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1. 发明申请

US20060170094A1 Semiconductor package integral heat spreader 审中-公开
标题翻译：半导体封装一体式散热器
公开(公告)号：US20060170094A1
公开(公告)日：2006-08-03
申请号：US11050330
申请日：2005-02-02
申请人： Sankara Subramanian , Abhay Watwe
发明人： Sankara Subramanian , Abhay Watwe
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L21/563 , H01L23/3733 , H01L23/42 , H01L25/0655 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： An integral heat spreader is disclosed wherein its physical characteristics are modified in regions between adjacent semiconductor devices. The modification improves the reliability of the semiconductor devices by reducing stiffness of the integral heat spreader.
摘要翻译：公开了一种整体散热器，其中其物理特性在相邻半导体器件之间的区域中被修改。该修改通过降低整体散热器的刚度来提高半导体器件的可靠性。

3. 发明申请

US20060127672A1 Method of providing a heat spreader 审中-公开
标题翻译：提供散热器的方法
公开(公告)号：US20060127672A1
公开(公告)日：2006-06-15
申请号：US11355698
申请日：2006-02-15
申请人： Gregory Chrysler , Abhay Watwe , Ravi Mahajan
发明人： Gregory Chrysler , Abhay Watwe , Ravi Mahajan
IPC分类号： B32B9/00
CPC分类号： B32B15/04 , C23C16/56 , H01L23/36 , H01L23/3732 , H01L2224/16 , H01L2224/73253 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , Y10T428/30 , Y10T428/31678 , H01L2924/00
摘要： A method of preparing a diamond body, and a diamond body thus prepared. A covering layer is provided on at least one surface of the diamond body such that the covering layer adheres to the at least one surface. The covering layer is in turn provided with a predetermined configuration.
摘要翻译：一种制备金刚石体的方法，以及如此制备的金刚石体。覆盖层设置在金刚石主体的至少一个表面上，使得覆盖层粘附到至少一个表面。覆盖层依次具有预定的构造。

4. 发明授权

US06504721B1 Thermal cooling apparatus 失效
标题翻译：热冷却装置
公开(公告)号：US06504721B1
公开(公告)日：2003-01-07
申请号：US09676099
申请日：2000-09-29
申请人： Abhay Watwe , Ravi Prasher
发明人： Abhay Watwe , Ravi Prasher
IPC分类号： H05K720
CPC分类号： G06F1/203
摘要： A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the heat generated by the heat source. The heat is then transferred via the vapor chamber to a plurality of fins attached to the vapor chamber. If a heat sink is provided, the heat is also transferred via the vapor chamber to the heat sink. The heat sink can also include a plurality of fins. The fins and the heat sink then convectively dissipate the heat to the atmosphere.
摘要翻译：提供一种用于冷却电子设备中的热源的方法和装置。该装置包括在第一端具有热源的蒸气室。可以在蒸气室的第二端设置散热器。蒸气室吸收热源产生的热量。然后将热量通过蒸气室转移到附接到蒸气室的多个散热片。如果提供散热器，则热量也通过蒸气室传递到散热器。散热器还可以包括多个翅片。散热片和散热片然后将热量散发到大气中。

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