/48H05K1/00H05K1/02G11B5/60
    • G11B5/4853G11B5/40H05K1/0254H05K1/0293
    • MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
    • 具有MR传感器的MR磁头可以防止由静电放电引起的损坏或静电场的存在。 在MR头上紧邻其终端的点处,在相邻的导电引线或MR传感器之间提供分流器。 焊接桥可用于分路。 在将安装有MR磁头的集成悬架放置在磁盘驱动系统中之前,将焊料分流器移除。 通过回流焊料并将回流的焊料从引线上拉出来,去除焊料分流器,以将分流器的电气连接断开到MR传感器的相邻导线。 为了便于通过回流焊料去除分路,至少一个所选择的几何形状的焊料凸块被放置在与引线相邻的位置。 该凸角包括限制凸角,其用于在形成分流器时将焊料限制在分流区域中;以及指定部分,其用于在随后的焊料回流时将焊料拉伸到远离分流区域的指定位置,从而导致物理 打破分流。 不需要物理去除焊料。 分路还可以是互连相邻引线的导电材料的整体桥的形式,其通过使用激光来去除以熔化材料。
    • 8. 发明授权
    • Integrated conductor magnetic recording head and suspension having
cross-over integrated circuits for noise reduction
    • 具有用于降噪的交叉集成电路的集成导体磁记录头和悬架
    • US5871655A
    • 1999-02-16
    • US044491
    • 1998-03-19
    • Edward Hin Pong LeeRandall George Simmons
    • Edward Hin Pong LeeRandall George Simmons
    • G11B5/48G11B23/00G11B5/235
    • G11B5/4853G11B23/0007Y10T29/49048
    • The present invention is an integral magnetic head suspension and method for making the same. The integral suspension, with or without the head, contains integrated conductive circuits that have multiple cross overs for noise reduction. The suspension is fabricated completely on silicon (Si) wafers using semiconductor processes. A N+ silicon layer is disposed over a P- silicon wafer. The N+ silicon layer and the P- silicon water are thermally oxidized to generate a bottom silicon oxide layer opposite the N+ layer side of the wafer and a top silicon oxide layer on the N+ side of the wafer, and to drive the N+ silicon into the P- silicon wafer. A layer of polysilicon is disposed over the silicon oxide layer on top of the N+ silicon layer. One or more pairs of conductive traces having multiple cross-overs are fabricated on the layer of polysilicon. Optimally, a magnetic head is simultaneously fabricated on the suspension. The polysilicon layer is then patterned to define the head structure and suspension structure as one piece. Finally, the magnetic head and suspension are separated from the wafer by removing the first silicon oxide layer by a chemical etchant and the P- silicon wafer by selective etching. The head and suspension are released from the silicon wafer as a single structure using the above-described semiconductor processes. Accordingly, no grinding or cutting is used to define the dimensions of the head. Further, no processes are required to attach the head to the suspension and the suspension can be made from low mass materials such as silicon (Si) or Al.sub.2 O.sub.3.
    • 本发明是一种整体磁头悬挂及其制造方法。 具有或不具有头部的整体悬架包含具有多个交叉以用于降噪的集成导电电路。 使用半导体工艺,在硅(Si)晶片上完全制造悬浮液。 N +硅层设置在P-硅晶片上。 N +硅层和P-硅水被热氧化以产生与晶片的N +层侧相对的底部氧化硅层和在晶片的N +侧上的顶部氧化硅层,并将N +硅驱入 P-硅晶片。 在N +硅层顶部的氧化硅层之上设置一层多晶硅。 在多晶硅层上制造具有多重交叉的一对或多对导电迹线。 最佳地,在悬架上同时制造磁头。 然后将多晶硅层图案化以将头部结构和悬挂结构定义为一体。 最后,通过化学蚀刻剂和P-硅晶片通过选择性蚀刻去除第一氧化硅层,将磁头和悬浮液与晶片分离。 使用上述半导体工艺,头和悬浮液作为单一结构从硅晶片释放。 因此,不使用研磨或切割来限定头部的尺寸。 此外,不需要将头部附接到悬架上,并且悬架可以由诸如硅(Si)或Al 2 O 3的低质量材料制成。