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1. 发明授权

US10139683B2 Method of cutting liquid crystal display panel 有权
公开(公告)号：US10139683B2
公开(公告)日：2018-11-27
申请号：US14742400
申请日：2015-06-17
申请人： Samsung Display Co., Ltd.
发明人： Min Su Kim , Jang-Hyun Kim , Tae Wook Kang , Tae Woon Cha
IPC分类号： G02F1/1339 , G02F1/1333
摘要： A mother substrate assembly according to an exemplary embodiment of the present invention includes: a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and includes a first irradiation line formed in the sealant, and a second irradiation line formed in the sealant of a side closer to the unit liquid crystal panel than the first irradiation line.

2. 发明申请

US20160155719A1 CHIP BONDING APPARATUS AND CHIP BONDING METHOD 有权
标题翻译：芯片接合装置和芯片接合方法
公开(公告)号：US20160155719A1
公开(公告)日：2016-06-02
申请号：US14706752
申请日：2015-05-07
申请人： Samsung Display Co., Ltd.
发明人： Seong Beom JEONG , Min Su Kim
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/83048 , H01L2224/83091 , H01L2224/83121 , H01L2224/83851
摘要： The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.
摘要翻译：用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。

3. 发明授权

US09977278B2 Polarizing member and display device having the same 有权
公开(公告)号：US09977278B2
公开(公告)日：2018-05-22
申请号：US14688132
申请日：2015-04-16
申请人： SAMSUNG DISPLAY CO., LTD.
发明人： Min Su Kim , Boo Kan Ki , Beong Hun Beon
IPC分类号： G02F1/1335 , G02B5/02 , G02B1/14 , G02B27/28
CPC分类号： G02F1/133502 , G02B1/14 , G02B5/0215 , G02B5/0242 , G02B5/0294 , G02B27/286 , G02F1/133504 , G02F1/133528 , G02F1/13362
摘要： A polarizing member includes a base layer, a first reflection preventing layer and a second reflection preventing layer. A base layer polarizes light, generating polarized light. A first reflection preventing layer is disposed on the base layer, diffusing the polarized light and generating first diffused light. A second reflection is disposed on the first reflection preventing layer, diffusing the first diffused light and generating second diffused light.

4. 发明授权

US09810813B2 Display device and optical film included therein 有权
公开(公告)号：US09810813B2
公开(公告)日：2017-11-07
申请号：US14860193
申请日：2015-09-21
申请人： Samsung Display Co. Ltd.
发明人： Joong Hyun Kim , Min Su Kim , Ju Youn Son , Seung Hwan Chung
IPC分类号： G02F1/1335 , G02B1/10 , G02F1/1333 , G09F9/00
CPC分类号： G02B1/10 , G02F1/133308 , G02F1/133528 , G02F2001/133331 , G09F9/00
摘要： A display device includes a display panel, an optical film arranged on an upper portion of the display panel and including first and second intaglio pattern portions having different depths from each other, a bonding member configured to contact at least a part of the display panel and a surface of the first intaglio pattern portion and an air layer configured to fill between a surface of the second intaglio pattern portion and the display panel.

5. 发明授权

US09570417B2 Chip bonding apparatus and chip bonding method 有权
标题翻译：芯片接合装置和芯片接合方法
公开(公告)号：US09570417B2
公开(公告)日：2017-02-14
申请号：US14706752
申请日：2015-05-07
申请人： Samsung Display Co., Ltd.
发明人： Seong Beom Jeong , Min Su Kim
IPC分类号： H01L21/00 , H01L23/00
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/83048 , H01L2224/83091 , H01L2224/83121 , H01L2224/83851
摘要： The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.
摘要翻译：用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。

6. 发明授权

US09423294B2 Display device and optical inputting device with retarders 有权
标题翻译：显示装置和带延迟器的光输入装置
公开(公告)号：US09423294B2
公开(公告)日：2016-08-23
申请号：US13705716
申请日：2012-12-05
申请人： Samsung Display Co., Ltd.
发明人： Kwang-Hyun Kim , Seung Beom Park , Min Su Kim , Ji-Hoon Kim , Na Young Shin
IPC分类号： G02F1/01 , H01J5/16 , G01J1/04 , F21V9/14 , G02F1/1333 , G06F3/03 , G02F1/13363
CPC分类号： G01J1/0429 , F21V9/14 , G02F1/13338 , G02F2001/133638 , G06F3/03
摘要： A display device includes an upper substrate, a lower substrate disposed opposite to the upper substrate, a photosensor disposed between the upper substrate and the lower substrate, a polarizer disposed on the upper substrate, and a retarder disposed on the polarizer, where light of elliptical polarization from outside is converted by a λ/4 phase difference, and transmitted to the photosensor sequentially through the retarder and the polarizer.
摘要翻译：显示装置包括上基板，与上基板相对设置的下基板，设置在上基板和下基板之间的光电传感器，设置在上基板上的偏振器和设置在偏振器上的延迟器，其中椭圆来自外部的极化被λ/ 4相位差转换，并通过延迟器和偏振器依次传输到光电传感器。

7. 发明授权

US11681330B2 Supporting member for display device, display device comprising the same, and method for manufacturing thereof 有权
公开(公告)号：US11681330B2
公开(公告)日：2023-06-20
申请号：US17668682
申请日：2022-02-10
申请人： Samsung Display Co., LTD.
发明人： Jin Yong Sim , Min Su Kim , Jai Ku Shin , Mun Sik Ham
IPC分类号： G06F3/041 , G06F1/16
CPC分类号： G06F1/1652 , G06F3/0412 , G06F2203/04102
摘要： The present disclosure relates to a supporting member for a display device, a display device including the same, and a manufacturing method of a supporting member for a display device. The supporting member for the display device according to an embodiment includes: a first region and a second region, and a third region positioned between the first region and the second region and made of a non-metal material. The supporting member includes a plurality of patterns positioned in the third region and adjacent to one another along a first direction and a second direction perpendicular to the first direction, where each of the plurality of patterns extends along the second direction.

8. 发明授权

US11554571B2 Decorative print member and display device including the same 有权
公开(公告)号：US11554571B2
公开(公告)日：2023-01-17
申请号：US15842634
申请日：2017-12-14
申请人： Samsung Display Co., Ltd.
发明人： Min Su Kim , Ji Young Wang
IPC分类号： B32B3/30 , B41M3/00
摘要： A decorative print member and a display device including the decorative print member are provided. The decorative print member includes a base layer, a first decorative print pattern disposed on the base layer, and a shielding layer disposed over the first decorative print pattern. The first decorative print pattern includes a first decorative print layer disposed on the base layer, and a second decorative print layer disposed on the first decorative print layer. The shielding layer covers upper and side surfaces of the second decorative print layer, and a side surface of the first decorative print layer protrudes outwardly from the side surface of the second decorative print layer and a side surface of the shielding layer.

9. 发明授权

US09796050B2 Method for manufacturing display panel and display panel manufactured by the method 有权
公开(公告)号：US09796050B2
公开(公告)日：2017-10-24
申请号：US14681492
申请日：2015-04-08
申请人： Samsung Display Co., Ltd.
发明人： Jang Hyun Kim , Min Su Kim , Tae Woon Cha
IPC分类号： B23K26/38 , B23K26/00 , B32B38/00 , G02F1/1333 , B32B37/00 , B23K101/36 , B23K103/00
CPC分类号： B23K26/38 , B23K26/0006 , B23K26/0093 , B23K26/359 , B23K2101/36 , B23K2103/54 , B23K2103/56 , B32B37/0076 , B32B38/105 , B32B2457/20 , G02F1/133351
摘要： A method for manufacturing a display panel includes providing a mother substrate that includes a display area and a non-display area, and includes a first substrate, a second substrate facing the first substrate, and a sealant provided between the first substrate and the second substrate, generating a crack on the sealant through irradiation of laser onto the sealant between the first substrate and the second substrate, and cutting a part of the second substrate and a part of the sealant at a position corresponding to the crack.

10. 发明授权

US09625753B2 Liquid crystal display and method of manufacturing the same 有权
公开(公告)号：US09625753B2
公开(公告)日：2017-04-18
申请号：US14147150
申请日：2014-01-03
申请人： Samsung Display Co., Ltd.
发明人： Yeun Tae Kim , Koichi Sugitani , Jung Wook Lee , Hoon Kang , Min Su Kim , Seon-Il Kim , Hee-Keun Lee
IPC分类号： G02F1/1333 , G02F1/1335 , G02F1/1362 , G02F1/1341
CPC分类号： G02F1/133377 , G02F1/133512 , G02F1/1341 , G02F1/136227
摘要： A liquid crystal display device includes: a substrate; a thin film transistor disposed on the substrate; a pixel electrode connected with the thin film transistor; and a roof layer disposed to face the pixel electrode, wherein a plurality of microcavities having respective liquid crystal injection holes are formed between the pixel electrode and the roof layer, and the microcavities are filled with electrically orientatable liquid crystal molecules, wherein a light blocking layer disposed adjacent to the injection holes is formed and covering the thin film transistor, wherein the light blocking layer is covered by a passivation layer.

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