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    • 6. 发明申请
    • CHIP FOR INSPECTING TOXICITY AND EFFICACY
    • 用于检查毒性和效力的芯片
    • US20110207205A1
    • 2011-08-25
    • US12760131
    • 2010-04-14
    • Sang Jin KIMJeong Suong YANGBo Sung KU
    • Sang Jin KIMJeong Suong YANGBo Sung KU
    • C12M1/34
    • G01N33/5302B01J19/0046B01J2219/00722G01N33/54373
    • Disclosed herein is a chip for inspecting toxicity and efficacy, including: a first substrate including fitting holes formed at corners thereof; and a second substrate including gap forming members formed at corners thereof corresponding to the fitting holes to form a gap between the first substrate and the second substrate, and protrusions formed on the gap forming members corresponding to the fitting holes and fitted in the fitting holes. The chip for inspecting toxicity and efficacy is advantageous in that alignment of the chip can be easily performed, in that problems with the emission of fluorescence or the penetration of measuring light in the chip can be solved, and in that the cost of producing the chip can be reduced.
    • 本文公开了一种用于检查毒性和功效的芯片,包括:第一基板,包括在其角部处形成的装配孔; 以及第二基板,其包括形成在其对应于所述装配孔的角部处的间隙形成部件,以在所述第一基板和所述第二基板之间形成间隙,以及形成在所述间隙形成部件上的对应于所述装配孔并且嵌合在所述装配孔中的突起。 用于检查毒性和功效的芯片的优点在于可以容易地进行芯片的对准,因为可以解决荧光发射或测量光在芯片中的穿透的问题,并且生产芯片的成本 可以减少
    • 10. 发明申请
    • FABRICATION METHOD OF THIN FILM DEVICE
    • 薄膜装置的制造方法
    • US20100151627A1
    • 2010-06-17
    • US12503004
    • 2009-07-14
    • Sang Jin KIMYongSoo OHHwan-Soo LEE
    • Sang Jin KIMYongSoo OHHwan-Soo LEE
    • H01L21/78H01L21/50
    • H01L27/1266H01L27/1214H01L27/1218H01L29/78603
    • A method for fabricating a thin film device includes the step of forming a sacrificial layer on a first substrate. A portion other than a region of the sacrificial layer is selectively removed. A material film is formed on the sacrificial layer to be connected to the first substrate via the selectively removed region. The material film portion filled in the selectively removed region is provided as an anchor. A thin film lamination is formed on the material film. The desired thin film device is formed by using a selective etching process. After removing the sacrificial layer, the thin film device floats over the first substrate with being supported by the anchor. A support body is temporarily attached on the thin film lamination. The thin film device is transferred to the support body onto a second substrate.
    • 制造薄膜器件的方法包括在第一衬底上形成牺牲层的步骤。 选择性地除去除了牺牲层的区域之外的部分。 在牺牲层上形成材料膜,以经由选择性去除的区域连接到第一衬底。 填充在选择性去除区域中的材料膜部分被设置为锚固件。 在材料膜上形成薄膜层压体。 通过使用选择性蚀刻工艺形成所需的薄膜器件。 在去除牺牲层之后,薄膜装置在被锚固件支撑的情况下漂浮在第一基板上。 支撑体临时附着在薄膜层压板上。 薄膜器件被转移到支撑体上到第二衬底上。