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    • 1. 发明授权
    • Apparatus for removing deposited film
    • 去除沉积膜的设备
    • US6422930B2
    • 2002-07-23
    • US76465501
    • 2001-01-17
    • SPEEDFAM CO LTD
    • HAKOMORI SHUNJI
    • B24B9/00B24B9/06H01L21/304B24B21/00
    • B24B9/065
    • An edge face of a deposited film at an edge portion of a device wafer having the deposited film formed on a substrate is polished at a substantially right angle so as to prevent the deposited film from peeling-off and dusting. A forming body having a sectional shape substantially agreeing with that of an edge portion of a device wafer after polishing, which is an object to be polished, is rotated and brought into contact with a polishing body so as to form a polishing portion on the polishing body surface. The edge portion of the object-to be polished is rotated and urged into contact with the formed polishing portion, so that the edge portion of the object to be polished is polished in a sectional shape agreeing with that of the polishing portion of the polishing body. The edge face of the deposited film on the substrate surface is polished not slantingly but at a right angel so as to be removed, so that peeling-off of the deposited film due to a post-process, etc., which will generate a foreign substance, can be prevented.
    • 在具有形成在基板上的沉积膜的器件晶片的边缘部分处的沉积膜的边缘面以大致直角被抛光,以防止沉积的膜被剥离和撒粉。 具有与抛光后的装置晶片的边缘部分基本一致的成形体,该被研磨物体被旋转并与抛光体接触,从而在抛光时形成抛光部分 身体表面。 要被抛光的物体的边缘部分被旋转并被推动与形成的抛光部分接触,使得被抛光物体的边缘部分被抛光成与抛光体的抛光部分一致的截面形状 。 基板表面上的沉积膜的边缘面不是倾斜地而是在右天使被抛光以便被去除,从而由于后处理而导致的沉积膜的剥离等会产生外来的 物质,可以防止。