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    • 4. 发明授权
    • Memory device
    • US11723208B2
    • 2023-08-08
    • US17695186
    • 2022-03-15
    • Samsung Electronics Co., Ltd.
    • Kyunghwa YunPansuk KwakChanho KimDongku Kang
    • G11C11/00H10B43/40G11C16/08G11C7/18H10B41/10H10B41/27H10B41/35H10B41/41H10B43/10H10B43/27H10B43/35
    • H10B43/40G11C7/18G11C16/08H10B41/10H10B41/27H10B41/35H10B41/41H10B43/10H10B43/27H10B43/35
    • A memory device comprises a peripheral circuit region including a first substrate and circuit elements on the first substrate, the circuit elements including a row decoder, and a memory cell region including a cell array region and a cell contact region, wherein the cell array region includes wordlines, stacked on a second substrate on the peripheral circuit region, and channel structures extending in a direction perpendicular to an upper surface of the second substrate and penetrating the wordlines, wherein the cell contact region includes cell contacts connected to the wordlines and on both sides of the cell array region in a first direction parallel to the upper surface of the second substrate, the cell contacts including a first cell contact region and a second cell contact region, the first and second cell contact regions having different lengths to each other in the first direction, wherein each of the first and second cell contact regions includes first pads having different lengths than each other in the first direction, and second pads different from the first pads, wherein the cell contacts are connected to the wordlines in the first pads, wherein the number of the second pads included in the first cell contact region is greater than the number of the second pads included in the second cell contact region, and wherein the memory cell region includes a first metal pad and the peripheral circuit region includes a second metal pad, and the memory cell region and the peripheral circuit region are vertically connected to each other by the first metal pad and the second metal pad.
    • 9. 发明授权
    • Program methods of memory devices using bit line sharing
    • 使用位线共享的存储器件的编程方法
    • US09396797B2
    • 2016-07-19
    • US14151534
    • 2014-01-09
    • Samsung Electronics Co., Ltd.
    • Dongku Kang
    • G11C11/34G11C16/10G11C16/34G11C16/24
    • G11C7/12G11C7/065G11C16/10G11C16/24G11C16/3459
    • A program method of a nonvolatile memory device includes loading first word line data to be stored in first memory cells connected to a first word line and second word line data to be stored in second memory cells connected to a second word line; setting up upper bit lines according to the first word line data; turning off bit line sharing transistors after the upper bit lines are set up; setting up lower bit lines according to the second word line data; performing a first program operation on the first memory cells using the upper bit lines; turning on the bit line sharing transistors; and performing a second program operation on the second memory cells using the lower bit lines. The bit line sharing transistors electrically connect the upper bit lines and the lower bit lines in response to a bit line sharing signal.
    • 一种非易失性存储装置的编程方法包括将要存储在连接到第一字线的第一存储单元中的第一字线数据和要存储在连接到第二字线的第二存储单元中的第二字线数据进行加载; 根据第一字线数据设置高位线; 在高位线建立之后关闭位线共享晶体管; 根据第二字线数据设置低位线; 使用高位线对所述第一存储器单元执行第一编程操作; 打开位线共享晶体管; 以及使用所述下位线对所述第二存储器单元执行第二编程操作。 位线共享晶体管响应于位线共享信号而电连接高位线和低位线。