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1. 发明授权

US09462697B2 Electronic component embedded substrate and manufacturing method thereof 有权
标题翻译：电子元件嵌入式基板及其制造方法
公开(公告)号：US09462697B2
公开(公告)日：2016-10-04
申请号：US14092331
申请日：2013-11-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Yul Kyo Chung , Doo Hwan Lee , Seung Eun Lee , Yee Na Shin
IPC分类号： H05K1/16 , H05K1/18 , H05K3/46
CPC分类号： H05K1/186 , H01L2924/15311 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , H05K2201/10636 , Y02P70/611 , Y10T29/4913
摘要： The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one guide hole for exposing a portion of the external electrode; a second insulating layer formed on the lower surface of the first insulating layer to cover the first metal pattern; a first circuit pattern formed on a lower surface of the second insulating layer; and a first via for electrically connecting the first external electrode exposed through the guide hole and the first circuit pattern, and can improve electrical connectivity between the external electrode and the via even when the size of the external electrode of the electronic component is reduced than before.
摘要翻译：电子部件嵌入式基板技术领域本发明涉及电子部件嵌入式基板，具备：包括空腔的第一绝缘层; 插入腔内的电子部件; 形成在所述第一绝缘层的下表面上以将所述电子部件安装在其上并且包括用于暴露所述外部电极的一部分的至少一个引导孔的第一金属图案; 形成在所述第一绝缘层的下表面上以覆盖所述第一金属图案的第二绝缘层; 形成在所述第二绝缘层的下表面上的第一电路图案; 以及用于电连接通过引导孔暴露的第一外部电极和第一电路图案的第一通孔，并且即使当电子部件的外部电极的尺寸比以前更小时，也可以改善外部电极和通孔之间的电连接性。

2. 发明申请

US20150195907A1 MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：多层基板及其制造方法
公开(公告)号：US20150195907A1
公开(公告)日：2015-07-09
申请号：US14509603
申请日：2014-10-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Yul Kyo CHUNG , Seung Eun Lee , Yee Na Shin , Doo Hwan Lee
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K1/03
CPC分类号： H05K1/0271 , H01L24/19 , H01L2224/04105 , H01L2924/3511 , H05K1/185 , H05K3/381 , H05K3/4605 , H05K3/4697
摘要： A multilayered substrate includes an insulating layer or core comprised of a glass material and having a light transmittance of about 50% or less; circuit pattern layers or parts respectively formed on the surfaces of the insulating layer or core; and a build-up part covering a surface of the insulating layer or core and one of the circuit pattern layers
摘要翻译：多层基板包括由玻璃材料构成的透光率为约50％以下的绝缘层或芯，分别形成在绝缘层或芯的表面上的电路图案层或部分; 以及覆盖绝缘层或芯的表面和电路图案层之一的堆积部分

3. 发明授权

US09474167B2 Multilayered substrate 有权
标题翻译：多层基材
公开(公告)号：US09474167B2
公开(公告)日：2016-10-18
申请号：US14061160
申请日：2013-10-23
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Yee Na Shin , Seung Eun Lee , Yul Kyo Chung , Doo Hwan Lee
IPC分类号： H05K1/02 , H05K1/11 , H05K3/46 , H01L23/00 , H05K1/18
CPC分类号： H05K3/4673 , H01L24/19 , H01L2224/04105 , H01L2924/3511 , H05K1/185 , H05K3/4602 , H05K2201/0154 , H05K2201/029 , H05K2201/09136
摘要： Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring.
摘要翻译：本文公开了一种多层基板，包括：在其上表面上形成有精细图案层的第二绝缘层; 以及第三绝缘层，其具有形成在其上表面上并且由与第二绝缘层不同的材料形成的电路图案层，该电路图案层具有比精细图案层的间距大的图案间距，从而使得可以解决翘曲问题，并且在内部布线的集成度方面进行细化和改进。

4. 发明申请

US20140374870A1 IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：图像传感器模块及其制造方法
公开(公告)号：US20140374870A1
公开(公告)日：2014-12-25
申请号：US14170325
申请日：2014-01-31
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Kyung Ho Lee , Suk Jin Ham , Seung Wan Woo , Yee Na Shin
IPC分类号： H01L27/146
CPC分类号： H01L27/14618 , H01L25/041 , H01L25/105 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a second groove having a stepped shape; and an image sensor mounted in a groove of the base substrate.
摘要翻译：这里公开了图像传感器模块及其制造方法。图像传感器包括：基底，具有安装有图像传感器的凹槽，该凹槽包括第一凹槽和具有台阶形状的第二凹槽; 以及安装在基底基板的凹槽中的图像传感器。

5. 发明授权

US09788433B2 Circuit board and method of manufacturing the same 有权
公开(公告)号：US09788433B2
公开(公告)日：2017-10-10
申请号：US15074209
申请日：2016-03-18
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Doo Hwan Lee , Yul Kyo Chung , Yee Na Shin , Seung Eun Lee
IPC分类号： H05K1/18 , H05K1/03 , H05K3/00 , H05K1/02 , H05K1/11 , H05K3/46 , H01L23/00
CPC分类号： H05K3/002 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/12105 , H01L2224/24227 , H01L2224/73267 , H01L2224/92244 , H01L2924/12042 , H01L2924/15153 , H01L2924/15311 , H01L2924/15788 , H01L2924/3511 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/185 , H05K3/4605 , H05K3/4644 , H05K3/4697 , H05K2201/10015 , H05K2203/1469 , Y10T29/4913 , H01L2924/00
摘要： A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer.

6. 发明授权

US09526177B2 Printed circuit board including electronic component embedded therein and method for manufacturing the same 有权
标题翻译：包含嵌入其中的电子部件的印刷电路板及其制造方法
公开(公告)号：US09526177B2
公开(公告)日：2016-12-20
申请号：US14061047
申请日：2013-10-23
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Seung Eun Lee , Yul Kyo Chung , Yee Na Shin , Doo Hwan Lee
IPC分类号： H05K1/16 , H05K1/18 , H01L23/00 , H05K3/46 , H01L21/56
CPC分类号： H05K1/185 , H01L21/568 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2924/12042 , H01L2924/3511 , H05K3/4602 , H05K2201/09854 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49139 , H01L2924/00
摘要： Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.
摘要翻译：这里公开了包括嵌入其中的电子部件的印刷电路板及其制造方法。包括嵌入其中的电子部件的印刷电路板包括：芯，其形成有由通孔形成的空腔，并且具有形成有基于其中心部分对称地形成有顶部和底部的倾斜表面的侧壁; 嵌入腔内的电子部件; 堆叠在包括电子部件的芯的上部和下部的绝缘层; 以及形成在绝缘层上的外部电路层。

7. 发明授权

US09155199B2 Passive device embedded in substrate and substrate with passive device embedded therein 有权
标题翻译：被动设备嵌入基板和基板中，其中嵌有无源器件
公开(公告)号：US09155199B2
公开(公告)日：2015-10-06
申请号：US14041235
申请日：2013-09-30
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Yee Na Shin , Yul Kyo Chung , Seung Eun Lee
IPC分类号： H05K1/18 , H01G4/228 , H05K3/46
CPC分类号： H05K1/185 , H05K3/4682 , H05K2203/308
摘要： The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate.
摘要翻译：本发明涉及嵌入基板中的无源器件，其包括通过交替层叠多个内部电极和电介质层而形成的层压体; 覆盖所述层压体的一个侧面的第一外部电极，具有覆盖所述层叠体的上部的一部分的第一上盖区域和覆盖所述层压体的下部的一部分的第一下盖区域，以及小于第一上盖区域; 以及覆盖所述层叠体的另一侧面的第二外部电极，具有覆盖所述层叠体的下部的一部分的第二下部覆盖区域和覆盖所述层叠体的上部的一部分的第二上部覆盖区域并且小于第二下盖区域和基板。

8. 发明申请

US20150014034A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有嵌入式电子设备的印刷电路板及其制造方法
公开(公告)号：US20150014034A1
公开(公告)日：2015-01-15
申请号：US14060365
申请日：2013-10-22
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Nam Hwang , Ju Wan Nam , Seung Wan Woo , Yee Na Shin
IPC分类号： H05K1/18 , H05K3/46 , H05K3/30
CPC分类号： H05K3/4697 , H01L24/19 , H01L2224/04105 , H05K1/185 , H05K3/0032 , H05K3/4602 , H05K3/4652 , H05K2201/09827 , Y10T29/4913 , Y10T29/49146
摘要： Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
摘要翻译：这里公开了具有嵌入式电子装置的印刷电路板及其制造方法。根据本发明的优选实施例，具有嵌入式电子设备的印刷电路板包括：具有形成在其两个表面上的电路层的芯基板; 形成在芯基板上的锥形空腔; 以及嵌入腔内的电子装置。

9. 发明授权

US10887995B2 Method for manufacturing a printed circuit board including an embedded electronic component 有权
公开(公告)号：US10887995B2
公开(公告)日：2021-01-05
申请号：US15993107
申请日：2018-05-30
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Seung Eun Lee , Yee Na Shin , Yul Kyo Chung , Doo Hwan Lee
IPC分类号： H05K3/30 , H05K1/18 , H05K3/46 , H01L21/56
摘要： A printed circuit board (PCB) including an embedded electronic component is provided. The printed circuit board includes a core having a cavity, an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces, insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity, and an external circuit pattern provided on the insulating layers.

10. 发明授权

US09504169B2 Printed circuit board having embedded electronic device and method of manufacturing the same 有权
标题翻译：具有嵌入式电子装置的印刷电路板及其制造方法
公开(公告)号：US09504169B2
公开(公告)日：2016-11-22
申请号：US14060365
申请日：2013-10-22
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Nam Hwang , Ju Wan Nam , Seung Wan Woo , Yee Na Shin
IPC分类号： H05K1/18 , H05K3/00 , H05K3/46
CPC分类号： H05K3/4697 , H01L24/19 , H01L2224/04105 , H05K1/185 , H05K3/0032 , H05K3/4602 , H05K3/4652 , H05K2201/09827 , Y10T29/4913 , Y10T29/49146
摘要： Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
摘要翻译：这里公开了具有嵌入式电子装置的印刷电路板及其制造方法。根据本发明的优选实施例，具有嵌入式电子设备的印刷电路板包括：具有形成在其两个表面上的电路层的芯基板; 形成在芯基板上的锥形空腔; 以及嵌入腔内的电子装置。

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