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1. 发明授权

US08227361B2 Prepreg and printed wiring board using thin quartz glass cloth 有权
标题翻译：预浸料和印刷线路板采用薄型石英玻璃布
公开(公告)号：US08227361B2
公开(公告)日：2012-07-24
申请号：US12453029
申请日：2009-04-28
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： B32B17/02 , B32B27/04
CPC分类号： H05K1/0366 , C08J5/24 , H05K1/024 , H05K2201/012 , H05K2201/029 , Y10T442/2418 , Y10T442/2992
摘要： It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.
摘要翻译：本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用预浸料作为绝缘层。

2. 发明授权

US08115105B2 Prepreg and its application products for low thermal expansion and low dielectric tangent 有权
标题翻译：预浸料及其低热膨胀和低介质切线的应用产品
公开(公告)号：US08115105B2
公开(公告)日：2012-02-14
申请号：US12353357
申请日：2009-01-14
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： H05K1/00
CPC分类号： H05K1/0366 , B32B3/08 , B32B3/18 , B32B5/022 , B32B5/024 , B32B15/02 , B32B15/14 , B32B15/20 , B32B17/02 , B32B2260/021 , B32B2260/046 , B32B2262/0253 , B32B2262/101 , B32B2307/202 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/00 , B32B2457/04 , B32B2457/08 , H05K3/4069 , H05K3/4652 , H05K2201/012 , H05K2201/0133 , H05K2201/0278 , H05K2201/068 , Y10T442/2475
摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
摘要翻译：包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中，在50〜100℃下的固化树脂组合物为50ppm /℃以下。公开了印刷电路板，多层电路板和电子部件。

3. 发明申请

US20080261472A1 PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME 审中-公开
标题翻译： PREPREG，多层印刷线路板及使用其的电子部件
公开(公告)号：US20080261472A1
公开(公告)日：2008-10-23
申请号：US12105328
申请日：2008-04-18
申请人： Satoru AMOU , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru AMOU , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： B32B27/04 , B32B5/02 , D03D25/00
CPC分类号： D03D15/0011 , B32B15/08 , B32B27/04 , C08J5/24 , C08J2353/02 , D03D1/0082 , D03D15/00 , D03D15/0027 , D10B2101/06 , D10B2321/02 , D10B2321/021 , D10B2321/022 , D10B2401/041 , D10B2401/063 , D10B2505/02 , H05K1/0366 , H05K3/4626 , H05K2201/0158 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , Y10T442/2475 , Y10T442/30
摘要： A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %.
摘要翻译：预浸料是热固性的。预浸料坯包含热固性树脂组合物A，热固性树脂组合物的固化树脂在1Hz以上表现出0.005以下的介电切线和浸渍有树脂A的基材B，其中，基材B含有聚烯烃纤维 C和纤维D，其拉伸强度高于聚烯烃纤维C的拉伸强度，并且热膨胀系数小于纤维C的热膨胀系数，并且其中基材是织布并且具有溶解速率进入烃有机溶剂小于5重量％。

4. 发明申请

US20090178832A1 PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT 有权
标题翻译： PREPREG及其低热膨胀和低介电常数的应用产品
公开(公告)号：US20090178832A1
公开(公告)日：2009-07-16
申请号：US12353357
申请日：2009-01-14
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： H05K1/03 , B32B27/04
CPC分类号： H05K1/0366 , B32B3/08 , B32B3/18 , B32B5/022 , B32B5/024 , B32B15/02 , B32B15/14 , B32B15/20 , B32B17/02 , B32B2260/021 , B32B2260/046 , B32B2262/0253 , B32B2262/101 , B32B2307/202 , B32B2307/204 , B32B2307/306 , B32B2307/714 , B32B2457/00 , B32B2457/04 , B32B2457/08 , H05K3/4069 , H05K3/4652 , H05K2201/012 , H05K2201/0133 , H05K2201/0278 , H05K2201/068 , Y10T442/2475
摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
摘要翻译：包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 50〜100℃的固化树脂组合物为50ppm /℃以下。公开了印刷电路板，多层电路板和电子部件。

5. 发明授权

US08097545B2 Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition 有权
标题翻译：相分离控制聚丁二烯树脂组合物和使用该树脂组合物的印刷线路板
公开(公告)号：US08097545B2
公开(公告)日：2012-01-17
申请号：US11867091
申请日：2007-10-04
申请人： Satoru Amou , Haruo Akahoshi , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Haruo Akahoshi , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： B32B27/04 , B32B27/00
CPC分类号： B32B5/02 , B32B27/04 , C08F290/06 , C08K5/0025 , C08L53/02 , C08L53/025 , H05K1/032 , H05K1/0373 , H05K3/4626 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10S428/901 , Y10T428/31757 , Y10T442/2631 , Y10T442/2738 , C08L2666/02
摘要： It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same.This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.
摘要翻译：本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。

6. 发明申请

US20090266591A1 Prepreg and printed wiring board using thin quartz glass cloth 有权
标题翻译：预浸料和印刷线路板采用薄型石英玻璃布
公开(公告)号：US20090266591A1
公开(公告)日：2009-10-29
申请号：US12453029
申请日：2009-04-28
申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： H05K1/02 , B32B5/00
CPC分类号： H05K1/0366 , C08J5/24 , H05K1/024 , H05K2201/012 , H05K2201/029 , Y10T442/2418 , Y10T442/2992
摘要： It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.
摘要翻译：本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用预浸料作为绝缘层。

7. 发明申请

US20080090478A1 Phase-Separation-Controlled Polybutadiene Resin Composition and Printed Wiring Board Using the Resin Composition 有权
标题翻译：相分离控制的聚丁二烯树脂组合物和使用该树脂组合物的印刷线路板
公开(公告)号：US20080090478A1
公开(公告)日：2008-04-17
申请号：US11867091
申请日：2007-10-04
申请人： Satoru Amou , Haruo Akahoshi , Hiroshi Shimizu , Akinori Hanawa
发明人： Satoru Amou , Haruo Akahoshi , Hiroshi Shimizu , Akinori Hanawa
IPC分类号： B32B5/02 , B05D3/06 , C08F236/06 , C08F290/06 , C08F4/32 , C08K5/34
CPC分类号： B32B5/02 , B32B27/04 , C08F290/06 , C08K5/0025 , C08L53/02 , C08L53/025 , H05K1/032 , H05K1/0373 , H05K3/4626 , H05K2201/012 , H05K2201/0158 , H05K2201/0209 , Y10S428/901 , Y10T428/31757 , Y10T442/2631 , Y10T442/2738 , C08L2666/02
摘要： It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.
摘要翻译：本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。

8. 发明授权

US09376577B2 Coating composition and coating film forming method 有权
标题翻译：涂料组合物和涂膜成型方法
公开(公告)号：US09376577B2
公开(公告)日：2016-06-28
申请号：US13521800
申请日：2011-01-13
申请人： Hiroshi Shimizu , Norio Fujita
发明人： Hiroshi Shimizu , Norio Fujita
IPC分类号： B05D1/36 , C09D1/00 , C09D7/12 , C09C1/36 , C09C1/40 , C09C1/64 , C08K3/22
CPC分类号： C09D7/1216 , C01P2006/62 , C01P2006/65 , C08K3/22 , C09C1/36 , C09C1/3684 , C09C1/40 , C09C1/64 , C09D7/1266 , C09D7/1275 , C09D7/61 , C09D7/67 , C09D7/68
摘要： The present invention relates to a coating composition containing a colored aluminum pigment and a titanium oxide pigment, wherein in the case where a coating film formed from the coating composition is illuminated at 45 degrees with respect to the surface of the coating film, a ratio of lightness L* of light observed at 45 degrees with respect to specularly reflected light, relative to lightness L* of light observed at 110 degrees with respect to specularly reflected light is within a range of 1.00 to 1.50. The invention further relates to a method for forming a coating film, including steps of applying the above-described coating composition to a substrate; and further applying a clear coating composition thereto.
摘要翻译：本发明涉及一种含有着色铝颜料和氧化钛颜料的涂料组合物，其中在由涂料组合物形成的涂膜相对于涂膜表面以45度照射的情况下，相对于镜面反射光，在相对于镜面反射光110度观察到的光的亮度L *相对于镜面反射光观察到的光的亮度L *在1.00〜1.50的范围内。本发明还涉及一种形成涂膜的方法，包括将上述涂料组合物涂布在基材上的步骤; 并进一步向其施加透明涂料组合物。

9. 发明授权

US09258453B2 Image capturing apparatus for enabling generation of data of panoramic image with wide dynamic range 有权
标题翻译：用于能够生成具有宽动态范围的全景图像的数据的图像捕获装置
公开(公告)号：US09258453B2
公开(公告)日：2016-02-09
申请号：US13432919
申请日：2012-03-28
申请人： Hiroyuki Kato , Jun Muraki , Hiroshi Shimizu , Hiroyuki Hoshino , Erina Ichikawa
发明人： Hiroyuki Kato , Jun Muraki , Hiroshi Shimizu , Hiroyuki Hoshino , Erina Ichikawa
IPC分类号： H04N9/68 , H04N1/387 , H04N5/232 , H04N5/235
CPC分类号： H04N1/3871 , H04N1/3876 , H04N5/23238 , H04N5/2355
摘要： An image capturing apparatus includes an image capturing section, an image capturing control section, an image clipping section, an HDR composing section and a panoramic image composing section. The image capturing control section causes the image capturing section to repeatedly capture an image of different luminance to provide plural images of different luminance. The image clipping section clips respective data of substantially overlapping image regions of the plural images of different luminance. The HDR composing section composes the image regions each clipped by the image clipping section to generate data of plural composite images having a wider dynamic range than the image captured by the image capturing section. The panoramic image composing section joins data of the plural composite images generated by the HDR composing section to generate an image whose range is wider than that of the image captured by the image capturing section.
摘要翻译：一种摄像装置，包括：图像拍摄部，图像拍摄控制部，图像拍摄部，HDR拍摄部，全景图像合成部。图像拍摄控制部使图像拍摄部重复拍摄不同亮度的图像，以提供不同亮度的多个图像。图像剪辑部分剪切不同亮度的多个图像的大致重叠的图像区域的各个数据。 HDR合成部分构成由图像剪切部分剪切的图像区域，以生成具有比由图像捕获部分捕获的图像更宽的动态范围的多个合成图像的数据。全景图像合成部连接由HDR构成部生成的多个合成图像的数据，生成范围比由图像拍摄部拍摄的图像的范围宽的图像。

10. 发明授权

US09199393B2 High-shear melt-kneader and method of high shearing 有权
标题翻译：高剪切熔融捏合机和高剪切方法
公开(公告)号：US09199393B2
公开(公告)日：2015-12-01
申请号：US13147925
申请日：2010-02-02
申请人： Hiroshi Shimizu , Yongjin Li , Yukio Yoshizawa , Takayuki Takahashi , Ken-ichi Toyoshima
发明人： Hiroshi Shimizu , Yongjin Li , Yukio Yoshizawa , Takayuki Takahashi , Ken-ichi Toyoshima
IPC分类号： B29B7/28 , B29B7/14 , B29B7/88
CPC分类号： B29B7/28 , B29B7/14 , B29B7/88
摘要： A high-shear melt-kneader includes a high-shear unit (20) having an internal feedback-type screw (23) configured to apply high-shear stress to a melted resin, resin pressure sensors (33) for configured to detect a front portion resin pressure in the vicinity of an inlet of the internal feedback-type screw and a rear portion resin pressure in the vicinity of an outlet, and a control device configured to appropriately control a material supplying amount, a material temperature, a kneading time, and a screw rotation speed according to pressure values detected by the sensors. The control device controls the conditions such that waveforms with the lapse of time of the front and rear portion resin pressures are similar to each other and show variation to a steady state after formation of a predetermined peak value, and the front and rear portion resin pressures form a predetermined pressure difference with the lapse of time. According to the high-shear melt-kneader, it is possible to improve high-shear efficiency, increase precision of nano dispersion of a material, and stably and finely disperse/mix internal structures of immiscible polymer blend-based, polymer/filler-based and polymer blend/filler-based materials to a nano level.
摘要翻译：高剪切熔融捏合机包括具有内部反馈型螺杆（23）的高剪切单元（20），该内部反馈型螺杆（23）被配置为向熔融树脂施加高剪切应力;树脂压力传感器（33），用于检测前端在内反馈型螺杆的入口附近的部分树脂压力和出口附近的后部树脂压力，以及控制装置，其被配置为适当地控制材料供给量，材料温度，混炼时间，以及根据由传感器检测的压力值的螺杆转速。控制装置控制使得前后树脂压力经过时间的波形彼此相似的条件，并且在形成预定峰值之后显示到稳定状态的变化，并且前部和后部树脂压力随着时间的流逝形成预定的压力差。根据高剪切熔融捏合机，可以提高高剪切效率，提高材料的纳米分散体的精度，并且可以稳定和细分散/混合不混溶聚合物共混物，基于聚合物/填料的内部结构和聚合物共混物/填料基材料达到纳米级。

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