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1. 发明申请

US20220290019A1 CURABLE FLUOROPOLYETHER ADHESIVE COMPOSITION AND OPTICAL PARTS 有权
公开(公告)号：US20220290019A1
公开(公告)日：2022-09-15
申请号：US17636471
申请日：2020-08-04
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/00 , C08G65/00 , C09J183/04 , C09J11/04 , C09J11/06 , C09J11/08 , C08K3/16
摘要： This curable fluoropolyether adhesive composition contains specific amounts of (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule, and having a perfluoropolyether structure in the main chain thereof, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluoro oxyalkyl group, a perfluoro alkylene group, or perfluoro oxyalkylene group, and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom. (C) sodium fluoride. (D) a platinum-group metal catalyst, and (E) an organopolysiloxane having, per molecule, a SiH group, a perfluoroalkyl group or a perfluoro oxyalkyl group, and an epoxy group and/or a trialkoxysilyl group. A cured product of the composition has good light transmission properties and good adhesion properties, and excellent rubber strength.

2. 发明申请

US20180371300A1 HEAT-CURABLE FLUOROPOLYETHER-BASED ADHESIVE COMPOSITION AND ELECTRIC/ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20180371300A1
公开(公告)日：2018-12-27
申请号：US15967669
申请日：2018-05-01
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/02 , C09J5/06 , C08G65/00 , C08J3/24
摘要： Provided are a heat-curable fluoropolyether-based adhesive composition capable of being cured and adhering to various kinds of base materials made of, for example, a metal, ceramic and/or plastic in a short period of time; and an electric/electronic component employing the same. The composition is a heat-curable fluoropolyether-based adhesive composition having, as an adhesion imparting agent, an alicyclic epoxy group-containing and fluorine-containing organohydrogensiloxane having in one molecule: a monovalent perfluoroalkyl or perfluorooxyalkyl group(s), or a divalent perfluoroalkylene or perfluorooxyalkylene group(s); and at least one silicon atom-bonded hydrogen atom (SiH group).

3. 发明申请

US20130320392A1 CURABLE COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR APPARATUS USING THE SAME 有权
标题翻译：用于封装光学半导体的固化组合物和使用其的光学半导体装置
公开(公告)号：US20130320392A1
公开(公告)日：2013-12-05
申请号：US13894849
申请日：2013-05-15
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hidenori KOSHIKAWA , Mikio SHIONO
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , C08G65/007 , C08G65/336 , C08G77/12 , C08G77/20 , C08G77/24 , C08L71/02 , C08L83/04 , C09J183/04 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3. The present invention provides a curable composition for encapsulating an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and an optical semiconductor apparatus in which an optical semiconductor device is encapsulated by a cured product obtained by curing the curable composition for encapsulating an optical semiconductor.
摘要翻译：用于封装光学半导体的可固化组合物包括直链多氟化合物，具有SiH基和含氟有机基团的环状有机硅氧烷和/或具有SiH基和含氟有机基团的有机氢硅氧烷，铂族金属催化剂，具有SiH基的环状有机硅氧烷，含氟有机基团和环氧基，以及具有一价不饱和烃基和含氟有机基团的环状有机聚硅氧烷和获得的固化物的硬度通过由HS K6253-3调节的A型硬度计固化为30至80。本发明提供了一种用于封装光学半导体的可固化组合物，其提供了耐冲击性和粘合性优异的固化产物，以及光学半导体装置，其中光学半导体装置被通过固化固化组合物而被固化，光学半导体。

4. 发明申请

US20230112091A1 CURABLE FLUOROPOLYETHER ADHESIVE COMPOSITION AND OPTICAL PART 有权
公开(公告)号：US20230112091A1
公开(公告)日：2023-04-13
申请号：US17802439
申请日：2021-02-15
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hidenori KOSHIKAWA
IPC分类号： C09J171/02 , C09J183/08 , C08G65/22 , C08G77/12 , C08G77/24 , C08G77/08 , C08G77/14 , C08K5/54
摘要： A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom, (C) a platinum-group metal catalyst, and (D) a cyclic organopolysiloxane having, per molecule, an SiH group and an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group optionally containing an oxygen atom, and not having fluorine in molecule, and a cured product of which having a thickness of 2 mm shows a transmittance to light with a wavelength of 500 nm of 80% or higher. This curable fluoropolyether adhesive composition is capable of providing a cured product having good light transmittance and high adhesiveness to glass materials.

5. 发明申请

US20210403709A1 CURABLE FLUOROPOLYETHER-BASED RUBBER COMPOSITION AND OPTICAL COMPONENT 有权
公开(公告)号：US20210403709A1
公开(公告)日：2021-12-30
申请号：US17293421
申请日：2019-10-24
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hidenori KOSHIKAWA
IPC分类号： C08L71/00
摘要： Provided are: a curable fluoropolyether-based rubber composition from which a cured product having good light transmissivity and excellent rubber strength is produced; and an optical component having a cured product layer of said composition.
The curable fluoropolyether-based rubber composition contains: (A) a linear polyfluoro compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in a main chain; (B) a fluorine-containing organohydrogen siloxane which has at least two hydrogen atoms directly bonded to a silicon atom (SiH group) and has a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group or a divalent perfluoroalkylene group or a divalent perfluorooxyalkylene group in one molecule; (C) sodium fluoride; and (D) a platinum group metal-based catalyst in an amount of 0.1-2,000 ppm in terms of the mass of a platinum group metal atom with respect to component (A).

6. 发明申请

US20170121583A1 HEAT-CONDUCTIVE FLUORINATED CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ELECTRIC/ELECTRONIC PART 有权
公开(公告)号：US20170121583A1
公开(公告)日：2017-05-04
申请号：US15332476
申请日：2016-10-24
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Hidenori KOSHIKAWA , Akihiro ENDO
IPC分类号： C09K5/14 , C08G77/08 , C08G77/00 , C08K7/18 , C08K3/22
CPC分类号： C09K5/08 , C08K3/22 , C08K7/18 , C08K2003/2227 , C08K2201/001 , C08K2201/005 , C08L71/00 , C08L83/04 , C09C3/12 , C09K5/14
摘要： A heat-conductive fluorinated curable composition is provided comprising (A) an alkenyl-containing linear polyfluoro compound, (B) a fluorinated organohydrogensiloxane having a fluorinated organic group and SiH groups, (C) a platinum catalyst, (D) a heat-conductive filler, and (E) a fluorinated organosilicon compound having a fluorinated organic group and an alkoxy group. The composition allows for heavy loading of the heat-conductive filler and cures into a cured product having improved oil resistance and thermal conductivity.

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