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    • 10. 发明授权
    • Semiconductor devices and methods of fabricating the same
    • 半导体器件及其制造方法
    • US09123774B2
    • 2015-09-01
    • US14162481
    • 2014-01-23
    • Samsung Electronics Co., Ltd.
    • Sung-Dae SukHeesoo KangSungil ParkChangwoo Oh
    • H01L29/66H01L29/40H01L21/3205H01L21/764H01L29/78
    • H01L21/764H01L29/66545H01L29/66795H01L29/785
    • Provided is a semiconductor device, which includes a gate electrode crossing over a semiconductor fin disposed on a substrate, a gate dielectric layer disposed between the gate electrode and the semiconductor fin, a channel region having a three dimensional structure defined in the semiconductor fin under the gate electrode, impurity regions disposed in the semiconductor fin at both sides of the gate electrode and spaced apart from the gate electrode, a first interlayer dielectric layer covering an entire surface of the substrate, except for the gate electrode, first contact plugs passing through the first interlayer dielectric layer and contacting the impurity regions, and a second interlayer dielectric layer covering the gate electrode and partially filling a space between the gate electrode and the impurity regions to define an air gap between the gate electrode and the impurity regions.
    • 提供了一种半导体器件,其包括跨越设置在衬底上的半导体翅片上的栅极电极,设置在栅极电极和半导体鳍片之间的栅极电介质层,具有限定在半导体鳍片下方的三维结构的沟道区域 栅极电极,设置在栅电极两侧并与栅电极间隔开的半导体鳍片中的杂质区域,除了栅电极之外覆盖基板整个表面的第一层间电介质层,穿过第 第一层间电介质层和与杂质区接触的第二层间电介质层和覆盖栅电极并部分地填充栅电极和杂质区之间的空间的第二层间电介质层,以限定栅电极和杂质区之间的气隙。