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1. 发明授权

US10986740B2 Solid state drive device and data storage system including the same 有权
公开(公告)号：US10986740B2
公开(公告)日：2021-04-20
申请号：US16127878
申请日：2018-09-11
申请人： Samsung Electronics Co., Ltd.
发明人： Teck-su Oh , Ji-won Park , Sung-chul Hur
IPC分类号： H05K5/00 , G06F1/18 , H05K5/02
摘要： A solid state drive device includes a housing defining an interior space and first through fourth edges defining a perimeter thereof; and a package substrate module in the interior space. The package substrate module includes a package base substrate, a plurality of semiconductor chips mounted on the package base substrate, and an external connector corresponding to the third edge of the housing. The housing includes at least one groove adjacent to the first edge and a rail unit on each of the second and fourth edges.

2. 发明申请

US20190246508A1 SOLID STATE DRIVE DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME 审中-公开
公开(公告)号：US20190246508A1
公开(公告)日：2019-08-08
申请号：US16127878
申请日：2018-09-11
申请人： Samsung Electronics Co., Ltd.
发明人： Teck-su Oh , Ji-won Park , Sung-chul Hur
IPC分类号： H05K5/00 , H05K5/02 , G06F1/18
CPC分类号： H05K5/0026 , G06F1/182 , G06F1/187 , H05K5/0004 , H05K5/0217
摘要： A solid state drive device includes a housing defining an interior space and first through fourth edges defining a perimeter thereof; and a package substrate module in the interior space. The package substrate module includes a package base substrate, a plurality of semiconductor chips mounted on the package base substrate, and an external connector corresponding to the third edge of the housing. The housing includes at least one groove adjacent to the first edge and a rail unit on each of the second and fourth edges.

3. 发明申请

US20190215972A1 SOLID STATE DRIVE APPARATUS AND DATA STORAGE SYSTEM HAVING THE SAME 审中-公开
公开(公告)号：US20190215972A1
公开(公告)日：2019-07-11
申请号：US16045045
申请日：2018-07-25
申请人： Samsung Electronics, Co., Ltd.
发明人： Myung-ryul Jang , Teck-su Oh , Su-in Kim , Ji-yong Kim
IPC分类号： H05K5/02 , H05K7/20 , H05K5/00 , H05K1/18 , H05K1/14
CPC分类号： H05K5/0213 , G06F1/16 , G06F1/181 , G06F1/182 , G06F1/187 , G06F1/20 , H05K1/141 , H05K1/181 , H05K5/0021 , H05K5/0247 , H05K7/20172 , H05K2201/049 , H05K2201/10159 , H05K2201/10522
摘要： A solid state drive apparatus includes a housing having an inner space and a plurality of vent channels penetrating a first side wall at a first side of the housing and a connector opening penetrating a second side wall at a second side of the housing opposite the first side of the housing, and a package substrate module in the inner space and having a package base substrate and a plurality of semiconductor chips mounted on the package base substrate. Each of the plurality of vent channels extends inwardly from an outer surface of the first side wall to an inner surface of the first side wall such that a vertical level of at least a portion of each of the plurality of vent channels varies between the outer surface and the inner surface.

4. 发明授权

US09504160B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US09504160B2
公开(公告)日：2016-11-22
申请号：US14548261
申请日：2014-11-19
申请人： Samsung Electronics Co., Ltd.
发明人： Teck-su Oh , Sung-ki Lee
IPC分类号： H05K5/00 , H05K1/18 , H01R12/70 , H05K1/11 , H01R12/72
CPC分类号： H05K1/181 , H01R12/7082 , H01R12/721 , H05K1/117 , H05K2201/10159 , Y02P70/611
摘要： A semiconductor memory device is included. The semiconductor device includes a semiconductor memory device, comprising: a first substrate including a first semiconductor device mounted on the first substrate and a first connection terminal disposed at an edge of the first substrate; a second substrate including a second semiconductor device mounted on the second substrate and a second connection terminal at an edge of the second substrate; and an interface connector including a first socket portion configured to receive the first connection terminal and a second socket portion configured to receive the second connection terminal. The interface connector further includes: first socket terminals of the first socket portion are connected with the first connection terminals; second socket terminals of the second socket portion are connected with the second connection terminals; and an internal wiring for electrically connecting the first socket terminals with the second socket terminals.
摘要翻译：包括半导体存储器件。半导体器件包括：半导体存储器件，包括：第一衬底，包括安装在第一衬底上的第一半导体器件和设置在第一衬底的边缘处的第一连接端子; 第二基板，包括安装在所述第二基板上的第二半导体器件和在所述第二基板的边缘处的第二连接端子; 以及接口连接器，包括被配置为接收第一连接端子的第一插座部分和被配置为接收第二连接端子的第二插座部分。接口连接器还包括：第一插座部分的第一插座端子与第一连接端子连接; 第二插座部的第二插座端子与第二连接端子连接; 以及用于将第一插座端子与第二插座端子电连接的内部布线。

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