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    • 1. 发明申请
    • SUBSTRATE OF ELECTRONIC DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MEASURING METHOD OF RESISTANCE AT CONNECTION PORTION
    • 电子设备的基板,包括其的电子设备和连接部分的电阻测量方法
    • US20140327459A1
    • 2014-11-06
    • US14013893
    • 2013-08-29
    • Samsung Display Co., Ltd.
    • Won-Gu CHO
    • G01R27/02
    • G09G3/006G01R27/02G01R27/08G01R27/14G01R31/046H01L2224/11
    • A substrate of an electronic device may include a first test region and a second test region to measure resistance at a connection portion. The first test region and the second test region each comprise a plurality of measuring pad portions, a protective layer disposed on the plurality of measuring pad portions, and a contact assistance member disposed on the protective layer. The protective layer in the first test region comprises a first contact hole exposing the plurality of measuring pad portions. The contact assistance member in the first test region contacts the measuring pad portion exposed through the first contact hole. The protective layer in the second test region comprises two second contact holes exposing one measuring pad portion, and the contact assistance member in the second test region contacts the one measuring pad portion through the two second contact holes.
    • 电子设备的基板可以包括测量连接部分的电阻的第一测试区域和第二测试区域。 第一测试区域和第二测试区域各自包括多个测量焊盘部分,设置在多个测量焊盘部分上的保护层和设置在保护层上的触头辅助构件。 第一测试区域中的保护层包括暴露多个测量垫部分的第一接触孔。 第一测试区域中的接触辅助构件接触通过第一接触孔暴露的测量垫部分。 第二测试区域中的保护层包括暴露一个测量垫部分的两个第二接触孔,并且第二测试区域中的接触辅助构件通过两个第二接触孔接触一个测量垫部分。