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    • 1. 发明授权
    • Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
    • 激光干涉测量端点检测与无窗抛光垫的化学机械抛光工艺
    • US06565416B2
    • 2003-05-20
    • US09805860
    • 2001-03-13
    • Samuel Vance DuntonYizhi Xiong
    • Samuel Vance DuntonYizhi Xiong
    • B24B4900
    • B24B37/013B24B49/12B24D7/12
    • A multi-platen chemical-mechanical polishing system is used to polish a wafer. The wafer is polished at a first station. During polishing, an endpoint is detected. The endpoint is detected by generating optical radiation by a first light source. The first optical radiation travels through a translucent area in a surface of a first platen and travels through a first polishing pad. After being reflected by the wafer, the optical radiation returns through the first polishing pad through the translucent window to a first optical radiation detector. The first polishing pad has a uniform surface in that no part of the surface of the first polishing pad includes transparent material through which non-scattered optical radiation originating from the first light source can pass and be detected by the first optical radiation detector. Optical radiation that travels through the first polishing pad and is detected by the first optical radiation detector is haze scattered by inclusions within the first polishing pad. Non-scattered light is absorbed by the first polishing pad. The wafer is also polished at a second station. During polishing a final endpoint is detected. The final endpoint is detected by generating optical radiation by a second light source. The second optical radiation travels through a translucent area in a surface of a second platen and travels through a window embedded in a second polishing pad. After being reflected by the wafer, the optical radiation returns through the window embedded in the second polishing pad, through the translucent area in the surface of the second platen, to a second optical radiation detector.
    • 多台板化学机械抛光系统用于抛光晶片。 晶片在第一站被抛光。 在抛光期间,检测到一个端点。 通过由第一光源产生光辐射来检测端点。 第一光辐射穿过第一压板的表面中的半透明区域并且穿过第一抛光垫。 在被晶片反射之后,光辐射通过第一抛光垫通过半透明窗口返回到第一光学辐射检测器。 第一抛光垫具有均匀的表面,因为第一抛光垫的表面的任何部分都不包括透明材料,通过该透明材料,源自第一光源的非散射光辐射可以通过第一光学辐射检测器检测。 穿过第一抛光垫并由第一光学辐射检测器检测的光辐射是由第一抛光垫内的夹杂物散射的雾。 非散射光被第一抛光垫吸收。 晶片也在第二站抛光。 在抛光期间,检测到最终的终点。 通过由第二光源产生光辐射来检测最终端点。 第二光辐射穿过第二压板的表面中的半透明区域并且穿过嵌入第二抛光垫中的窗口。 在被晶片反射之后,光学辐射通过嵌入第二抛光垫中的窗口通过第二压板的表面中的半透明区域返回到第二光学辐射检测器。
    • 2. 发明授权
    • Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
    • US06224460B1
    • 2001-05-01
    • US09340487
    • 1999-06-30
    • Samuel Vance DuntonYizhi Xiong
    • Samuel Vance DuntonYizhi Xiong
    • B24B4900
    • B24B37/013B24B49/12B24D7/12
    • A multi-platen chemical-mechanical polishing system is used to polish a wafer. The wafer is polished at a first station. During polishing, an endpoint is detected. The endpoint is detected by generating optical radiation by a first light source. The first optical radiation travels through a translucent area in a surface of a first platen and travels through a first polishing pad. After being reflected by the wafer, the optical radiation returns through the first polishing pad through the translucent window to a first optical radiation detector. The first polishing pad has a uniform surface in that no part of the surface of the first polishing pad includes transparent material through which non-scattered optical radiation originating from the first light source can pass and be detected by the first optical radiation detector. Optical radiation that travels through the first polishing pad and is detected by the first optical radiation detector is haze scattered by inclusions within the first polishing pad. Non-scattered light is absorbed by the first polishing pad. The wafer is also polished at a second station. During polishing a final endpoint is detected. The final endpoint is detected by generating optical radiation by a second light source. The second optical radiation travels through a translucent area in a surface of a second platen and travels through a window embedded in a second polishing pad. After being reflected by the wafer, the optical radiation returns through the window embedded in the second polishing pad, through the translucent area in the surface of the second platen, to a second optical radiation detector.
    • 5. 发明授权
    • Segment protection scheme for a network
    • 网络的分段保护方案
    • US07398321B2
    • 2008-07-08
    • US10439898
    • 2003-05-13
    • Chunming QiaoDahai XuYizhi Xiong
    • Chunming QiaoDahai XuYizhi Xiong
    • G06F15/173
    • H04L45/24H04J14/0227H04J14/0245H04J14/0249H04J14/0284H04J14/0286H04J14/0287H04J14/029H04J14/0291H04L45/02H04L45/22H04L45/28H04Q11/0062H04Q2011/0077H04Q2011/0081
    • This invention broadly comprises a novel segment protection scheme (survivability framework) for a network, which we refer to as PROMISE (Protection using MultIple SEgments). It combines the best of existing link and path protection schemes (e.g., bandwidth efficiency and fast recovery). The PROMISE approach divides an active path or AP (along which a survivable connection is established) into several, possibly overlapping active segments or ASs, and then protects each AS with a detour called backup segment or BS (instead of protecting the AP as a whole as in path protection schemes). This facilitates the bandwidth sharing not only among the BSs for different APs, but also among those for the same AP. In addition, recovery time can be shortened due to the limited length of each AS and BS. This technology can be applied to MPLS, ATM, SONET, WDM and other high-speed link layers under the evolving G-MPLS framework.
    • 本发明广泛地包括用于网络的新颖的段保护方案(生存性框架),我们称之为PROMISE(使用多重节点保护)。 它结合了现有的最佳链路和路径保护方案(例如,带宽效率和快速恢复)。 PROMISE方法将活动路径或AP(其中建立了可行的连接)划分成若干可能重叠的活动段或AS,然后以称为备份段或BS的绕路保护每个AS(而不是整体保护AP) 如路径保护方案)。 这不仅有助于不同AP的BS之间的带宽共享,而且在同一个AP的带宽共享之间。 此外,由于每个AS和BS的长度有限,可以缩短恢复时间。 该技术可以在不断变化的G-MPLS框架下应用于MPLS,ATM,SONET,WDM等高速链路层。