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    • 2. 发明授权
    • Method for manufacturing light-shielding mask for curing cell sealant
    • 用于固化细胞密封剂的遮光掩模的制造方法
    • US09256130B2
    • 2016-02-09
    • US14235392
    • 2013-10-18
    • Shenzhen China Star Optoelectronics Technology Co., Ltd.
    • Chaode MoChunliang Lee
    • G03F1/38G03F7/16G03F7/20G03F7/26G03F1/44G03F1/42G02F1/1339G03F1/00G02F1/13
    • G03F7/16G02F1/1303G02F1/1339G02F2202/28G03F1/00G03F1/38G03F1/42G03F1/44G03F7/20G03F7/26
    • The present invention provides a method for manufacturing a light-shielding mask for curing a sealant, including the following steps: step 1: providing a transparent substrate (20); step 2: sequentially forming a metal layer (22) and a photoresist layer (24) on the transparent substrate (20); Step 3: carrying out exposure on an edge of the photoresist layer (24) to form an inspection mark (242); step 4: subjecting the photoresist layer (24) to exposure along a predetermined trace by adopting an edge exposure process, wherein the predetermined trace corresponds to a predetermined trace of a sealant to be formed in a liquid crystal display panel; step 5: removing the exposed portion of the photoresist layer (24) to expose the metal layer (22); step 6: subjecting the exposed portion of the metal layer (22) to etching and removing the unexposed portion of the photoresist layer (24); and step 7: forming a transparent protection layer (26) on the metal layer (22) and the transparent substrate (20). The present invention uses an edge exposure process to achieve exposure of the photoresist layer so that no specific masking plate is needed and the number of masking plates prepared can be effectively reduced, thereby reducing the cost the material for manufacture.
    • 本发明提供一种制造用于固化密封剂的遮光掩模的方法,包括以下步骤:步骤1:提供透明基材(20); 步骤2:在透明基板(20)上依次形成金属层(22)和光刻胶层(24); 步骤3:在光致抗蚀剂层(24)的边缘上进行曝光以形成检查标记(242); 步骤4:通过采用边缘曝光处理使光致抗蚀剂层(24)沿着预定迹线曝光,其中预定迹线对应于要在液晶显示面板中形成的密封剂的预定迹线; 步骤5:去除光致抗蚀剂层(24)的暴露部分以暴露金属层(22); 步骤6:对金属层(22)的暴露部分进行蚀刻和去除光致抗蚀剂层(24)的未曝光部分; 和步骤7:在金属层(22)和透明基板(20)上形成透明保护层(26)。 本发明使用边缘曝光工艺来实现光致抗蚀剂层的曝光,使得不需要特定的掩模板,并且可以有效地减少制备的掩模板的数量,从而降低制造材料的成本。