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    • 5. 发明授权
    • Manufacturing method of a nonvolatile semiconductor memory device
    • 非易失性半导体存储器件的制造方法
    • US07651914B2
    • 2010-01-26
    • US12176559
    • 2008-07-21
    • Hiroshi AkahoriWakako TakeuchiYoshio Ozawa
    • Hiroshi AkahoriWakako TakeuchiYoshio Ozawa
    • H01L21/336H01L21/3205H01L21/28
    • H01L29/7881H01L27/115H01L27/11521H01L27/11524H01L29/42324H01L29/513
    • A manufacturing method of a nonvolatile semiconductor memory device including: providing a first insulating film and a silicon film on a semiconductor substrate; providing a fifth insulating film containing silicon and oxygen on the silicon film; providing a second insulating film containing silicon and nitrogen on the fifth insulating film; providing a third insulating film on the second insulating film, the third insulating film is composed of a single-layer insulating film containing oxygen or multiple-layer stacked insulating film at least whose films on a top layer and a bottom layer contain oxygen, and relative dielectric constant of the single-layer insulating film and the stacked insulating film being larger than relative dielectric constant of a silicon oxide film; providing a fourth insulating film containing silicon and nitrogen on the third insulating film; and providing a control gate above the fourth insulating film.
    • 一种非易失性半导体存储器件的制造方法,包括:在半导体衬底上提供第一绝缘膜和硅膜; 在硅膜上提供含有硅和氧的第五绝缘膜; 在第五绝缘膜上提供含有硅和氮的第二绝缘膜; 在所述第二绝缘膜上提供第三绝缘膜,所述第三绝缘膜由包含氧或多层堆叠绝缘膜的单层绝缘膜组成,所述单层绝缘膜至少其顶层和底层上的膜含有氧,并且相对 单层绝缘膜和叠层绝缘膜的介电常数大于氧化硅膜的相对介电常数; 在所述第三绝缘膜上提供含有硅和氮的第四绝缘膜; 以及在所述第四绝缘膜上方设置控制栅极。
    • 6. 发明申请
    • Method for Manufacturing Backside-Illuminated Optical Sensor
    • 制造背面照明光学传感器的方法
    • US20070275488A1
    • 2007-11-29
    • US10553231
    • 2004-04-14
    • Hiroya KobayashiHiroshi AkahoriMasaharu Muramatsu
    • Hiroya KobayashiHiroshi AkahoriMasaharu Muramatsu
    • H01L21/02
    • H01L27/14618H01L27/1464H01L27/14683H01L27/14812H01L2224/45144H01L2224/48091H01L2924/00014H01L2924/00
    • A CCD portion 3 is formed on a front surface side of a semiconductor substrate 1. A region of a back surface side of semiconductor substrate 1 that corresponds to CCD portion 3 is thinned while leaving peripheral regions 1a of the region, and an accumulation layer 5 is formed on the back surface side of semiconductor substrate 1. An electrical wiring 7, which is electrically connected to CCD portion 3, and an electrode pad 9, which is electrically connected to electrical wiring 7, are then formed on a region 1b of the front surface side of semiconductor substrate 1 that corresponds to a peripheral region 1a, and a supporting substrate 11 is adhered onto the front surface side of semiconductor substrate 1 so as to cover CCD portion 3 while leaving electrode pad 9 exposed. Semiconductor substrate 1 and supporting substrate 11 are then cut at a thinned portion of semiconductor substrate 1 so as to leave peripheral region 1a corresponding to region 1b at which electrical wiring 7 and electrode pad 9 are formed.
    • CCD部3形成在半导体基板1的正面侧。半导体基板1的与CCD部3对应的背面侧的区域变薄,同时留下该区域的周边区域1a,并且累积层 5形成在半导体基板1的背面侧。然后,在区域1b上形成电连接到CCD部分3的电布线7和电连接到电线7的电极焊盘9 的半导体衬底1的表面侧,并且将支撑衬底11粘附到半导体衬底1的前表面侧,以覆盖CCD部3,同时使电极焊盘9露出。 然后在半导体衬底1的薄化部分处切割半导体衬底1和支撑衬底11,以便留下对应于形成电布线7和电极焊盘9的区域1b的周边区域1a。
    • 7. 发明授权
    • Semiconductor energy detector
    • 半导体能量探测器
    • US07148551B2
    • 2006-12-12
    • US10262859
    • 2002-10-03
    • Yasuhito YonetaHiroshi AkahoriMasaharu Muramatsu
    • Yasuhito YonetaHiroshi AkahoriMasaharu Muramatsu
    • H01L31/00
    • H01L31/103H01L27/14663
    • A semiconductor energy detector includes a semiconductor substrate comprised of a semiconductor of a first conductivity type, into which an energy ray of a predetermined wavelength range is incident from an incident surface thereof. A semiconductor energy detector includes a plurality of diffusion regions of a second conductivity type comprised of a semiconductor of a second conductivity type and a diffusion region of the first conductivity type comprised of a semiconductor of the first conductivity type higher in impurity concentration than the semiconductor substrate. The diffusion regions of a second conductivity type and the diffusion region of the first conductivity type are provided on a surface opposite to the incident surface of said semiconductor substrate. Each first conductivity type semiconductor substrate side of pn junctions, formed at the area of interface between the semiconductor substrate and each of the diffusion regions of the second conductivity type, is commonly connected.
    • 半导体能量检测器包括由第一导电类型的半导体构成的半导体衬底,预定波长范围的能量射线从入射表面入射到该半导体衬底。 半导体能量检测器包括由第二导电类型的半导体构成的第二导电类型的多个扩散区域和由比半导体衬底的杂质浓度高的第一导电类型的半导体构成的第一导电类型的扩散区域 。 第二导电类型的扩散区域和第一导电类型的扩散区域设置在与所述半导体衬底的入射表面相对的表面上。 形成在半导体衬底和第二导电类型的每个扩散区之间的界面区域的pn结的每个第一导电类型半导体衬底侧通常连接。