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1. 发明申请

US20170072594A1 FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE 有权
标题翻译：固定磨砂线，线锯和切割工件的方法
公开(公告)号：US20170072594A1
公开(公告)日：2017-03-16
申请号：US15311325
申请日：2015-03-18
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Tadahiro KATO
IPC分类号： B28D5/04 , B24D3/00 , B24B27/06 , B28D5/00
CPC分类号： B28D5/045 , B23D61/185 , B24B27/06 , B24B27/0633 , B24D3/00 , B24D3/004 , B24D11/00 , B28D5/0076 , H01L21/02005 , H01L21/304
摘要： The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.
摘要翻译：本发明是一种固定磨粒，其特征在于，包括固定在芯线表面的芯线和磨粒，其中磨粒密度为1200粒/ mm2以上，磨粒密度为芯线表面的每单位面积的磨粒和磨粒的质心之间的所有距离的2％以下等于或小于整个磨粒的平均圆当量直径。可以提供固定磨粒线，线锯，以及用于切割工件的方法，该工件可以在切割工件期间抑制固定磨粒线的弯曲，并改善从工件切片的晶片的TTV和翘曲。

2. 发明申请

US20160300708A1 CHAMFERING APPARATUS AND METHOD FOR MANUFACTURING NOTCHLESS WAFER 有权
标题翻译：切割装置和制造无凹槽的方法
公开(公告)号：US20160300708A1
公开(公告)日：2016-10-13
申请号：US15037067
申请日：2014-10-29
申请人： SHIN-ETSU HANDOTAI CO., LTD.
发明人： Tadahiro KATO
IPC分类号： H01L21/02 , B24B49/12 , H01L23/544 , B24B9/06
CPC分类号： H01L21/02021 , B24B9/065 , B24B49/02 , B24B49/04 , B24B49/12 , H01L21/02052 , H01L23/544 , H01L2223/54493
摘要： A chamfering apparatus including chamfering part for removing notch, cleaning part for cleaning and drying wafer, and chamfered-shape measuring part for measuring chamfered shape, each of chamfering and cleaning part, and chamfered-shape measuring part including rotatable stage for holding wafer and control unit for controlling rotational positions of rotatable stage and wafer, rotatable stage having reference position serving as reference of rotational positions at beginning of rotation, wherein wafer is held wherein rotational position of wafer at beginning of rotation relative to reference position is at same rotational position on all rotatable stages, and control unit to control rotational position of wafer to be at predetermined position at beginning and end of rotation. As a result, the chamfering apparatus and method for manufacturing notchless wafer allowing appropriate feedback control even in notchless wafer, suppress variation in chamfered shape dimension, and achieve desired cross-sectional shape precision of wafer chamfered portion.
摘要翻译：包括用于去除切口的倒角部分，用于清洁和干燥晶片的清洁部分的倒角装置以及倒角形状的倒角形状测量部分，每个倒角和清洁部分，以及包括用于保持晶片和控制的旋转台的倒角形状测量部分用于控制可旋转台和晶片的旋转位置的单元，具有参考位置的旋转台，其作为旋转开始时的旋转位置的参考，其中保持晶片，其中晶片在相对于基准位置的旋转开始处的旋转位置处于相同的旋转位置所有可旋转台，以及控制单元，用于在旋转开始和结束时将晶片的旋转位置控制在预定位置。结果，即使在无切槽晶片中也能够进行适当的反馈控制的倒角装置及其制造方法，可以抑制倒角形状尺寸的变化，并达到晶圆倒角部所需的截面形状精度。

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