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    • 2. 发明授权
    • Rotator for a module integrated circuit (IC) handler
    • 用于模块集成电路(IC)处理器的转子
    • US06479982B1
    • 2002-11-12
    • US09449574
    • 1999-11-29
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • G01R3102
    • H01L21/67742G01R31/2808
    • There is disclosed a rotator for a module IC handler, including a loading side rotator for 90-degrees changing a direction of a carrier and supplying it to the inside of a heating chamber, and an unloading side rotator for 90-degrees changing a direction of the carrier after being vertically contacted in a test site and for transferring it to the unloading location. The rotator according to the invention includes a loading side rotator, and an unloading side rotator, the loading side rotator having a driving unit, a transferring member, a holding unit for holding or releasing the carrier, and a removal/insertion unit for introducing or discharging the transferring member into or from the rotating plate, the unloading side rotator having a rotating plate, a driving unit and a holding unit.
    • 公开了一种用于模块IC处理器的旋转器,包括用于90度改变载体的方向并将其供应到加热室内部的装载侧旋转器,以及用于90度改变方向的卸载侧旋转器 载体在试验部位垂直接触并将其转移到卸载位置。 根据本发明的旋转器包括装载侧旋转器和卸载侧旋转器,装载侧旋转器具有驱动单元,传送构件,用于保持或释放载体的保持单元,以及用于引入或 将转印构件排出旋转板或从旋转板排出,卸载侧旋转体具有旋转板,驱动单元和保持单元。
    • 3. 发明授权
    • Method for handling a module IC and a carrier of a module IC handler
    • 用于处理模块IC和模块IC处理程序的载体的方法
    • US06498472B1
    • 2002-12-24
    • US09449636
    • 1999-11-30
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • G01R3102
    • H01L21/67271G01R31/2887
    • There is disclosed a method for handling a module IC and a carrier of a module IC handler used for transferring the carrier containing a plurality of module ICs between the processes. While a separate carrier containing the produced module ICs is transferred between the processes, the tests for the module ICs are performed. Thus, the reliability of the product discharged can be further improved, and the operation rate of a high-cost test apparatus is maximized. For this, a plurality of module ICs 1 vertically loaded in the carrier are transferred inside a heating chamber 22, the tests for the module ICs 1 are conducted at a test site 7 under the state that the module ICs 1 are contained in the carrier 18, and then at an unloading position 20, the module ICs having been tested are held by pick-up means 8 in an unloading side and classified based upon the test results and the classified module ICs are placed in customer trays 9.
    • 公开了一种用于处理模块IC的模块IC的处理器的方法和用于在所述处理之间传送包含多个模块IC的载体的模块IC处理器的载体。 虽然在这些过程之间传送包含所产生的模块IC的单独的载体,但是对模块IC进行测试。 因此,可以进一步提高放电产品的可靠性,并且使成本高的测试装置的操作率最大化。 为此,垂直装载在载体上的多个模块IC1被传送到加热室22内,模块IC1的测试在模块IC1被包含在载体18中的状态下在测试地点7进行 ,然后在卸载位置20,已经被测试的模块IC由卸载侧的拾取装置8保持,并且基于测试结果进行分类,并且将分类的模块IC放置在客户托盘9中。
    • 4. 发明授权
    • Carrier handling apparatus of an IC module handler
    • IC模块处理器的载体处理装置
    • US06471462B1
    • 2002-10-29
    • US09449573
    • 1999-11-29
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • Sang Soo LeeWan Gu LeeJong Won KimHee Soo KimYoung Hak OhDong Chun Lee
    • G01R3126
    • H01L21/68G01R31/2808H01L21/67766
    • A carrier handling apparatus of an IC module handler includes a carrier transferring unit for holding one side of the carrier to transfer the same between the various processes, and a carrier positioning unit for precisely positioning the carrier. The carrier handling apparatus includes a carrier for transferring predetermined modules, a carrier transferring unit for transferring the carrier from a loading location to an unloading location, and a carrier positioning unit for precisely positioning the carrier in the loading and unloading locations, thereby allowing IC modules contained in a tray to be accurately loaded into the carrier or unloaded therefrom by a pick-up means. According to another aspect of the present invention, a slider is installed to be moved along the traveling path of the carrier, and is provided with a pair of fingers that can be withdrawn or spread by one cylinder, so that the area required to install the carrier transferring apparatus can be minimized. Further, since the carrier is accurately positioned before the pick-up means loads and unloads the IC modules in the loading and unloading locations, any troubles which may be caused due to position inaccuracies during the loading and unloading of the IC modules can be prevented in advance, thereby maximizing the operation rate of the apparatus.
    • IC模块处理器的载体处理装置包括载体传送单元,用于保持载体的一侧在各种处理之间传送载体;以及载体定位单元,用于精确地定位载体。 载体处理装置包括用于传送预定模块的载体,用于将载体从装载位置转移到卸载位置的载体传送单元和用于将载体精确地定位在装载和卸载位置的载体定位单元,由此允许IC模块 容纳在托盘中以被精确地装载到托架中或通过拾取装置从其中卸载。 根据本发明的另一方面,滑块被安装成沿着承载件的移动路径移动,并且设置有可以由一个气缸抽出或扩展的一对手指,使得安装 载体传送装置可以最小化。 此外,由于在拾取装置在装载和卸载位置装载和卸载IC模块之前载体被准确定位,所以可以防止由于在IC模块的装载和卸载期间的位置不准确而引起的任何故障 从而使设备的操作速度最大化。