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1. 发明授权

US07790354B2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same 有权
标题翻译：光敏树脂组合物，其固化产物和使用其的印刷电路板的制备方法
公开(公告)号：US07790354B2
公开(公告)日：2010-09-07
申请号：US11587162
申请日：2005-04-21
申请人： Satoru Ishigaki , Hiroshi Uchida , Yoshio Miyajima , Katsutoshi Morinaka
发明人： Satoru Ishigaki , Hiroshi Uchida , Yoshio Miyajima , Katsutoshi Morinaka
IPC分类号： G03F7/00 , G03F7/004 , G03F7/035
CPC分类号： G03F7/027 , C08G18/0823 , C08G18/4854 , C08G18/672 , C08G18/755 , C09D175/16 , G03F7/032 , G03F7/033 , G03F7/035 , G03F7/038 , G03F7/0388 , H05K3/287 , Y10T428/31855 , C08G18/6692
摘要： There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2═CH—COO—R—NCO (1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).
摘要翻译：提供了一种新颖的感光性树脂组合物，其固化膜具有充分的柔软性，并且产生具有优异的耐焊接耐热性，耐热劣化性和无电镀金电镀性的绝缘保护涂层。本发明的感光性树脂组合物包含：含有氨基甲酸酯丙烯酸酯化合物（A）和除所述氨基甲酸酯丙烯酸酯化合物（A）以外具有乙烯性不饱和基团的化合物（B）的光聚合性成分，热固性树脂（C），光聚合引发剂（D）和热聚合催化剂（E）; 其中，所述氨基甲酸酯丙烯酸酯化合物（A）是以下通式（1）的异氰酸酯化合物（a-1）：CH 2 = CH-COO-R-NCO（1）（其中，R表示烃具有1至30个碳原子的基团）与多羟基化合物（a-2）反应。

2. 发明申请

US20070218305A1 Photosensitive Resin Composition, Cured Product Thereof and Production Method of Printed Circuit Board Using the Same 有权
标题翻译：感光性树脂组合物及其固化物及使用其的印刷电路板的制造方法
公开(公告)号：US20070218305A1
公开(公告)日：2007-09-20
申请号：US11587162
申请日：2005-04-21
申请人： Satoru Ishigaki , Hiroshi Uchida , Yoshio Miyajima , Katsutoshi Morinaka
发明人： Satoru Ishigaki , Hiroshi Uchida , Yoshio Miyajima , Katsutoshi Morinaka
IPC分类号： G03F7/004
CPC分类号： G03F7/027 , C08G18/0823 , C08G18/4854 , C08G18/672 , C08G18/755 , C09D175/16 , G03F7/032 , G03F7/033 , G03F7/035 , G03F7/038 , G03F7/0388 , H05K3/287 , Y10T428/31855 , C08G18/6692
摘要： There are provided a novel photosensitive resin composition, a cured film of which has ample flexibility, and which yields an insulating protective coating having superior soldering heat resistance, thermal degradation resistance and electroless gold plating resistance. The photosensitive resin composition as claimed in the present invention comprises: a photopolymerizeable component containing a urethane acrylate compound (A) and a compound (B) having an ethylenic unsaturated group other than said urethane acrylate compound (A), a thermosetting resin (C), a photopolymerization initiator (D) and a thermal polymerization catalyst (E); wherein, said urethane acrylate compound (A) is the reaction product of an isocyanate compound (a-1) of the following general formula (1): CH2═CH—COO—R—NCO (1) (wherein, R represents a hydrocarbon group having 1 to 30 carbon atoms) with a polyhydroxy compound (a-2).
摘要翻译：提供了一种新颖的感光性树脂组合物，其固化膜具有充分的柔软性，并且产生具有优异的耐焊接耐热性，耐热劣化性和无电镀金电镀性的绝缘保护涂层。本发明的感光性树脂组合物包含：含有氨基甲酸酯丙烯酸酯化合物（A）和除所述氨基甲酸酯丙烯酸酯化合物（A）以外具有乙烯性不饱和基团的化合物（B）的光聚合性成分，热固性树脂（C），光聚合引发剂（D）和热聚合催化剂（E）; 其中，所述氨基甲酸酯丙烯酸酯化合物（A）是下列通式（1）的异氰酸酯化合物（a-1）的反应产物：<？in-line-formula description =“In-line Formula”end =“lead “ - > CH 2 - -CH-COO-R-NCO（1）<？在线公式描述=”在线式“末端=”尾“→（其中，R表示具有1〜30个碳原子的烃基）与多羟基化合物（a-2）。

3. 发明申请

US20090082518A1 CARBOXYL GROUP-CONTAINING POLYURETHANE, HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：含羧基的聚氨酯，可固化树脂组合物及其用途
公开(公告)号：US20090082518A1
公开(公告)日：2009-03-26
申请号：US11914435
申请日：2006-05-16
申请人： Hiroshi Uchida , Ritsuko Hirakawa , Yoshio Miyajima , Hirofumi Inoue , Kazuya Kimura , Yukihiko Azuma
发明人： Hiroshi Uchida , Ritsuko Hirakawa , Yoshio Miyajima , Hirofumi Inoue , Kazuya Kimura , Yukihiko Azuma
IPC分类号： C08L75/04 , C08G18/32 , C08L67/00 , C09D11/10 , C09D175/04
CPC分类号： H05K3/285 , C08G18/0823 , C08G18/348 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G18/69 , C08G18/698 , C09D11/106 , C09D175/04 , H05K1/0393
摘要： Disclosed is a carboxyl group-containing polyurethane (A) produced from a polyol (b) containing at least 10 mol % (relative to the total (100 mol %) of the polyol (b)) of a polyol (b1) which: (i) has a number-average molecular weight of 500 to 50,000; (ii) has 1 to 10 hydroxyl groups per molecule; and (iii) is one or a combination of two or more polyols selected from the group consisting of polybutadiene polyol, polyisoprene polyol, hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol. The carboxyl group-containing polyurethane (A) is suitable as materials of cured products, for example cured films, that are excellent in adhesion with substrates, low warpage, flexibility, plating resistance, soldering heat resistance and long-term reliability.
摘要翻译：公开了由多元醇（b）生成的含有羧基的聚氨酯（A），该多元醇（b）含有多元醇（b1）的至少10摩尔％（相对于多元醇（b）的总量（100摩尔％））为：（ i）数均分子量为500〜50,000; （ii）每分子具有1至10个羟基; 和（iii）是选自聚丁二烯多元醇，聚异戊二烯多元醇，氢化聚丁二烯多元醇和氢化聚异戊二烯多元醇的一种或两种以上的多元醇的组合。含羧基的聚氨酯（A）适合作为与基材的粘合性优异，翘曲翘曲，柔韧性，耐电镀性，焊接耐热性，长期可靠性等固化物例如固化膜的材料。

4. 发明授权

US07232876B2 Phosphorus-containing urethane(meth)acrylate compounds and photosensitive compositions 失效
标题翻译：含磷氨基甲酸酯（甲基）丙烯酸酯化合物和感光性组合物
公开(公告)号：US07232876B2
公开(公告)日：2007-06-19
申请号：US10501864
申请日：2003-01-21
申请人： Kenji Tamura , Yoshio Miyajima , Motoyuki Hirata
发明人： Kenji Tamura , Yoshio Miyajima , Motoyuki Hirata
IPC分类号： C08G18/10
CPC分类号： C08G18/755 , C08G18/0823 , C08G18/348 , C08G18/388 , C08G18/3885 , C08G18/3889 , C08G18/4854 , C08G18/5084 , C08G18/6461 , C08G18/672 , C09D175/16 , H05K3/287 , Y10S528/905 , Y10S528/906 , C08G18/64
摘要： A phosphorus-containing urethane (meth)acrylate compound obtained by reacting (A) a polyol compound comprising (A1) a phosphorus-containing polyol having a phosphorus atom, with (B) a bifunctional or greater polyisocyanate and (C) a hydroxyl group-containing (meth)acrylate.
摘要翻译：（A）含有磷原子的含磷多元醇的多元醇化合物与（B）双官能以上的多异氰酸酯和（C）羟基 - （甲基）丙烯酸酯。

5. 发明申请

US20090266585A1 Flame-Retardant Composition for Solder Resist and Cured Product Thereof 审中-公开
标题翻译：阻燃及其固化产品的阻燃组合物
公开(公告)号：US20090266585A1
公开(公告)日：2009-10-29
申请号：US11887394
申请日：2006-03-24
申请人： Yoshio Miyajima
发明人： Yoshio Miyajima
IPC分类号： H05K1/02 , C08J3/28 , G03F7/20 , B05D3/02 , G03F7/004 , B32B27/38 , B32B27/08
CPC分类号： G03F7/032 , G03F7/0047 , G03F7/035 , G03F7/038 , G03F7/0388 , H05K3/287 , Y10T428/31511
摘要： There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble resin comprising either or both (A1) a carboxyl group-containing epoxy (meth)acrylate or (A2) a carboxyl group-containing urethane (meth)acrylate obtained by reacting an epoxy resin with two or more epoxy groups in the molecule (a), an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c), (B) a compound having an ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, (D) a phosphorus-containing epoxy resin having a specific structure and (E) a hydrated metal compound. The composition of the invention can be suitably used as a solder resist or cover lay film for an FPC.
摘要翻译：本发明提供阻燃剂的阻燃剂组合物，其为无卤素且具有高水平的阻燃性和柔韧性，同时具有优异的耐热性，耐湿性和高温可靠性。根据本发明的阻焊剂用阻燃剂组合物包含（A）包含（A1）含羧基的环氧（甲基）丙烯酸酯或（A2）含羧基的氨基甲酸酯（甲基）丙烯酸酯中的任一种或两者的碱溶性树脂）丙烯酸酯通过环氧树脂与分子（a）中的两个或更多个环氧基反应获得，不饱和基团的一元羧酸（b）和多元酸酐（c），（B）具有烯属不饱和基团在分子中，（C）光聚合引发剂，（D）具有特定结构的含磷环氧树脂和（E）水合金属化合物。本发明的组合物可以适合用作FPC的阻焊层或覆盖膜。

6. 发明申请

US20050107556A1 Phosphorus-containing urethane(meth)acrylate compounds and photosensitive compositions 失效
标题翻译：含磷氨基甲酸酯（甲基）丙烯酸酯化合物和感光性组合物
公开(公告)号：US20050107556A1
公开(公告)日：2005-05-19
申请号：US10501864
申请日：2003-01-21
申请人： Kenji Tamura , Yoshio Miyajima , Motoyuki Hirata
发明人： Kenji Tamura , Yoshio Miyajima , Motoyuki Hirata
IPC分类号： G03F7/027 , C08G18/08 , C08G18/34 , C08G18/38 , C08G18/48 , C08G18/50 , C08G18/64 , C08G18/67 , C08G18/75 , C09D175/16 , H05K3/28 , C08F118/02
CPC分类号： C08G18/755 , C08G18/0823 , C08G18/348 , C08G18/388 , C08G18/3885 , C08G18/3889 , C08G18/4854 , C08G18/5084 , C08G18/6461 , C08G18/672 , C09D175/16 , H05K3/287 , Y10S528/905 , Y10S528/906 , C08G18/64
摘要： A phosphorus-containing urethane (meth)acrylate compound obtained by reacting (A) a polyol compound comprising (A1) a phosphorus-containing polyol having a phosphorus atom, with (B) a bifunctional or greater polyisocyanate and (C) a hydroxyl group-containing (meth)acrylate.
摘要翻译：（A）含有磷原子的含磷多元醇的多元醇化合物与（B）双官能以上的多异氰酸酯和（C）羟基 - （甲基）丙烯酸酯。

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