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1. 发明申请

US20110188694A1 VARIABLE DIRECTIONAL MICROPHONE ASSEMBLY AND METHOD OF MAKING THE MICROPHONE ASSEMBLY 审中-公开
标题翻译：可变方向麦克风组件及制作麦克风组件的方法
公开(公告)号：US20110188694A1
公开(公告)日：2011-08-04
申请号：US12663182
申请日：2008-08-29
申请人： Sang-Ho Lee , Hyoung-Ho Kim
发明人： Sang-Ho Lee , Hyoung-Ho Kim
IPC分类号： H04R1/02 , H04R31/00
CPC分类号： H04R1/406 , H04R31/00 , Y10T29/49005
摘要： A variable directional microphone assembly and method of manufacturing the same, which includes a printed circuit board including a connection terminal provided to a surface thereof, and a semiconductor integrated circuit device mounted to another surface thereof, a microphone body including a first mounting space for mounting the semiconductor integrated circuit device, two second mounting spaces, and a coil spring insertion hole, the first mounting space being provided to a surface of the microphone body, the second mounting spaces being provided to another surface of the microphone body, two microphone devices mounted to the second mounting spaces, the insertion hole allowing the microphone device to be in contact with the printed circuit board, a coil spring inserted into the coil spring insertion hole to electrically connect the microphone device to the printed circuit board, and a case including a sound hole in a bottom thereof.
摘要翻译：一种可变方向性麦克风组件及其制造方法，包括：印刷电路板，包括设置在其表面上的连接端子;以及半导体集成电路装置，安装在其另一表面;麦克风主体，包括用于安装的第一安装空间所述半导体集成电路装置，两个第二安装空间和螺旋弹簧插入孔，所述第一安装空间设置在所述麦克风主体的表面上，所述第二安装空间设置在所述麦克风主体的另一个表面上，安装有两个麦克风装置到第二安装空间，允许麦克风装置与印刷电路板接触的插入孔，插入到螺旋弹簧插入孔中以将麦克风装置电连接到印刷电路板的螺旋弹簧和包括在其底部的声孔。

2. 发明授权

US08685797B2 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof 有权
标题翻译：具有封装和底部填充的集成电路封装系统及其制造方法
公开(公告)号：US08685797B2
公开(公告)日：2014-04-01
申请号：US13597086
申请日：2012-08-28
申请人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
发明人： Soo-San Park , Sang-Ho Lee , DaeSik Choi
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49811 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.
摘要翻译：一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除由升高的部分分离而产生的表面。

3. 发明申请

US20120261810A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER 有权
标题翻译：集成电路封装系统与WAFERSCALE SPACER
公开(公告)号：US20120261810A1
公开(公告)日：2012-10-18
申请号：US13536268
申请日：2012-06-28
申请人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
发明人： Sang-Ho Lee , Jong-Woo Ha , Soo-San Park
IPC分类号： H01L23/50
CPC分类号： H01L25/0657 , H01L24/73 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2924/01067 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.
摘要翻译：提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

4. 发明授权

US08254933B2 Apparatus and method for handover between a heterogeneous communication system and a broadband wireless communication system 有权
标题翻译：异构通信系统与宽带无线通信系统之间切换的装置和方法
公开(公告)号：US08254933B2
公开(公告)日：2012-08-28
申请号：US12029809
申请日：2008-02-12
申请人： Young-Hak Choi , Pyeong-Hwan Wee , Sang-Jun Lee , Jae-Yeong Kwon , Sang-Ho Lee
发明人： Young-Hak Choi , Pyeong-Hwan Wee , Sang-Jun Lee , Jae-Yeong Kwon , Sang-Ho Lee
IPC分类号： H04Q7/20
CPC分类号： H04W36/18 , H04W36/0022 , H04W36/0072 , H04W36/14 , H04W36/30 , H04W88/06 , H04W88/10
摘要： An apparatus and a method for handover between a broadband wireless communication system and a heterogeneous communication system are provided. An operating method of a base station for the handover between a broadband wireless communication system and a and a heterogeneous communication system includes when a terminal enters a border cell, sending a message requesting to measure a signal level of a downlink, to the terminal, when a signal level measured by the terminal falls below a preset threshold, requesting a handover, to a corresponding heterogeneous communication system, over a core network, receiving a message, including channel allocation information for the handover, from the corresponding heterogeneous communication system, and forwarding the message, including the channel allocation information, to the terminal. Hence, when the terminal gets out of the service coverage area of the broadband wireless communication system, it can be handed over to the heterogeneous communication system seamlessly.
摘要翻译：提供了宽带无线通信系统与异构通信系统之间切换的装置和方法。用于宽带无线通信系统和异构通信系统之间的切换的基站的操作方法包括当终端进入边界小区时，向终端发送请求测量下行链路的信号电平的消息，当时由终端测量的信号电平低于预设阈值，通过核心网请求切换到相应的异构通信系统，从对应的异构通信系统接收包括用于切换的信道分配信息的消息，以及转发向终端发送包括信道分配信息的消息。因此，当终端离开宽带无线通信系统的服务覆盖区域时，可以无缝地切换到异构通信系统。

5. 发明授权

US08067307B2 Integrated circuit package system for stackable devices 有权
标题翻译：用于堆叠设备的集成电路封装系统
公开(公告)号：US08067307B2
公开(公告)日：2011-11-29
申请号：US12037291
申请日：2008-02-26
申请人： DaeSik Choi , Sang-Ho Lee , Soo-San Park
发明人： DaeSik Choi , Sang-Ho Lee , Soo-San Park
IPC分类号： H01L21/44 , H01L23/28
CPC分类号： H01L23/3128 , H01L23/4951 , H01L23/49551 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2223/6677 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06596 , H01L2225/1023 , H01L2225/1058 , H01L2924/01013 , H01L2924/078 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.
摘要翻译：一种集成电路封装系统，包括：提供封装管芯; 以及将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

6. 发明申请

US20100061288A1 METHOD FOR PROVIDING MULTICAST BROADCAST SERVICE IN COMMUNICATION SYSTEM 有权
标题翻译：在通信系统中提供多播广播服务的方法
公开(公告)号：US20100061288A1
公开(公告)日：2010-03-11
申请号：US12517350
申请日：2007-09-21
申请人： Mi-Young Yun , Jung-Mo Moon , Sang-Ho Lee
发明人： Mi-Young Yun , Jung-Mo Moon , Sang-Ho Lee
IPC分类号： H04H20/71
CPC分类号： H04J3/0647 , H04J3/0682 , H04W4/06 , H04W56/00 , H04W76/40
摘要： In a communication system, a plurality of radio access systems (RASs) respectively receives connection resources from an MBS server for transmitting a multicast broadcast data packet. The MBS server is involved in transmission of the multicast broadcast data packet. Then, the plurality of RASs receive the multicast broadcast data packet including parameters for synchronization between the plurality of RASs and parameters for size and location of the multicast broadcast data packet and deliver the received multicast broadcast data packet to a portable subscriber station (PSS). Thereby, the plurality of RASs can transmit the multicast broadcast data packets with the same location and the same size to the PSSs at the same time.
摘要翻译：在通信系统中，多个无线接入系统（RAS）分别从用于发送组播广播数据分组的MBS服务器接收连接资源。 MBS服务器涉及组播广播数据包的传输。然后，多个RAS接收组播广播数据分组，其包括用于多个RAS之间的同步的参数和用于组播广播数据分组的大小和位置的参数，并将接收到的多播广播数据分组传送到便携式用户台（PSS）。因此，多个RAS可以同时发送具有相同位置和相同大小的多播广播数据分组给PSS。

7. 发明申请

US20090140408A1 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT 审中-公开
标题翻译：集成电路封装系统，具有通过互连的堆叠
公开(公告)号：US20090140408A1
公开(公告)日：2009-06-04
申请号：US11948060
申请日：2007-11-30
申请人： Taewoo Lee , Sang-Ho Lee , Soo-San Park
发明人： Taewoo Lee , Sang-Ho Lee , Soo-San Park
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L25/105 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/206
摘要： An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected.
摘要翻译：集成电路封装封装系统包括：提供具有底部衬底的底部集成电路封装系统; 安装顶部集成电路封装系统，该系统在底部集成电路封装系统上具有顶部衬底; 通过顶部基板形成顶部堆叠通孔; 将底部堆叠通孔形成底部集成电路封装系统到底部基板; 以及通过经由对齐和连接的顶部堆叠通孔和底部堆叠的互连形成堆叠。

8. 发明申请

US20090103799A1 PATTERN MATCHING METHOD IN MANUFACTURING SEMICONDUCTOR MEMORY DEVICES 有权
标题翻译：制造半导体存储器件中的图案匹配方法
公开(公告)号：US20090103799A1
公开(公告)日：2009-04-23
申请号：US12253618
申请日：2008-10-17
申请人： Chan-Kyeong Hyon , Young-Seog Kang , Sang-Ho Lee , Hyun-Jong Lee
发明人： Chan-Kyeong Hyon , Young-Seog Kang , Sang-Ho Lee , Hyun-Jong Lee
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G03F1/84
摘要： A pattern matching method for use in manufacturing a semiconductor memory device increases a pattern matching rate between a GDS image and an SEM image. The pattern matching method includes extracting a scanning electron microscope (SEM) image and a graphic data system (GDS) image to perform a pattern matching; performing a two-dimensional furrier transform (FFT) for the extracted GDS image and analyzing a low spatial frequency; deciding whether or not a pattern is a repeated pattern or non-repeated pattern by using the analyzed low spatial frequency; and limiting an X/Y range for a pattern matching when the decision result is for the repeated pattern, and then performing the pattern matching between the SEM image and the GDS image.
摘要翻译：用于制造半导体存储器件的图案匹配方法增加了GDS图像和SEM图像之间的图案匹配率。模式匹配方法包括提取扫描电子显微镜（SEM）图像和图形数据系统（GDS）图像以执行模式匹配; 对所提取的GDS图像执行二维傅立叶变换（FFT），并分析低空间频率; 通过使用所分析的低空间频率来确定图案是否是重复图案或非重复图案; 并且当判定结果用于重复图案时，限制用于模式匹配的X / Y范围，然后执行SEM图像和GDS图像之间的图案匹配。

9. 发明申请

US20090091042A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING DIE HAVING RELIEVED ACTIVE REGION 有权
标题翻译：集成电路封装系统，包括具有可移动活动区域的DIE
公开(公告)号：US20090091042A1
公开(公告)日：2009-04-09
申请号：US12235111
申请日：2008-09-22
申请人： Byung Tai Do , Sang-Ho Lee , Jong Wook Ju
发明人： Byung Tai Do , Sang-Ho Lee , Jong Wook Ju
IPC分类号： H01L23/49 , H01L21/60
CPC分类号： H01L24/33 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L29/0657 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/4809 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2225/0651 , H01L2225/06555 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/078 , H01L2924/10156 , H01L2924/10157 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An integrated circuit package system includes: providing a substrate; attaching a base die to the substrate, the base die having a relief region with a shaped cross-section; and connecting a bond wire between an active base surface of the base die and the substrate, the bond wire extending through the shaped cross-section of the relief region.
摘要翻译：集成电路封装系统包括：提供衬底; 将基模连接到基板上，基模具有具有成形横截面的浮雕区域; 以及将所述基模的活性基底表面和所述基底之间的接合线连接，所述接合线延伸穿过所述浮雕区域的形状横截面。

10. 发明申请

US20090057862A1 INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH CARRIER INTERPOSER 有权
标题翻译：集成电路封装系统与载体插接器
公开(公告)号：US20090057862A1
公开(公告)日：2009-03-05
申请号：US11849127
申请日：2007-08-31
申请人： Jong-Woo Ha , BumJoon Hong , Sang-Ho Lee , Soo-San Park
发明人： Jong-Woo Ha , BumJoon Hong , Sang-Ho Lee , Soo-San Park
IPC分类号： H01L23/538 , H01L21/56
CPC分类号： H01L25/03 , H01L23/3128 , H01L24/73 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2225/06558 , H01L2924/14 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H01L2924/19107 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.
摘要翻译：集成电路封装包装系统包括：将集成电路装置安装在封装载体上; 形成子组件，其包括：提供集成电路封装系统，其具有其上具有集成电路管芯的载体插入器，以及将器件安装在所述载体插入器下; 将组件安装在集成电路装置上; 并将该组件和该集成电路器件封装在该封装载体上。

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