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1. 发明授权

US11901348B2 Semiconductor package and method of manufacturing the semiconductor package 有权
公开(公告)号：US11901348B2
公开(公告)日：2024-02-13
申请号：US17376865
申请日：2021-07-15
申请人： Samsung Electronics Co., Ltd.
发明人： Tae-Ho Kang , Bo-Seong Kim
IPC分类号： H01L25/18 , H01L25/00 , H01L23/00 , H01L23/16 , H01L25/065 , H01L21/48 , H01L23/498 , H01L21/56 , H01L23/31 , H01L23/24
CPC分类号： H01L25/18 , H01L21/4857 , H01L23/16 , H01L23/49822 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/48 , H01L24/73 , H01L24/96 , H01L25/065 , H01L25/50 , H01L21/568 , H01L23/24 , H01L23/3121 , H01L23/49816 , H01L24/32 , H01L24/83 , H01L2224/04105 , H01L2224/05554 , H01L2224/12105 , H01L2224/16227 , H01L2224/2402 , H01L2224/24101 , H01L2224/24137 , H01L2224/25171 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49175 , H01L2224/73215 , H01L2224/73265 , H01L2224/73267 , H01L2224/73277 , H01L2224/83191 , H01L2225/0651 , H01L2225/06506 , H01L2225/06562 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19105 , H01L2924/00014 , H01L2224/45099 , H01L2924/181 , H01L2924/00012 , H01L2224/73265 , H01L2224/32145 , H01L2224/48227 , H01L2924/00012 , H01L2224/73265 , H01L2224/32145 , H01L2224/48145 , H01L2924/00012 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor package includes a mold substrate, at least one first semiconductor chip in the mold substrate and including chip pads, wiring bonding pads formed at a first surface of the mold substrate and connected to the chip pads by bonding wires, and a redistribution wiring layer covering the first surface of the mold substrate and including redistribution wirings connected to the wiring bonding wirings.

2. 发明申请

US20130294778A1 Optical Connector and Stack Module Including the Same 有权
标题翻译：光连接器和堆叠模块包括它
公开(公告)号：US20130294778A1
公开(公告)日：2013-11-07
申请号：US13828165
申请日：2013-03-14
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Bo-Seong Kim , Chang-Hoon Han
IPC分类号： H04B10/40
CPC分类号： H04B10/40 , H04B10/801
摘要： An optical connector for directly transferring data is disclosed. The optical connector includes a first input device connected to a first data source and to which a first input signal is applied, a first light emitting device connected to the first input device and generating a first optical signal corresponding to the first input signal, a first light receiving device positioned close to the first light emitting device in such a configuration that the first optical signal directly reaches the first light receiving device from the first light emitting device, the first light receiving device generating a first output signal corresponding to the first optical signal, and a first output device connected to the first light receiving device and to a second data source to which the first output signal is transferred. Large-sized data may be transferred at high speed and high reliability without light transfer units.
摘要翻译：公开了一种用于直接传送数据的光连接器。光连接器包括连接到第一数据源并且被施加第一输入信号的第一输入装置，连接到第一输入装置并产生对应于第一输入信号的第一光信号的第一发光装置，第一光接收装置以第一光信号从第一发光装置直接到达第一光接收装置的方式配置在靠近第一发光装置的位置，第一光接收装置产生对应于第一光信号的第一输出信号以及连接到第一光接收装置和传送第一输出信号的第二数据源的第一输出装置。大尺寸数据可以高速和高可靠性传输，无需光传输单元。

3. 发明授权

US09246591B2 Optical connector and stack module including the same 有权
标题翻译：光连接器和堆叠模块包括它们
公开(公告)号：US09246591B2
公开(公告)日：2016-01-26
申请号：US13828165
申请日：2013-03-14
申请人： Samsung Electronics Co., Ltd.
发明人： Bo-Seong Kim , Chang-Hoon Han
IPC分类号： H04B10/00 , H04B10/40 , H04B10/80
CPC分类号： H04B10/40 , H04B10/801
摘要： An optical connector for directly transferring data is disclosed. The optical connector includes a first input device connected to a first data source and to which a first input signal is applied, a first light emitting device connected to the first input device and generating a first optical signal corresponding to the first input signal, a first light receiving device positioned close to the first light emitting device in such a configuration that the first optical signal directly reaches the first light receiving device from the first light emitting device, the first light receiving device generating a first output signal corresponding to the first optical signal, and a first output device connected to the first light receiving device and to a second data source to which the first output signal is transferred. Large-sized data may be transferred at high speed and high reliability without light transfer units.
摘要翻译：公开了一种用于直接传送数据的光连接器。光连接器包括连接到第一数据源并且被施加第一输入信号的第一输入装置，连接到第一输入装置并产生对应于第一输入信号的第一光信号的第一发光装置，第一光接收装置以第一光信号从第一发光装置直接到达第一光接收装置的方式配置在靠近第一发光装置的位置，第一光接收装置产生对应于第一光信号的第一输出信号以及连接到第一光接收装置和传送第一输出信号的第二数据源的第一输出装置。大尺寸数据可以高速和高可靠性传输，无需光传输单元。

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